Flip Chip Bonder MD-P300
MD-P300
A flip-chip bonder for high-speed, high-quality placement of bare ICs for cutting-edge devices
The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.
The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head.
The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.
The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.
Features and benefits of the Panasonic's MD-P300 Flip-chip Bonder
Easy process exchange
Bonding processes are available by switching the bonding tools, which can be performed by the customer by configuring the C4 dipping unit.
Real-time inspection
The bonding stage camera enables post-bonding inspection immediately after die bonding. This system enables manufacturing with real-time quality inspection.
User-friendly operation
A large touch panel and interactive software realize an easy and reliable operating environment for all users from beginners to experts.
- Process versatility
- Ideal for processors, CMOS, MEMS and power devices
- Fast and accurate
Key features of MD-P300 Flip-chip Bonder
Key features
| The basic structure comprises fixed-point pickup and placement that supports supply of wafers up to ⌀300 mm |
| Process change is possible by switching the bonding tool(Compatible with GGI/C4/TCB) |
| High-precision placement of ± 5 um is achieved using the placement nozzle where the chip backside recognition result obtained by a flip camera is feed-forwarded to handling |
| For productivity, high-speed placement of 5,500 CPH (production output per hour) is achieved |
Specifications of MD-P300 Flip-chip Bonder
Specifications table
| Model Number | NM-EFF1C |
|---|---|
| Placement Accuracy | XY ( 3σ at Panasonic conditions ) : ±5 μm*1 |
| Substrate dimensions | L 50 mm × W 50 mm to L 330 mm × W 330 mm ( Heating specifications : L 330 mm × W 220 mm ) |
| Die dimensions (mm) | L 1 mm × W 1 mm to L 25 mm × W 25 mm ( Thermosonic : L 7 mm × W 7 mm） |
| Die Supply | Wafer frame 12 inches ( Option : 8 inches ) |
| Bonding Load | VCM head : 1 N to 50 N ( Option : 2 N to 100 N ) |
Related resources
Sorry there was an error...
The files you selected could not be downloaded as they do not exist.
You selected items.
Continue to select additional items or download selected items together as a zip file.
You selected 1 item.
Continue to select additional items or download the selected item directly.
Share page
Share this link via:
Twitter
LinkedIn
Xing
Facebook
Or copy link: