Placement
NPM-W2
The NPM-W2 combines accurate component placement, precise SPI and AOI inspection and reproductive adhesive dispensing in one high-speed solution.
Higher productivity and quality thanks to the integration of printing, placement and inspection processes make the NPM-W2 one of the most flexible and versatile pick-and-place solutions on the market.
This machine provides the user with a tool that allows him to choose between high speed or high accuracy, depending on the PCB requirements.
In addition, the NPM-W2 is optimised for larger boards and larger components, such as PCBs up to 750 x 550 mm and components up to 150 x 25 x 30 mm (L,W,H). For high productivity, dual lanes can be used.
Features
The multifunctional NPM-W2 is equipped with a 16-nozzle head and can place 42,000 components. 120 feeders can be mounted.
Additionally, the NPM-W2 can automatically inspect solder depots and components according to the production data.
As a third function, the NPM can be fitted with the conventional HDF discharge mechanism, which ensures high-quality non-contact dispensing with a screw valve-dispenser.
Key features of NPM-W2
Key features
| Higher productivity and quality with printing, placement and inspection process integration |
| Versatility for large PCBs and components |
| 5M* process control “APC-5M” for good production and stable operation * 5M: The variable elements of a production site: huMan, Machine, Material, Method, and Measurement |
| Various skill-less and manpower-saving features including Auto Setting Feeder |
Specifications of NPM-W2
Specifications table
| PCB dimensions (mm) | Single conveyor Batch mounting：L 50 mm × W50 mm ～ L 750 mm × W 550 mm 2-positin mounting：L 50 mm × W50 mm ～ L 350 mm × W 550 mm Dual conveyor Dual transfer ( Batch ):L 50 mm × W50 mm ～ L 750 mm × W 260 mm Dual transfer ( 2-positin ):L 50 mm × W50 mm ～ L 350 mm × W 260 mm Single transfer ( Batch ):L 50 mm × W50 mm ～ L 750 mm × W 510 mm Single transfer ( 2-positin ):L 50 mm × W50 mm ～ L 350 mm × W 510 mm |
|---|---|
| Placement Head max Speed | 42 000 cph ( 0.086 s / chip ) 35 000 cph ( 0.103 s / chip ) |
| Placement Head Placement Accuracy (Cpk≧1) | ±40 μm / chip ±30 μm / chip |
Accessories & Software
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