Microelectronics Solutions

Delivering the latest systems for: plasma dicing and dry etching of wafers; plasma cleaning of wafers and substrates; and high-quality ultrasonic flip-chip bonding of bare ICs.

With decades of experience - including as a manufacturer ourselves - we are continually improving our technologies and developing new solutions. We provide a line-up of cutting-edge microelectronics equipment to help our customers reduce production costs and increase quality.

About Microelectronics

Panasonic is one of the world's leading companies in the area of the Smart Factory. Our combined power of being both a manufacturer and an equipment provider is highly unique and has enabled us to deliver proven technology. In the Microelectronics area we offer first-class equipment, process solutions, materials, and software for high-precision wafer processing, ultra-high precision device bonding, and high-quality liquid crystal panel bonding. Additonally, we are offering Plasma Dicing as a service.

Our Product Line Up

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Where to find us

Panasonic Connect Europe GmbH
Factory Solutions Europe
Microelectronics

Caroline-Herschel-Straße 100
85521 Ottobrunn
Germany

+ 49 89 45354-1000
microelectronics.sales@eu.panasonic.com