Full specifications
| Dimensions (mm) | [Load lock wafer Handling] W 1350 x D 2230 x H 2000 (Exclude touch panel, operation section and signal tower) [Load lock wafer Handling] W 1375 x D 2600 x H 2000 (Exclude touch panel, operation section and signal tower) |
|---|---|
| Plasma source | ICP Plasma |
| Model-No. (Model Name) | NM-EFE3AA-S |
| Process gas | Standard 4 lines (Maximum 6 Lines: Chlorinated Gas, Fluoride Gas, Ar, O2, He, etc.) |
| Wafer size | Ø100mm / 150mm wafer with orientation flat Ø200mm wafer with notch *Please consult, if different size of wafer will be required. |
| Mass (Weight) | 2000kg (Differs depending on machine configuration) |
| Power Source | 3-phase AC 200 / 208 / 220 / 230 / 240 ±10 V, 50 / 60Hz, 21.00kVA *3-phase electricity has two kinds of lineage. Figure shows total. |
| Pneumatic Source | 0.5MPa to 0.7MPa, 250L/min (A.N.R.) |
| N2 Source | 0.1MPa to 0.2MPa, 50L/min (A.N.R.) |
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