Full specifications
| Dimensions (mm) | [Load lock wafer Handling] W 1350 x D 2230 x H 2000 (Exclude touch panel, operation section and signal tower) [Load lock wafer Handling] W 1375 x D 2600 x H 2000 (Exclude touch panel, operation section and signal tower) W 1350 × D 2230 × H 2000 mm (Single chamber system (Optional transfer unit attachment type) *The transfer unit (optional) is of the vacuum load lock supply type using dedicated cassettes. |
|---|---|
| Plasma source | ICP Plasma |
| Process gas | 4 Line (standard) (Maximum 6 lines : Fluoride Gas, Ar, O2, He, etc.) |
| Wafer size | φ200 mm (standard), or φ300 mm (with ring frame) * For other wafer sizes, please contact us. |
| Mass (Weight) | 2 330 kg (differs depending on machine configuration) |
| Power Source | 3-phase AC 200 / 208 / 220 / 230 / 240 ±10 V, 50 / 60 Hz, 21.0 kVA * 2-line 3-phase power source, and this shows the total. Peripheral devices, such as dry pump and chiller, are not included. |
| Pneumatic Source | 0.5 MPa ～ 0.7 MPa, 250 L/min (A.N.R.) |
| N2 Source | 0.1 MPa ～ 0.2 MPa, 50 L/min (A.N.R.) |
| Model Number | NM-EFE4AA-D |
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