MD-P200 Die Bonder

Full specifications

Model Number	NM-EFD1B
Productivity	0.56s/IC (Under the fastest conditions) 0.75s/IC for thermosonic bonding(Including process time of 0.2 seconds. Under the fastest conditions)
Placement Accuracy	XY (3σ at PFSC conditions): ±7µm (Flip bonding), ±15µm (With pre-centering), ±25µm (Direct bonding)
Substrate dimensions	L 50 x W 30 to L 280 x W 140 (For thermosonic: L 200mm x W 150mm)
Die dimensions (mm)	L 0.25 x W 0.25 to L 6 x W 6
Number of die types	Up to 12 types (For AWC)/ Up to 10 types (Tray with the palette changer)/ Up to 5 types (Wafer frame with the palette changer)
Configuration of die feeder	Wafer frame, Pre-expanded ring, Tray
Adhesive dispenser	Air-powered writing, Stamping pin
Bonding Load	Pneumatic head: 0.5N to 10N (Option: 1N to 50N) VCM head for thermosonic process: 1N to 50N (Option: 2N to 100N)
Head Heating	Constant heating, Up to 250°C for the pneumatic head, Up to 300°C for the VCM head
Substrate Heating	Constant heating, Up to 300°C
Number of nozzles	Up to 24 nozzles (Pickup nozzle, Bonding nozzle, Stamping tool) (Not available for the thermosonic nozzle)
Power Source	3-phase AC 200V ±10V, 50 / 60Hz, Up to 4kVA (Up to 7kVA for heating specification)
Pneumatic Source	0.5MPa, 30L/min (A.N.R.) (Up to 150L/min for full-featured machine including cooling air)
Dimensions (mm)	Standard specification (Up to 200mm substrate length. including loader/unloader) W 1950mm x D 1370mm x H 1720mm (Machine body: W 1190 mm x D 1190mm x H 1720mm)
Mass (Weight)	2200kg (including loader / unloader)