Full specifications
Model Number | NM-EFP3A |
---|---|
Cleaning Method | Parallel plate RF back-sputtering method |
Gas for electrical discharge | Ar [Option:O2, O2 + He] |
Substrate dimensions | L 50mm × W 200mm to L 350mm × W 350mm |
Substrate thickness (mm) | 0.1mm to 2.0mm |
Power Source | 1-phase AC 200 / 208 / 220 / 230 / 240 ± 10V, 50 / 60Hz , 6.00kVA |
Adhesive dispenser | 0.49MPa、25 L/min [A.N.R] |
Dimensions (mm) | W 900mm × D 1150mm × H 1650mm |
Mass (Weight) | (Excluding touch panel, operating part, and signal tower / 630kg) |
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