NPM-W2

Full specifications

PCB dimensions (mm)	Single-lane Batch mounting 2-positin mounting Dual-lane Dual transfer (Batch) Dual transfer (2-position) Single transfer (Batch) Single transfer (2-position
Placement Head max Speed	38 500cph (0.094 s/ chip)
Placement Head Placement Accuracy (Cpk≧1)	±40 μm / chip
Placement Head Component Dimensions (mm)	0402 chip ~ L 6 x W 6 x T 3
Dispensing Head	Dispensing speed: Dot dispensing: 0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation) Draw dispensing: 4.25 s/component (Condition : 30 mm x 30 mm corner dispensing)*9 Adhesive position accuracy (Cpk≥1) Dot Dispensing: ± 75 μ m /dot Draw Dispensing: ± 100 μ m /component Applicable components Dot Dispensing: 1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP Draw Dispensing: BGA, CSP
Resolution	2D inspection head (A) 18 µm
View Size (mm)	44.4 x 37.2
Inspection Processing Time	Solder Inspection 0.35s/ View size Component Inspection 0.5s/ View size
Inspection Object	Solder Inspection Chip component: 100 μm × 150 μm or more (0603 or more) Package component: φ150 μm or more Component Inspection: Square chip (0603 or more), SOP, QFP (a pitch of 0.4mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector
Inspection Items	Solder Inspection: Oozing, blur, misalignment, abnormal shape, bridging Component Inspection: Missing, shift, flipping, polarity, foreign object inspection
Inspection Position Accuracy	± 20 μm
No of Inspection	Solder Inspection : Max. 30 000 pcs./machine (No. of components :Max. 10 000 pcs./machine) Component Inspection: Max. 10 000 pcs./machine
Component Supply Taping	Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm Max.120 (Tape: 4, 8 mm)