Features and benefits of Panasonic's MD-P200 Die Bonder
The MD-P200 Die Bonder offers the capability of multiple small die stacking which contributes to the downsizing of valuable devices. A variety of epoxy-supplying methods contributes to flexible production. Flip-chip and thermosonic bonding capabilities contribute to higher density and performance for valuable devices.
Unit Level Manufacturing by the synchro-motion of dispensing and bonding
The MD-P200's die bonding is carried out immediately after epoxy dispensing, thereby making it possible to finish the bonding operation before the epoxy has deteriorated. This realizes stable and high quality bonding at all bond positions on a substrate. In addition, the bonding stage camera enables pre-bonding inspection immediately after epoxy dispensing and post-bonding control immediately after the bonding of a die. This process enables manufacturing with real-time quality inspection.
A large touch panel and interactive software realize an easy and reliable operating environment for all users from beginners to experts.
|Ultrasonic flip-chip device bonding
|High quality bonding process
|Easy and reliable operating environment
|Manufacturing with real-time quality inspection.
|0.56s/IC (Under the fastest conditions) 0.75s/IC for thermosonic bonding(Including process time of 0.2 seconds. Under the fastest conditions)
|XY (3σ at PFSC conditions): ±7µm (Flip bonding), ±15µm (With pre-centering), ±25µm (Direct bonding)
|L 50 x W 30 to L 280 x W 140 (For thermosonic: L 200mm x W 150mm)
|Die dimensions (mm)
|L 0.25 x W 0.25 to L 6 x W 6
|Number of die types
|Up to 12 types (For AWC)/ Up to 10 types (Tray with the palette changer)/ Up to 5 types (Wafer frame with the palette changer)
|Configuration of die feeder
|Wafer frame, Pre-expanded ring, Tray
|Air-powered writing, Stamping pin