Higher productivity and quality thanks to the integration of printing, placement and inspection processes make the NPM-W2 one of the most flexible and versatile pick-and-place solutions on the market.
This machine provides the user with a tool that allows him to choose between high speed or high accuracy, depending on the PCB requirements.
In addition, the NPM-W2 is optimised for larger boards and larger components, such as PCBs up to 750 x 550 mm and components up to 150 x 25 x 30 mm (L,W,H). For high productivity, dual lanes can be used.
The multifunctional NPM-W2 is equipped with a 12-nozzle head and can place 38,500 components. 120 feeders can be mounted.
Additionally, the NPM-W2 can automatically inspect solder depots and components according to the production data.
As a third function, the NPM can be fitted with the conventional HDF discharge mechanism, which ensures high-quality non-contact dispensing with a screw valve-dispenser.
This platform is also available as a single-beam solution:
- NPM-W2S single beam allows various operations ranging, from NPM-series backup to multiple connection configuration.
|Equipped with a 12-nozzle head and can place 38,500 components|
|Automatical inspection of solder depots and components according to the production data|
|HDF discharge mechanism compatible, which ensures high-quality non-contact dispensing with a screw valve-dispenser|
|Also available as a single-beam solution|
|PCB dimensions (mm)||Single-lane Batch mounting 2-positin mounting Dual-lane Dual transfer (Batch) Dual transfer (2-position) Single transfer (Batch) Single transfer (2-position|
|Placement Head max Speed||38 500cph (0.094 s/ chip)|
|Placement Head Placement Accuracy (Cpk≧1)||±40 μm / chip|
|Placement Head Component Dimensions (mm)||0402 chip ~ L 6 x W 6 x T 3|
|Taping||Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm Max.120 (Tape: 4, 8 mm)|
|Dispensing Head||Dispensing speed: Dot dispensing: 0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation) Draw dispensing: 4.25 s/component (Condition : 30 mm x 30 mm corner dispensing)*9 Adhesive position accuracy (Cpk≥1) Dot Dispensing: ± 75 μ m /dot Draw Dispensing: ± 100 μ m /component Applicable components Dot Dispensing: 1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP Draw Dispensing: BGA, CSP|
|Resolution||2D inspection head (A) 18 µm|
|View Size (mm)||44.4 x 37.2|