Products

The next-generation PT-REQ12 1-Chip DLP™ 4K Laser Projector is designed to streamline productions and expand the endless possibilities of entertainment by delivering exceptional, highly engaging immersive experiences with up to 12,000lm brightness, 4K resolution, and 240 Hz projection capability.

4,000-lm-class SOLID SHINE Laser Projectors Revitalize Communication with WUXGA Images

Redefining Immersive Experiences with Rec. 2020 Color, 20,000 lm Brightness, and Detailed 4K Resolution

World’s Smallest, Lightest, and Quietest 20,000 lm* Projector with WUXGA Resolution and LCD Technology.

The next-generation PT-REZ15 1-Chip DLP™ 4K Laser Projector is designed to streamline productions and expand the endless possibilities of entertainment by delivering exceptional, highly engaging immersive experiences with up to 15,000lm brightness, 4K resolution, and 240 Hz projection capability.

7,000 lm LCD laser projector - Reduce Shadows,Enhance Flexibility with Eco-Friendly Short-Throw Projection

Remote cameras enhance visual communication in a variety of applications ranging from online classes to online seminars. The AW-UE50/UE40 supports a compact design to blend in with the surroundings and operates very quietly to permit flexible use in any video shooting locations or conditions. The AW-UE50/UE40 offers high security and it is easy to install and operate for capturing stable images, so even people unfamiliar with video shooting or camera operation can utilize it. The excellent flexibility of the product simplifies wiring and operation. Linkage with online conference software or online application is possible, so online video streaming is easy to initiate. The AW-UE50/UE40 is a standard model perfect for people who want to utilize online video streaming more frequently or enhance the quality of online video streaming.

Next-generation Remote Camera Controller Revolutionizes Operator Workflows The AW-RP200GJ, building on its predecessor’s (AW-RP150GJ) highly regarded operability, introduces powerful new features such as convenient macro functionality for executing complex camera operations with ease, and dual left and right joysticks for flexible control. Such innovations enhance the controller’s performance for multi-camera productions, including in large-scale shooting environments, to elevate video content value.

PanaCIM-EE Gen2 is the next generation of smart factory MES solution and connects digital and physical work, reporting and management areas.

Panasonic's Adaptive Process Control (APC) system realizes high-quality placement through excellent feed-forward and feed-back communication technology.

Unit Level Manufacturing by the synchro-motion of dispensing and bondingThe MD-P200's die bonding is carried out immediately after epoxy dispensing, thereby making it possible to finish the bonding operation before the epoxy has deteriorated. This realizes stable and high quality bonding at all bond positions on a substrate. In addition, the bonding stage camera enables pre-bonding inspection immediately after epoxy dispensing and post-bonding control immediately after the bonding of a die. This process enables manufacturing with real-time quality inspection.User-friendly operationA large touch panel and interactive software realize an easy and reliable operating environment for all users from beginners to experts.

The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.