Products

With the help of AC Servo Motors the functionality of positioners can be increased and furthermore additional applications are possible. A flexible solution from Panasonic! The AC-Servo Motors are free programmable and help improve synchronism with robots, enables smoother movement, and enhances productivity.

Visualization by IoT enables improved productivityand quality and enhanced traceability.

 GuidanceEnforcementKey Values Increase operator's efficiencyGet the assembly more reliableImprove product quality by higher yield    TraceabilityMaterial ManagementFeaturesCentral storage of work flows and instructionsSharing and accumulate knowledge & know-howAvoid errors and increase motivationCost saving by reducing error factor  Connection to MES and/or ERP systemProvide "just-in-time" required materials automaticallyManual assembly included in the reporting loopCost saving by more efficient production  and material planning

Typical use-cases for PGMA to guide & enhance are: Manual THT insertionManual mechanical assemblySemiautomatic screw & nut mounting with and without torque controlManual visual inspectionSemiautomatic testing and/or measurementManual product packing and labelling incl. weight control (optional)Training for any manual assembly & activityThe ROI (return of invest) period for PGMA implementation is typically much less than one year due to reduction of failures and mistakes, speeding up the assembly process and finally increase of user‘s motivation.

The PSX307 Plasma Cleaner provides 1.5 times the productivity of conventional plasma cleaners. Panasonic's parallel plate plasma chamber technology delivers superior etch uniformity compared to conventional batch-type plasma cleaner systems.By using an argon plasma treatment, ultra-thin gold-plated electrodes can be wire-bonded reliably without the formation of nickel compounds. The savings achieved in cheaper gold plating can provide the ROI justification alone. The PSX307 Plasma Cleaner's other capabilities include surface modification by oxygen plasma, improving mold resin adhesion and under-fill wettability, and reducing the incidence of peel-off, voids, and cracks.Panasonic's Plasma Monitoring System suppresses abnormal discharges for a secure and efficient production process. The option to include traceability functionality ensures high level process quality as well.

Building upon the PSX307 Plasma Cleaner, the PSX307A Plasma Cleaner features an enlarged plasma chamber capacity that improves productivity. In addition, the PSX307A system is able to handle full wafers (both bare and on dicing frames).  Besides the increased capacity, Panasonic's original Plasma Monitoring System suppresses abnormal discharges resulting in a secure and efficient production process.  Additionally, the option to include a traceability functionality  ensures high level process Quality.

The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.

Unit Level Manufacturing by the synchro-motion of dispensing and bondingThe MD-P200's die bonding is carried out immediately after epoxy dispensing, thereby making it possible to finish the bonding operation before the epoxy has deteriorated. This realizes stable and high quality bonding at all bond positions on a substrate. In addition, the bonding stage camera enables pre-bonding inspection immediately after epoxy dispensing and post-bonding control immediately after the bonding of a die. This process enables manufacturing with real-time quality inspection.User-friendly operationA large touch panel and interactive software realize an easy and reliable operating environment for all users from beginners to experts.

The Panasonic UA3P profilometer series is designed to measure aspherical lenses & molds, freeform optics, mirrors and any other precision component requiring nanometer level accuracy ranging up to 200mm x 200mm. Different machine models are available to meet your optical & high aspect ratio metrology needs.

The UA3P-300, UA3P-4 and UA3P-5 all offer users the accuracy of AFM technology with the measurement range of a CMM. Our unique approach uses atomic force probe technology in the stylus and HeNe laser-based interferometric XYZ axis positioning.

Couple this technology with a solid granite-base and you have a robust metrology system that can be used on the factory floor and still deliver 0.1um level total uncertainty.