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FeaturesThe line management system NPM-DGS provides various features, like the Multi-CAD import, tact simulations, a component library of all pick and place machines, displaying of placement and inspection head data on the display during operation, production data optimization and an optional off-line component data creation to make the work preparation as easy as possible, by guaranteeing an improved and more efficient placement process. NPM-DGS offers to create off-line component data and improves productivity and the data generation workflow. A parts library for the entire shop floor can be centrally managed. With simulations the total operating rate of the production line can be checked. With the MJS-function the feeder replacement can be reduced. The PPD/LWS Editor helps to quickly and easily edit the production data. Multi-CAD importMost CAD data formats can be imported through macro definitions. A polarity check in performed in advance. Optional off-line component data creationDGS works with any flatbed scannerand offers the ability  to create off-line component data or with the NPM off-line camera unit to improve productivity and  quality of the data generation workflow Component library A parts library for all placement equipment in the entire shop floor can be centrally managed, even including data from the CM series. SimulationCheck the tact simulation in advance on the screen and improve the total operating rate of the line. Mix Job Setter (MJS)A common feeder arrangement is advantageous when manufacturing multiple different products, since the reduction in feeder replacement time increases productivity. PPD/LWS EditorReduce loss times by quickly and easily editing the production data of the placement and inspection heads on the PC screen during production.

The fully automated printing solution is part of the "Autonomous Factory" Concept - a factory that immediately responds to every situation and continues to evolve autonomously. Ensuring the production of non-defective items through the integrated control of autonomous uninterrupted mounting lines and floors independent of any human intervention and judgment.

Features:Increased Production Time:  (1) Reduces machine availability losses through automation of operations required for model changeover.(2) Reduces machine performance losses through automation of operations involved in production.(3) Increases production time by monitoring machine conditions and thereby performing maintenanceat right times.

Maintenance of printing quality at a consistently high level: Reduces losses due to defective items through various functions that actualizes consistently high-qualityprinting capable of responding to any changes in 5M.

Support for line solution: Realizes high-quality line production through M2M

FeaturesThe Manufacturing Operations Optimiser (MFO) is a newly developed product for drawing up production plans required  for on-site  operations  to  reduce the man-hours needed for the production  plan  and,  at  the same time, to enhance production efficiency. MFO creates detailed schedules for productions and pre-set-up operations and calculates the required resources for production by simulating the manufacturing process  of  the  entire  SMT production floor.  By simulating the planned  production, the  MFO  answers questions about estimated  production  completion, indicates which  production  sequence is to  be  used for higher efficiency, proposes optimal machine set-up for higher efficiency, and indicates the number of staff needed to  achieve  the  plan.  MFO  models  the  required  production  line, taking  into  account errors that can occur at the production machines, such as parts exchange. It optimises production taking into  account multiple  production  lines.  The  off-line  set-up  sequence  can  be  optimised  to  adjust  the requirement  of  staff  and  material. MFO  support  is  not  limited  to  machines  of the NPM-series  but also  supports  CMand  DT-series  machines  and  screen  printers. It also supports non-Panasonic equipment such as SPI, AOI, reflow ovens, screen printers and others.

Panasonic manufacturing operations optimizer (MFO) is the line management system to create detailed production schedules including pre-set-up operations. Those production plans are mandatory to optimize manufacturing processes and thus improves cycle times and production efficiency. It also calculates the number of operators required by simulating the entire SMT manufacturing operation.  Image of the systemMFO provides clear and easy to understand plans for production, process set-up and operator management plus simulation reports.

Beside this, it provides various optimization function, like mounting process, production plan, production-set-up plan and operator count, including a table of function list and machines.  

The AM100 meets the high standards of reliability, capacity and flexibility that customers look forward to in a cost-efficient, gradationally scalable, high-mix SMT solution. It only takes one machine to start off production and extra units and/or technologies can be easily integrated according to requirements. The single-head (single beam) of Panasonic's AM100 modular placement machine is able to place an impressive component array including: 0402 mm to 120 x 90 x 2 8mm, odd-shaped components, large connectors, as well as advanced packaging types e.g.Features The single solution AM100 provides high net productivity and versatility. Equipped with a 14-nozzle head and 160 feeders the AM100 can place an impressive component range. On top the non-stop changeover allows you to prepare the next product process during running production. An off-line setup support station and a feeder set-up navigator option improves operating time and minimizes the downtime.

Automation / Labor-saving Solution + Intelligent system solution to achieve manufacturing that is further in line with production plan

The NPM-DX provides a greater line throughput, better quality and lower production cost featuring an autonomous line control, which guaranties a stable operation based on automatic functionality. This functionality in combination with the machine set up offers a labor-saving production with improved utilization. In combination with the Panasonic software environment and embedded into an Industry 4.0 philosophy, the user can expect a modern shop floor management system including various remote operation options, feeder setup navigation, component supply navigation etc. In total, the NPM-DX reduces downtimes and increase the line throughput. With 92 400 cph and a feeder capacity for up to 136 reels, the NPM-DX is the ideal solution to meet the expectation of an evolving electronics assembly industry. The NPM-DX can process PCB sizes of up to 510 x 590 mm and place large connectors (up to 150 x 25mm) and other components (up to 120 x 90mm). This and other features make the NPM-DX the best solution for high volume-mix manufacturing.

The PSX307 Plasma Cleaner provides 1.5 times the productivity of conventional plasma cleaners. Panasonic's parallel plate plasma chamber technology delivers superior etch uniformity compared to conventional batch-type plasma cleaner systems.By using an argon plasma treatment, ultra-thin gold-plated electrodes can be wire-bonded reliably without the formation of nickel compounds. The savings achieved in cheaper gold plating can provide the ROI justification alone. The PSX307 Plasma Cleaner's other capabilities include surface modification by oxygen plasma, improving mold resin adhesion and under-fill wettability, and reducing the incidence of peel-off, voids, and cracks.Panasonic's Plasma Monitoring System suppresses abnormal discharges for a secure and efficient production process. The option to include traceability functionality ensures high level process quality as well.

Building upon the PSX307 Plasma Cleaner, the PSX307A Plasma Cleaner features an enlarged plasma chamber capacity that improves productivity. In addition, the PSX307A system is able to handle full wafers (both bare and on dicing frames).  Besides the increased capacity, Panasonic's original Plasma Monitoring System suppresses abnormal discharges resulting in a secure and efficient production process.  Additionally, the option to include a traceability functionality  ensures high level process Quality.

Mounting feed-forward function Components can be placed correctly based on the solder printing position. Placement skip data feed-forward/Block recognition data feed-forward Placement machine recognition time reduction based on feed-forward discrepancy data. Misplacement of components using a modular placement machine can be prevented based on feed-forward solder/land* printing defect block data.*When inspecting lands on which package components are placed using flux epoxy. Printing position data feedback The solder printing position misalignment is measured by the inspection machine. The positioning correction is transferred by means of feedback to the screen printer. The solder printing area is measured by the inspection equipment. The stencil cleaning direction can be compared with the reference value by means of feedback.

The APX300 (option S) Dry Etcher is the perfect dry etching equipment for silicon and compound semiconductors. It incorporates a multi-wafer direct cooling system for optimal control of wafer temperature, as well as MSC-ICP (Multi-Spiral Coil type ICP) and BM-ICP (Beamed-type ICP) plasma sources to generate high density plasma. In this way, it achieves a uniform etching profile in a very short timeframe. Building upon the single wafer process chamber of the previous model (Panasonic E620), combined with enhanced process options and two different handling systems, the APX300 (option S) is extremely fast and covers a wide range of process demands.

Features and benefits of Panasonic's APX300 (option S) Dry Etcher  The Panasonic APX300 (option S) Dry Etcher can process wafers such as power devices, SAW filters, communication devices, MEMS sensors and many more. The APX300 (option S) is the successor to the previous best-selling Panasonic E620 and utilizes the same single wafer process chamber.  Two plasma sources are available: MSC-ICP (Multi-Spiral Coil type ICP) and BM-ICP (Beamed-type ICP). MSC-ICP is Panasonic's latest technology, developed to realize highly accurate processing. BM-ICP offers higher electron density and achieves faster processing, covering a wide range of process demands.  In addition, two types of handling systems are available: Atmospheric Loading Supply and Vacuum Load Lock Supply.  The Panasonic APX300 (option S) Dry Etcher is CE certified.

FeaturesThe revolutionary integrated  line  management  system  is  the basis for  controlling the  entire  production line. It  is  not limited  to  Panasonic machines but  also  integrates  third-party  equipment such as PCB transfer systems, laser markers, AOI, SPI and ovens. Conventional systems require a number of PCs to control different machine types from different suppliers. The iLNB controls the entire line with only one PC.  iLNB  significantly improves overall  productivity.  Production  data  and  production  changeover  of  all equipment, such as Panasonic’s placement machines as well as non-Panasonic machines including AOI, SPI, reflow  ovens  and  others,  can  be  controlled.  All  collected  data  are  transferred  to  a remote central computer. Small  errors such  as pick-up  errors  can  be recovered from  that  central  point.  Automatic production changeover is also possible. With the iLNB, users can manage automatic product changeovers and have an E-Link which provides an interface for information input and output, for machine control, management of components per feeder, and communication with a GEM/PLC. iLNB provides total control of the production line by interfacing between Panasonic and non-Panasonic machines, acting as one-stop channel. With the iLNB Users can manage automatic product changeovers and have an E-Link which provides an interface for information in- and output, for machine control, management of component per feeder and a communication to GEM/PLC. Automatic changeover Registration of automatic changeover recipeLine automatic changeoverAutomatic changeover monitoringLine operation monitoringE-Link interface for Information inputDownload / edit of scheduleE-Link interface for Information outputOperational information outputTrace information outputMachine status outputE-Link interface for machine controlMachine interlock; production start controlE-Link interface for feeder writeWriting of component data by an external systemCommunications to GEM/PLCSECS2/GEM communicationOPC communicationIO/RS-232C communication

The RL132 combines functionality and speed with an insertion rate up to 25,700cph (.14s/component), a board processing sizes up to 650 x 381mm, a 33% reduction in PCB transfer time, up to 18% reduction in electrical and air consumption per insertion and an improved parts lifespan for a very low cost of ownership. This through-hole machine features a 4-pitch span and is configurable with 40 or 80 components inputs. Meanwhile, its dual split carriage enables machine function at exchange mode and parts replenishment during production. The RL132 was designed for a non-stop productivity. The Lead V cut method enables the RL132 to insert radial lead components at a speed of 0.14s/component. Either a 2-pitch (2.5mm/5.0mm), 3-pitch (2.5mm/5.0mm/7.5mm) or 4-pitch (2.5mm/5.0mm/7.5mm/10.0mm) option can be selected. The fixed feeder unit method and an out-of-component detection function allow ongoing component replenishment and long-term runs. PCB of 650mm x 381mm can be processed.