Products

Les vidéoprojectors DLP™ à 1 puce évolués transforment votre expérience avec un flux de travail fluide et fluide.

Le vidéoprojector de 20 000 lm* le plus petit, le plus léger et le plus silencieux au monde avec résolution WUXGA et technologie LCD.

Les projecteurs laser SOLID SHINE de classe 4 000 lm revitalisent la communication avec les images WUXGA

Vidéoprojecteur laser LCD de 7 000 lm - Moins d'ombres, plus de flexibilité grâce à une projection courte distance respectueuse de l'environnement

Une nouvelle référence en projection 4K : Rec.2020, 20 000 lm et une précision d’image exceptionnelle

Le vidéoprojecteur laser 4K PT-REZ15 monoDLP™ est conçu pour simplifier la production audiovisuelle et ouvrir de nouvelles possibilités dans le divertissement, notamment pour la réalisation d'expériences immersives exceptionnelles, avec une luminosité allant jusqu’à 15 000 lm, une résolution 4K et la capacité de projeter à 240 Hz.

Les caméras PTZ améliorent la communication vidéo pour de nombreuses applications allant des cours en ligne aux séminaires en ligne. Le design compact des AW-UE50/UE40 se fond dans l’environnement, le moteur Direct Drive fonctionne très silencieusement et permet une utilisation dans tous les lieux ou conditions de tournage vidéo. Les AW-UE50/UE40 offrent une haute sécurité, sont faciles à installer et à utiliser pour capturer des images stables, elles ont été conçues de sorte que chacun puisse l’utiliser.  L’excellente connectivité du produit simplifie le câblage et le fonctionnement. La liaison avec un logiciel de visioconférence ou une application en ligne est possible, le streaming vidéo est facile à initier.  AW-UE50/UE40 : un modèle standard parfait pour les personnes qui souhaitent streamer en ligne plus régulièrement ou améliorer la qualité de leur streaming.

Next-generation Remote Camera Controller Revolutionizes Operator Workflows The AW-RP200GJ, building on its predecessor’s (AW-RP150GJ) highly regarded operability, introduces powerful new features such as convenient macro functionality for executing complex camera operations with ease, and dual left and right joysticks for flexible control. Such innovations enhance the controller’s performance for multi-camera productions, including in large-scale shooting environments, to elevate video content value.

Featuressmart-factory-solutions software panacim-logo-02PanaCIM-EE Gen2 is the next generation of PanaCIM-EE, which allows for more efficient electronics manufacturing. This digital planning tool is necessary to enable reliable data management. This applies not only to individual systems, but to entire production lines, in which the data of each individual machine is included in the analysis. In addition, data from reports and management are included in the planning. This allows higher production rates and shorter cycle times to be achieved to make electronics production even more efficient and reliable. The PanaCIM-EE Gen2 is the next generation of a smart factory solution, connecting the shop floor with overall the management system. This includes precise inventory management, maximized factory performance based on a continuous production, total traceability, real time monitoring and optimization and an accurate in-time material supply. Material verificationMaterial controlTraceabilityProduction monitoring/dispatchProduction analysisMaintenanceEnterprise link

The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.

FeaturesThe Manufacturing Operations Optimiser (MFO) is a newly developed product for drawing up production plans required  for on-site  operations  to  reduce the man-hours needed for the production  plan  and,  at  the same time, to enhance production efficiency. MFO creates detailed schedules for productions and pre-set-up operations and calculates the required resources for production by simulating the manufacturing process  of  the  entire  SMT production floor.  By simulating the planned  production, the  MFO  answers questions about estimated  production  completion, indicates which  production  sequence is to  be  used for higher efficiency, proposes optimal machine set-up for higher efficiency, and indicates the number of staff needed to  achieve  the  plan.  MFO  models  the  required  production  line, taking  into  account errors that can occur at the production machines, such as parts exchange. It optimises production taking into  account multiple  production  lines.  The  off-line  set-up  sequence  can  be  optimised  to  adjust  the requirement  of  staff  and  material. MFO  support  is  not  limited  to  machines  of the NPM-series  but also  supports  CMand  DT-series  machines  and  screen  printers. It also supports non-Panasonic equipment such as SPI, AOI, reflow ovens, screen printers and others.

Panasonic manufacturing operations optimizer (MFO) is the line management system to create detailed production schedules including pre-set-up operations. Those production plans are mandatory to optimize manufacturing processes and thus improves cycle times and production efficiency. It also calculates the number of operators required by simulating the entire SMT manufacturing operation.  Image of the systemMFO provides clear and easy to understand plans for production, process set-up and operator management plus simulation reports.

Beside this, it provides various optimization function, like mounting process, production plan, production-set-up plan and operator count, including a table of function list and machines.  

Unit Level Manufacturing by the synchro-motion of dispensing and bondingThe MD-P200's die bonding is carried out immediately after epoxy dispensing, thereby making it possible to finish the bonding operation before the epoxy has deteriorated. This realizes stable and high quality bonding at all bond positions on a substrate. In addition, the bonding stage camera enables pre-bonding inspection immediately after epoxy dispensing and post-bonding control immediately after the bonding of a die. This process enables manufacturing with real-time quality inspection.User-friendly operationA large touch panel and interactive software realize an easy and reliable operating environment for all users from beginners to experts.