Products
Software
Manufacturing operations optimizer (MFO)
FeaturesThe Manufacturing Operations Optimiser (MFO) is a newly developed product for drawing up production plans required for on-site operations to reduce the man-hours needed for the production plan and, at the same time, to enhance production efficiency. MFO creates detailed schedules for productions and pre-set-up operations and calculates the required resources for production by simulating the manufacturing process of the entire SMT production floor. By simulating the planned production, the MFO answers questions about estimated production completion, indicates which production sequence is to be used for higher efficiency, proposes optimal machine set-up for higher efficiency, and indicates the number of staff needed to achieve the plan. MFO models the required production line, taking into account errors that can occur at the production machines, such as parts exchange. It optimises production taking into account multiple production lines. The off-line set-up sequence can be optimised to adjust the requirement of staff and material. MFO support is not limited to machines of the NPM-series but also supports CMand DT-series machines and screen printers. It also supports non-Panasonic equipment such as SPI, AOI, reflow ovens, screen printers and others.
Panasonic manufacturing operations optimizer (MFO) is the line management system to create detailed production schedules including pre-set-up operations. Those production plans are mandatory to optimize manufacturing processes and thus improves cycle times and production efficiency. It also calculates the number of operators required by simulating the entire SMT manufacturing operation. Image of the systemMFO provides clear and easy to understand plans for production, process set-up and operator management plus simulation reports.
Beside this, it provides various optimization function, like mounting process, production plan, production-set-up plan and operator count, including a table of function list and machines.
Printing (SMT)
NPM-GP/L
The fully automated printing solution is part of the "Autonomous Factory" Concept - a factory that immediately responds to every situation and continues to evolve autonomously. Ensuring the production of non-defective items through the integrated control of autonomous uninterrupted mounting lines and floors independent of any human intervention and judgment.
Microelectronics
MD-P200 Die Bonder
Unit Level Manufacturing by the synchro-motion of dispensing and bondingThe MD-P200's die bonding is carried out immediately after epoxy dispensing, thereby making it possible to finish the bonding operation before the epoxy has deteriorated. This realizes stable and high quality bonding at all bond positions on a substrate. In addition, the bonding stage camera enables pre-bonding inspection immediately after epoxy dispensing and post-bonding control immediately after the bonding of a die. This process enables manufacturing with real-time quality inspection.User-friendly operationA large touch panel and interactive software realize an easy and reliable operating environment for all users from beginners to experts.
Software
iLNB: line management system
FeaturesThe revolutionary integrated line management system is the basis for controlling the entire production line. It is not limited to Panasonic machines but also integrates third-party equipment such as PCB transfer systems, laser markers, AOI, SPI and ovens. Conventional systems require a number of PCs to control different machine types from different suppliers. The iLNB controls the entire line with only one PC. iLNB significantly improves overall productivity. Production data and production changeover of all equipment, such as Panasonic’s placement machines as well as non-Panasonic machines including AOI, SPI, reflow ovens and others, can be controlled. All collected data are transferred to a remote central computer. Small errors such as pick-up errors can be recovered from that central point. Automatic production changeover is also possible. With the iLNB, users can manage automatic product changeovers and have an E-Link which provides an interface for information input and output, for machine control, management of components per feeder, and communication with a GEM/PLC. iLNB provides total control of the production line by interfacing between Panasonic and non-Panasonic machines, acting as one-stop channel. With the iLNB Users can manage automatic product changeovers and have an E-Link which provides an interface for information in- and output, for machine control, management of component per feeder and a communication to GEM/PLC. Automatic changeover Registration of automatic changeover recipeLine automatic changeoverAutomatic changeover monitoringLine operation monitoringE-Link interface for Information inputDownload / edit of scheduleE-Link interface for Information outputOperational information outputTrace information outputMachine status outputE-Link interface for machine controlMachine interlock; production start controlE-Link interface for feeder writeWriting of component data by an external systemCommunications to GEM/PLCSECS2/GEM communicationOPC communicationIO/RS-232C communication
Microelectronics
APX300 Dry Etcher
The APX300 (option S) Dry Etcher is the perfect dry etching equipment for silicon and compound semiconductors. It incorporates a multi-wafer direct cooling system for optimal control of wafer temperature, as well as MSC-ICP (Multi-Spiral Coil type ICP) and BM-ICP (Beamed-type ICP) plasma sources to generate high density plasma. In this way, it achieves a uniform etching profile in a very short timeframe. Building upon the single wafer process chamber of the previous model (Panasonic E620), combined with enhanced process options and two different handling systems, the APX300 (option S) is extremely fast and covers a wide range of process demands.
Features and benefits of Panasonic's APX300 (option S) Dry Etcher The Panasonic APX300 (option S) Dry Etcher can process wafers such as power devices, SAW filters, communication devices, MEMS sensors and many more. The APX300 (option S) is the successor to the previous best-selling Panasonic E620 and utilizes the same single wafer process chamber. Two plasma sources are available: MSC-ICP (Multi-Spiral Coil type ICP) and BM-ICP (Beamed-type ICP). MSC-ICP is Panasonic's latest technology, developed to realize highly accurate processing. BM-ICP offers higher electron density and achieves faster processing, covering a wide range of process demands. In addition, two types of handling systems are available: Atmospheric Loading Supply and Vacuum Load Lock Supply. The Panasonic APX300 (option S) Dry Etcher is CE certified.
Microelectronics
PSX307 Plasma Cleaner
The PSX307 Plasma Cleaner provides 1.5 times the productivity of conventional plasma cleaners. Panasonic's parallel plate plasma chamber technology delivers superior etch uniformity compared to conventional batch-type plasma cleaner systems.By using an argon plasma treatment, ultra-thin gold-plated electrodes can be wire-bonded reliably without the formation of nickel compounds. The savings achieved in cheaper gold plating can provide the ROI justification alone. The PSX307 Plasma Cleaner's other capabilities include surface modification by oxygen plasma, improving mold resin adhesion and under-fill wettability, and reducing the incidence of peel-off, voids, and cracks.Panasonic's Plasma Monitoring System suppresses abnormal discharges for a secure and efficient production process. The option to include traceability functionality ensures high level process quality as well.
Microelectronics
PSX307A Plasma Cleaner
Building upon the PSX307 Plasma Cleaner, the PSX307A Plasma Cleaner features an enlarged plasma chamber capacity that improves productivity. In addition, the PSX307A system is able to handle full wafers (both bare and on dicing frames). Besides the increased capacity, Panasonic's original Plasma Monitoring System suppresses abnormal discharges resulting in a secure and efficient production process. Additionally, the option to include a traceability functionality ensures high level process Quality.
Software
Adaptive Process Control
Mounting feed-forward function Components can be placed correctly based on the solder printing position. Placement skip data feed-forward/Block recognition data feed-forward Placement machine recognition time reduction based on feed-forward discrepancy data. Misplacement of components using a modular placement machine can be prevented based on feed-forward solder/land* printing defect block data.*When inspecting lands on which package components are placed using flux epoxy. Printing position data feedback The solder printing position misalignment is measured by the inspection machine. The positioning correction is transferred by means of feedback to the screen printer. The solder printing area is measured by the inspection equipment. The stencil cleaning direction can be compared with the reference value by means of feedback.
Ultrahigh accurate 3-D profilometer (UA3P)
Ultrahigh accurate 3-D profilometer (UA3P)
The Panasonic UA3P profilometer series is designed to measure aspherical lenses & molds, freeform optics, mirrors and any other precision component requiring nanometer level accuracy ranging up to 200mm x 200mm. Different machine models are available to meet your optical & high aspect ratio metrology needs.
The UA3P-300, UA3P-4 and UA3P-5 all offer users the accuracy of AFM technology with the measurement range of a CMM. Our unique approach uses atomic force probe technology in the stylus and HeNe laser-based interferometric XYZ axis positioning.
Couple this technology with a solid granite-base and you have a robust metrology system that can be used on the factory floor and still deliver 0.1um level total uncertainty.
Insertion (THT/PTH)
AV132
Supplied with a 40 or 80 component feeder with optional jumper wire, the compact supply unit configuration of the AV132 can fit both ammo pack and reel. The dual partition configuration enables a fast changeover. The next job can be set up while the current one is being processed.Capable of inserting components in four directions: 0°, 90°, 180°, and 270°, the AV132 optimizes productivity by simultaneously handling 26 and 52mm taped components and providing fast, full auto-recovery. The AV132 can reduce loading times by running two PCBs simultaneously, enabling efficient production due to a speed of 0.12s/component and a transfer speed of 2s/PCB.The fixed feeder unit and the out-of-component detection feature allow to replenish components while maintaining long-term non-stop runs.Preparation in advance or equipment operation during component change-over is possible.
Placement (SMT)
NPM-GW
The NPM-GW SMT mounter combines flexibility, versatility, and precision.
Placement (SMT)
Offline Camera Unit
Reduce offline data creation time and realization of machine downtime zero
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