Products

A device bonder for high-speed, high-quality bonding of bare ICs for cutting-edge devices

Contribute to manpower reduction and stable production by automating the manual insertion process

A flip-chip bonder for high-speed, high-quality placement of bare ICs for cutting-edge devices

High speed axial lead component insertion machine for high productivity with High speed insertion of 0.12 s / component , sequential component supply system and vertical automated feeder

A dry etching system specializing in the processing of chemical compounds and non-volatile materials

High density radial lead component insertion machine for high quality and high production with our company's unique insertion method

High speed radial lead component insertion machine for for high efficiency and high quality production with high-speed insertion of 0.14s/ component

Smooth and Detailed 4K*1 Images from the Smallest, Lightest LCD Projector in Its Class*2

Smooth and Detailed 4K*1 Images from the Smallest, Lightest LCD Projector in Its Class*2

Smooth and Detailed 4K*1 Images from the Smallest, Lightest LCD Projector in Its Class*2

14" VOLLROBUSTES WINDOWS 11 PRO NOTEBOOK MIT FULL-HD-TOUCHSCREEN

Bedienfreundliche, einfache 1-Chip DLP™-Laserprojektoren für scharfe Bilder in hellen Räumen mit flexibler Integration in Unterrichtsräume oder Büros