Products

THE INFOCASE MOBILITY BUNDLE WITH DELUXE SHOULDER STRAP (PCPE-INFG2B1) PROVIDES CARRYING SOLUTIONS FOR THE TOUGHBOOK G2 TABLET

THE SHOULDER STRAP (FZ-VNSG21U) IS COMPATIBLE FOR ALL TOUGHBOOK G2 MODELS

The Standard Vehicle Dock (PCPE-GJG1V09) is designed for compatibility with TOUGHBOOK G2.

THE INFOCASE HOLSTER (PCPE-INFBPK1) IS DESIGNED FOR COMPATIBILITY WITH TOUGHBOOK 40, 33, 55, G2, A3, N1, S1

The 10.1" Display Protection (FZ-VPF38U) is designed for compatibility with TOUGHBOOK G2.

The Car charger (LIND) with bare wire input cable (CF-LND8024BW) is designed to be compatible with TOUGHBOOK G2 (via vehicle dock), A3, F1, N1.

The Tablet Vehicle Dock, no electronics (PCPE-PMTG203) is designed for compatibility with TOUGHBOOK G2.

The Car charger (CF-LND1224A) is designed to be compatible with ALL TOUGHBOOK devices.

DLP™ imaging technology, Quartet Colour Harmonizer, Rich Colour Enhancer, and digitally modulated Dynamic Contrast 2 optimization coalesce in images of surpassing brightness, colour, and clarity regardless of ambient light levels.Powered 0.8:1 short-throw lens for rear projection joins DIGITAL LINK and CEC-ready HDMI® terminals supporting 4K/60p input signals2. Separate LAN terminal and USB-DC outlet further streamline installation. Operation is almost inaudible at 27 dB3.Heat-pipe cooling for the laser modules and heat-sinks for airtight DMD block support filterless design for 20,000 hours of maintenance-free projection. Multi-Laser Drive Engine has failover circuit protection while optional Early Warning software reinforces reliability.

Immersive for all : Compact and Light 1DLP 4K Projectors

The APX300 (option S) Dry Etcher is the perfect dry etching equipment for silicon and compound semiconductors. It incorporates a multi-wafer direct cooling system for optimal control of wafer temperature, as well as MSC-ICP (Multi-Spiral Coil type ICP) and BM-ICP (Beamed-type ICP) plasma sources to generate high density plasma. In this way, it achieves a uniform etching profile in a very short timeframe. Building upon the single wafer process chamber of the previous model (Panasonic E620), combined with enhanced process options and two different handling systems, the APX300 (option S) is extremely fast and covers a wide range of process demands.

Features and benefits of Panasonic's APX300 (option S) Dry Etcher  The Panasonic APX300 (option S) Dry Etcher can process wafers such as power devices, SAW filters, communication devices, MEMS sensors and many more. The APX300 (option S) is the successor to the previous best-selling Panasonic E620 and utilizes the same single wafer process chamber.  Two plasma sources are available: MSC-ICP (Multi-Spiral Coil type ICP) and BM-ICP (Beamed-type ICP). MSC-ICP is Panasonic's latest technology, developed to realize highly accurate processing. BM-ICP offers higher electron density and achieves faster processing, covering a wide range of process demands.  In addition, two types of handling systems are available: Atmospheric Loading Supply and Vacuum Load Lock Supply.  The Panasonic APX300 (option S) Dry Etcher is CE certified.

DLP™ imaging technology, Quartet Color Harmonizer, Rich Color Enhancer, and digitally modulated Dynamic Contrast 2 optimization coalesce in images of surpassing brightness, color, and clarity regardless of ambient light levels. Flexible 2.0x zoom lens with V/H Lens-Shift joins DIGITAL LINK and CEC-ready HDMI® terminals supporting 4K/60p input signals*2. Separate LAN terminal and USB-DC outlet further streamline installation.