Products

55-inch LED display capable of providing large-screen displays tailored to the space when used with multiple units

Next-generation Remote Camera Controller Revolutionizes Operator Workflows The AW-RP200GJ, building on its predecessor’s (AW-RP150GJ) highly regarded operability, introduces powerful new features such as convenient macro functionality for executing complex camera operations with ease, and dual left and right joysticks for flexible control. Such innovations enhance the controller’s performance for multi-camera productions, including in large-scale shooting environments, to elevate video content value.

ET-MDNFB10

When it comes to PTZ configuration, we have created an Easy IP Setup tool to make the process that much more straightforward. It allows you to see and change the IP of the cameras manually, as well as providing both camera control and reset options.

Software platform to manage media smartly and expand your creativity. Integration of software realize effective operation. Easy to add various extensive function on one software platform.

D-Sub/S-VIDEO conversion cable

DVI-D input signal board

The ET-WML100 is a compact, wireless module for use with Panasonic projectors.

THE CONTACTLESS SMART CARD READER (FZ-VNF401BU) IS DESIGNED FOR COMPATIBILITY WITH TOUGHBOOK 40

The next-generation PT-REQ10 1-Chip DLP™ 4K Laser Projector is designed to streamline productions and expand the endless possibilities of entertainment by delivering exceptional, highly engaging immersive experiences with up to 10,000lm brightness, 4K resolution, and 240 Hz projection capability.

Unit Level Manufacturing by the Synchro-motion of Dispensing and Bonding MD-P200's die bonding is carried out immediately after Epoxy dispensing , thereby making it possible to finish the bonding operation before the Epoxy is deteriorated over time.This realizes stable and high quality bonding at all bond positions on a substrate.Also, the Bonding Stage Camera enables pre-bonding inspection right after Epoxy dispensing and post-bonding inspection right after the bonding of a die ( Option ). This system allows you to realize manufacturing with real-time quality-inspection. The large-sized touch panel and the interactive software realize an easy and reliable operating environment for all users from beginners to experts.

The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.