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Microelectronics

PSX307 Plasma Cleaner

The PSX307 Plasma Cleaner provides 1.5 times the productivity of conventional plasma cleaners. Panasonic's parallel plate plasma chamber technology delivers superior etch uniformity compared to conventional batch-type plasma cleaner systems.By using an argon plasma treatment, ultra-thin gold-plated electrodes can be wire-bonded reliably without the formation of nickel compounds. The savings achieved in cheaper gold plating can provide the ROI justification alone. The PSX307 Plasma Cleaner's other capabilities include surface modification by oxygen plasma, improving mold resin adhesion and under-fill wettability, and reducing the incidence of peel-off, voids, and cracks.Panasonic's Plasma Monitoring System suppresses abnormal discharges for a secure and efficient production process. The option to include traceability functionality ensures high level process quality as well.

Microelectronics

PSX307A Plasma Cleaner

Building upon the PSX307 Plasma Cleaner, the PSX307A Plasma Cleaner features an enlarged plasma chamber capacity that improves productivity. In addition, the PSX307A system is able to handle full wafers (both bare and on dicing frames).  Besides the increased capacity, Panasonic's original Plasma Monitoring System suppresses abnormal discharges resulting in a secure and efficient production process.  Additionally, the option to include a traceability functionality  ensures high level process Quality.

Microelectronics

MD-P300 Flip-chip Bonder

The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.

Microelectronics

MD-P200 Die Bonder

Unit Level Manufacturing by the synchro-motion of dispensing and bondingThe MD-P200's die bonding is carried out immediately after epoxy dispensing, thereby making it possible to finish the bonding operation before the epoxy has deteriorated. This realizes stable and high quality bonding at all bond positions on a substrate. In addition, the bonding stage camera enables pre-bonding inspection immediately after epoxy dispensing and post-bonding control immediately after the bonding of a die. This process enables manufacturing with real-time quality inspection.User-friendly operationA large touch panel and interactive software realize an easy and reliable operating environment for all users from beginners to experts.

Ultrahigh accurate 3-D profilometer (UA3P)

Ultrahigh accurate 3-D profilometer (UA3P)

Designed to measure aspherical lenses & molds, freeform optics, mirrors and any other precision component requiring nanometer level accuracy.

4K product line-up

AW-UE160

4K PTZ Camera for an era of enhanced creativity and the pursuit of visual expression.

Studio Camera Accessories

AK-UCX100

The new AK-UCX100 4K studio camera is fully equipped to meet the demands of live production in the IP era, including studio work, sports broadcasting and stage productions.

Interface board/conversion cable

TY-SB01FB

The 12G-SDI Optical Function Board (TY-SB01FB) is compatible to be used with the PT-RQ7 Series projectors.

Interface board/conversion cable

TY-SB01DL

This DIGITAL LINK Terminal Board is compatible to be used with models; PT-REQ15, PT-REZ15, PT-REQ12, PT-REQ10, PT-REQ80.

Interface board/conversion cable

TY-SB01QS

This terminal board is supported only when the main software version of the display is 2.30 or later and the sub software version of the display is 02.20 or later. Please contact your sales representative with regard to details.

TOUGHBOOK 33

TOUGHBOOK 33 mk4 Detachable

WINDOWS 11 PRO FULLY RUGGED DETACHABLE WITH 12" OUTDOOR FULL-HD DISPLAY

Planned for launch in the first quarter of 2026

Control panels, CCU and Converter

AW-RP200GJ

Next-generation Remote Camera Controller Revolutionizes Operator Workflows The AW-RP200GJ, building on its predecessor’s (AW-RP150GJ) highly regarded operability, introduces powerful new features such as convenient macro functionality for executing complex camera operations with ease, and dual left and right joysticks for flexible control. Such innovations enhance the controller’s performance for multi-camera productions, including in large-scale shooting environments, to elevate video content value.

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