Products

The RL132 combines functionality and speed with an insertion rate up to 25,700cph (.14s/component), a board processing sizes up to 650 x 381mm, a 33% reduction in PCB transfer time, up to 18% reduction in electrical and air consumption per insertion and an improved parts lifespan for a very low cost of ownership. This through-hole machine features a 4-pitch span and is configurable with 40 or 80 components inputs. Meanwhile, its dual split carriage enables machine function at exchange mode and parts replenishment during production. The RL132 was designed for a non-stop productivity. The Lead V cut method enables the RL132 to insert radial lead components at a speed of 0.14s/component. Either a 2-pitch (2.5mm/5.0mm), 3-pitch (2.5mm/5.0mm/7.5mm) or 4-pitch (2.5mm/5.0mm/7.5mm/10.0mm) option can be selected. The fixed feeder unit method and an out-of-component detection function allow ongoing component replenishment and long-term runs. PCB of 650mm x 381mm can be processed.

Plasma dicing is becoming increasingly attractive in the semiconductor market. Dies are becoming smaller and thinner and manufacturers are facing difficulties such as increasing material loss due to the width of the dicing line, mechanical damage to the dies from chipping and increasingly longer processing times due to line-by-line mechanical dicing. Panasonic’s APX300 Plasma Dicer solves these challenges and simultaneously provides a higher quality product with a lower cost of production. Features and benefits of Panasonic's APX300 Plasma DicerPlasma dicing requires a dicing street mask. After the mask is applied to the surface of the wafer and the dicing streets are exposed, the plasma process etches the exposed streets by a chemical reaction. By using a chemical etching process, a chipping-free and particle-free process is achieved. Thanks to the use of mask patterning, narrower street widths are possible – allowing more chips to be designed onto the wafer. Furthermore, the mask patterning allows complete flexibility in chip size, shape and position. The benefits of the Panasonic APX300 Plasma Dicer are: Particle-free and damage-free processHigher chip strengthYield improvementsThe Panasonic APX300 is available in a stand-alone single chamber (1 chamber) or a multi chamber (1, 2, or 3 chambers) configuration.  Panasonic can provide a plasma dicing total solution to achieve a damage-free, particle-free, higher throughput and lower overall cost of production. The Panasonic APX300 is CE certified. 

FeaturesThe line management system NPM-DGS provides various features, like the Multi-CAD import, tact simulations, a component library of all pick and place machines, displaying of placement and inspection head data on the display during operation, production data optimization and an optional off-line component data creation to make the work preparation as easy as possible, by guaranteeing an improved and more efficient placement process. NPM-DGS offers to create off-line component data and improves productivity and the data generation workflow. A parts library for the entire shop floor can be centrally managed. With simulations the total operating rate of the production line can be checked. With the MJS-function the feeder replacement can be reduced. The PPD/LWS Editor helps to quickly and easily edit the production data. Multi-CAD importMost CAD data formats can be imported through macro definitions. A polarity check in performed in advance. Optional off-line component data creationDGS works with any flatbed scannerand offers the ability  to create off-line component data or with the NPM off-line camera unit to improve productivity and  quality of the data generation workflow Component library A parts library for all placement equipment in the entire shop floor can be centrally managed, even including data from the CM series. SimulationCheck the tact simulation in advance on the screen and improve the total operating rate of the line. Mix Job Setter (MJS)A common feeder arrangement is advantageous when manufacturing multiple different products, since the reduction in feeder replacement time increases productivity. PPD/LWS EditorReduce loss times by quickly and easily editing the production data of the placement and inspection heads on the PC screen during production.

FeaturesThe Manufacturing Operations Optimiser (MFO) is a newly developed product for drawing up production plans required  for on-site  operations  to  reduce the man-hours needed for the production  plan  and,  at  the same time, to enhance production efficiency. MFO creates detailed schedules for productions and pre-set-up operations and calculates the required resources for production by simulating the manufacturing process  of  the  entire  SMT production floor.  By simulating the planned  production, the  MFO  answers questions about estimated  production  completion, indicates which  production  sequence is to  be  used for higher efficiency, proposes optimal machine set-up for higher efficiency, and indicates the number of staff needed to  achieve  the  plan.  MFO  models  the  required  production  line, taking  into  account errors that can occur at the production machines, such as parts exchange. It optimises production taking into  account multiple  production  lines.  The  off-line  set-up  sequence  can  be  optimised  to  adjust  the requirement  of  staff  and  material. MFO  support  is  not  limited  to  machines  of the NPM-series  but also  supports  CMand  DT-series  machines  and  screen  printers. It also supports non-Panasonic equipment such as SPI, AOI, reflow ovens, screen printers and others.

Panasonic manufacturing operations optimizer (MFO) is the line management system to create detailed production schedules including pre-set-up operations. Those production plans are mandatory to optimize manufacturing processes and thus improves cycle times and production efficiency. It also calculates the number of operators required by simulating the entire SMT manufacturing operation.  Image of the systemMFO provides clear and easy to understand plans for production, process set-up and operator management plus simulation reports.

Beside this, it provides various optimization function, like mounting process, production plan, production-set-up plan and operator count, including a table of function list and machines.  

Mounting feed-forward function Components can be placed correctly based on the solder printing position. Placement skip data feed-forward/Block recognition data feed-forward Placement machine recognition time reduction based on feed-forward discrepancy data. Misplacement of components using a modular placement machine can be prevented based on feed-forward solder/land* printing defect block data.*When inspecting lands on which package components are placed using flux epoxy. Printing position data feedback The solder printing position misalignment is measured by the inspection machine. The positioning correction is transferred by means of feedback to the screen printer. The solder printing area is measured by the inspection equipment. The stencil cleaning direction can be compared with the reference value by means of feedback.

The NPM-WX  represents the  next  generation  of  Panasonic’s  mounting  production  concept “Smart manufacturing”. The platform represents higher  line  throughput  and  improved  quality  at  lower cost  thanks  to  integrated  automated  systems.  APC  system  and  automatic  recovery  are  integrated  to provide autonomous line control.  The  incorporated  floor-management system and  remote-operation option  improve  utilisation  combined  with  lower  labour  costs.  Feeder  set-up  and  component supply  navigation  systems  are available, helping  to  reduce  the  work  variations.The  NPM-WX  can  handle  a  wide variety  of  components, from  0402  chip  components  up  to  large  components with  a max. size  of 150x25x40 mm.  Parts can be supplied from  tape,  stick or tray-feeder . Feeder-cart  flexibility can be provided by selecting the existing 30-input feeder cart or inserting two 17-inpu

The PSX307 Plasma Cleaner provides 1.5 times the productivity of conventional plasma cleaners. Panasonic's parallel plate plasma chamber technology delivers superior etch uniformity compared to conventional batch-type plasma cleaner systems.By using an argon plasma treatment, ultra-thin gold-plated electrodes can be wire-bonded reliably without the formation of nickel compounds. The savings achieved in cheaper gold plating can provide the ROI justification alone. The PSX307 Plasma Cleaner's other capabilities include surface modification by oxygen plasma, improving mold resin adhesion and under-fill wettability, and reducing the incidence of peel-off, voids, and cracks.Panasonic's Plasma Monitoring System suppresses abnormal discharges for a secure and efficient production process. The option to include traceability functionality ensures high level process quality as well.

The fully automated printing solution is part of the "Autonomous Factory" Concept - a factory that immediately responds to every situation and continues to evolve autonomously. Ensuring the production of non-defective items through the integrated control of autonomous uninterrupted mounting lines and floors independent of any human intervention and judgment.

Features:Increased Production Time:  (1) Reduces machine availability losses through automation of operations required for model changeover.(2) Reduces machine performance losses through automation of operations involved in production.(3) Increases production time by monitoring machine conditions and thereby performing maintenanceat right times.

Maintenance of printing quality at a consistently high level: Reduces losses due to defective items through various functions that actualizes consistently high-qualityprinting capable of responding to any changes in 5M.

Support for line solution: Realizes high-quality line production through M2M

The NPM-VF is equipped with a double portal. The SMD and THT components are placed by one placement head per portal. A wide variety of vacuum pipettes and grippers are available. The pick and place machine can be used in single or dual lane mode. The NPM-VF reaches a speed of up to 4,500cph and can process component sizes from 5x5mm up to 130x35mm and 60mm height. Active cutting and clinching tools are integrated which detach THT components from the radial and axial feeders. Clinching directions as well as pin lengths per THT component can be defined via the assembly program. Beside the radial and axial feeders, the NPM-VF can be equipped with all common standard feeder systems for SMD components. The flexible NPM-VF is an ideal machine for cycle-optimized production, especially for companies that must process both types of components due to the increased demand from power electronics for THT assemblies. This efficient pick and place machine contributes to reduce manpower requirements and to consistent production with high productivity, flexibility and high-quality pick and place results.

The RG 131 is the successor of the RHSG. By supporting 3/4 pitches, expanding the range of board sizes and increasing component insertion rate, this high-density radial component insertion machine increases productivity. High speed insertion at a rate of between 0.25s and 0.6s per component can be achieved, even for large-size components with 3-pitch (2.5mm/5.0mm/7.5mm) or 4-pitch (2.5mm/5.0mm/7.5mm/10.0mm) configurations. A comprehensive self-correction function ensures high reliability. With large numbers of component supply and dual-partitioned component supply units, long-term operation can be obtained. A total of up to 80 types of components can be mounted. With large numbers of component supply and dual-partitioned component supply units, long-term operation can be achieved easily with the RG131. A total of up to 80 types of components can be mounted, with up to 32 (16 + 16) types of large components. The two separate component supply units enable components to be exchanged and replenished during operation. Panasonic offers also the RG131-S platform version with smaller footprint. Higher productivity expanding board size range and increasing component input.

Supplied with a 40 or 80 component feeder with optional jumper wire, the compact supply unit configuration of the AV132 can fit both ammo pack and reel. The dual partition configuration enables a fast changeover. The next job can be set up while the current one is being processed.Capable of inserting components in four directions: 0°, 90°, 180°, and 270°, the AV132 optimizes productivity by simultaneously handling 26 and 52mm taped components and providing fast, full auto-recovery. The AV132 can reduce loading times by running two PCBs simultaneously, enabling efficient production due to a speed of 0.12s/component and a transfer speed of 2s/PCB.The fixed feeder unit and the out-of-component detection feature allow to replenish components while maintaining long-term non-stop runs.Preparation in advance or equipment operation during component change-over is possible.

The APX300 (option S) Dry Etcher is the perfect dry etching equipment for silicon and compound semiconductors. It incorporates a multi-wafer direct cooling system for optimal control of wafer temperature, as well as MSC-ICP (Multi-Spiral Coil type ICP) and BM-ICP (Beamed-type ICP) plasma sources to generate high density plasma. In this way, it achieves a uniform etching profile in a very short timeframe. Building upon the single wafer process chamber of the previous model (Panasonic E620), combined with enhanced process options and two different handling systems, the APX300 (option S) is extremely fast and covers a wide range of process demands.

Features and benefits of Panasonic's APX300 (option S) Dry Etcher  The Panasonic APX300 (option S) Dry Etcher can process wafers such as power devices, SAW filters, communication devices, MEMS sensors and many more. The APX300 (option S) is the successor to the previous best-selling Panasonic E620 and utilizes the same single wafer process chamber.  Two plasma sources are available: MSC-ICP (Multi-Spiral Coil type ICP) and BM-ICP (Beamed-type ICP). MSC-ICP is Panasonic's latest technology, developed to realize highly accurate processing. BM-ICP offers higher electron density and achieves faster processing, covering a wide range of process demands.  In addition, two types of handling systems are available: Atmospheric Loading Supply and Vacuum Load Lock Supply.  The Panasonic APX300 (option S) Dry Etcher is CE certified.