Products

The RG 131 is the successor of the RHSG. By supporting 3/4 pitches, expanding the range of board sizes and increasing component insertion rate, this high-density radial component insertion machine increases productivity. High speed insertion at a rate of between 0.25s and 0.6s per component can be achieved, even for large-size components with 3-pitch (2.5mm/5.0mm/7.5mm) or 4-pitch (2.5mm/5.0mm/7.5mm/10.0mm) configurations. A comprehensive self-correction function ensures high reliability. With large numbers of component supply and dual-partitioned component supply units, long-term operation can be obtained. A total of up to 80 types of components can be mounted. With large numbers of component supply and dual-partitioned component supply units, long-term operation can be achieved easily with the RG131. A total of up to 80 types of components can be mounted, with up to 32 (16 + 16) types of large components. The two separate component supply units enable components to be exchanged and replenished during operation. Panasonic offers also the RG131-S platform version with smaller footprint. Higher productivity expanding board size range and increasing component input.

The NPM-WX  represents the  next  generation  of  Panasonic’s  mounting  production  concept “Smart manufacturing”. The platform represents higher  line  throughput  and  improved  quality  at  lower cost  thanks  to  integrated  automated  systems.  APC  system  and  automatic  recovery  are  integrated  to provide autonomous line control.  The  incorporated  floor-management system and  remote-operation option  improve  utilisation  combined  with  lower  labour  costs.  Feeder  set-up  and  component supply  navigation  systems  are available, helping  to  reduce  the  work  variations.The  NPM-WX  can  handle  a  wide variety  of  components, from  0402  chip  components  up  to  large  components with  a max. size  of 150x25x40 mm.  Parts can be supplied from  tape,  stick or tray-feeder . Feeder-cart  flexibility can be provided by selecting the existing 30-input feeder cart or inserting two 17-inpu

The NPM-DGS data creation system is the integral solution for creating, editing and simulating production and library data for high productivity.

The APX300 (option S) Dry Etcher is the perfect dry etching equipment for silicon and compound semiconductors. It incorporates a multi-wafer direct cooling system for optimal control of wafer temperature, as well as MSC-ICP (Multi-Spiral Coil type ICP) and BM-ICP (Beamed-type ICP) plasma sources to generate high density plasma. In this way, it achieves a uniform etching profile in a very short timeframe. Building upon the single wafer process chamber of the previous model (Panasonic E620), combined with enhanced process options and two different handling systems, the APX300 (option S) is extremely fast and covers a wide range of process demands.

Features and benefits of Panasonic's APX300 (option S) Dry Etcher  The Panasonic APX300 (option S) Dry Etcher can process wafers such as power devices, SAW filters, communication devices, MEMS sensors and many more. The APX300 (option S) is the successor to the previous best-selling Panasonic E620 and utilizes the same single wafer process chamber.  Two plasma sources are available: MSC-ICP (Multi-Spiral Coil type ICP) and BM-ICP (Beamed-type ICP). MSC-ICP is Panasonic's latest technology, developed to realize highly accurate processing. BM-ICP offers higher electron density and achieves faster processing, covering a wide range of process demands.  In addition, two types of handling systems are available: Atmospheric Loading Supply and Vacuum Load Lock Supply.  The Panasonic APX300 (option S) Dry Etcher is CE certified.

FeaturesThe revolutionary integrated  line  management  system  is  the basis for  controlling the  entire  production line. It  is  not limited  to  Panasonic machines but  also  integrates  third-party  equipment such as PCB transfer systems, laser markers, AOI, SPI and ovens. Conventional systems require a number of PCs to control different machine types from different suppliers. The iLNB controls the entire line with only one PC.  iLNB  significantly improves overall  productivity.  Production  data  and  production  changeover  of  all equipment, such as Panasonic’s placement machines as well as non-Panasonic machines including AOI, SPI, reflow  ovens  and  others,  can  be  controlled.  All  collected  data  are  transferred  to  a remote central computer. Small  errors such  as pick-up  errors  can  be recovered from  that  central  point.  Automatic production changeover is also possible. With the iLNB, users can manage automatic product changeovers and have an E-Link which provides an interface for information input and output, for machine control, management of components per feeder, and communication with a GEM/PLC. iLNB provides total control of the production line by interfacing between Panasonic and non-Panasonic machines, acting as one-stop channel. With the iLNB Users can manage automatic product changeovers and have an E-Link which provides an interface for information in- and output, for machine control, management of component per feeder and a communication to GEM/PLC. Automatic changeover Registration of automatic changeover recipeLine automatic changeoverAutomatic changeover monitoringLine operation monitoringE-Link interface for Information inputDownload / edit of scheduleE-Link interface for Information outputOperational information outputTrace information outputMachine status outputE-Link interface for machine controlMachine interlock; production start controlE-Link interface for feeder writeWriting of component data by an external systemCommunications to GEM/PLCSECS2/GEM communicationOPC communicationIO/RS-232C communication

The PSX307 Plasma Cleaner provides 1.5 times the productivity of conventional plasma cleaners. Panasonic's parallel plate plasma chamber technology delivers superior etch uniformity compared to conventional batch-type plasma cleaner systems.By using an argon plasma treatment, ultra-thin gold-plated electrodes can be wire-bonded reliably without the formation of nickel compounds. The savings achieved in cheaper gold plating can provide the ROI justification alone. The PSX307 Plasma Cleaner's other capabilities include surface modification by oxygen plasma, improving mold resin adhesion and under-fill wettability, and reducing the incidence of peel-off, voids, and cracks.Panasonic's Plasma Monitoring System suppresses abnormal discharges for a secure and efficient production process. The option to include traceability functionality ensures high level process quality as well.

The NPM-VF is equipped with a double portal. The SMD and THT components are placed by one placement head per portal. A wide variety of vacuum pipettes and grippers are available. The pick and place machine can be used in single or dual lane mode. The NPM-VF reaches a speed of up to 4,500cph and can process component sizes from 5x5mm up to 130x35mm and 60mm height. Active cutting and clinching tools are integrated which detach THT components from the radial and axial feeders. Clinching directions as well as pin lengths per THT component can be defined via the assembly program. Beside the radial and axial feeders, the NPM-VF can be equipped with all common standard feeder systems for SMD components. The flexible NPM-VF is an ideal machine for cycle-optimized production, especially for companies that must process both types of components due to the increased demand from power electronics for THT assemblies. This efficient pick and place machine contributes to reduce manpower requirements and to consistent production with high productivity, flexibility and high-quality pick and place results.

THE ROTATING HAND STRAP (FZ-VSTL11U) IS DESIGNED FOR TOUGHBOOK S1

THE DESKTOP PORT REPLICATOR (CF-VEB201U) IS DESIGNED FOR COMPATIBILITY WITH TOUGHBOOK G2, G1 MODELS

The Capacitive Stylus Pen is designed for compatibility with TOUGHBOOK A3, S1.

The Active Stylus Pen (FZ-VNPN11U) is designed for compatibility with TOUGHBOOK N1.

THE STANDARD LI-ION BATTERY PACK (CF-VZSU1AW) IS DESIGNED FOR COMPATIBILITY WITH THE TOUGHBOOK 33