Products
PSX307 Plasma Cleaner
PSX307 is a parallel plate plasma cleaner for PCBs with automatic transfer. Loader/unloader and in-line specifications can be selected. One of the following 2 models can be selected depending on the PCB dimensions. S type PCB dimensions: L 50 mm × W 20 mm to L 250 mm × W 75 mm M type PCB dimensions: L 50 mm × W 20 mm to L 330 mm × W 120 mm
AV132
High speed Axial Lead Component Insertion Machine AV132 for high productivity with High speed insertion of 0.12 s / component , sequential component supply system and vertical automated feederThis is a high speed axial lead component insertion machine that inserts axial components and jumper wires at high speed (0.12 s/component).A sequential system has been adopted in the component supply unit to improve the operation rate.
NPM-VF
Innovating PCB assembly process via automation of odd-form components insertion This is a odd-form component insertion machine that realizes high productivity by automating manual insertion of odd-form components.It supports various types of odd-form components with various head and feeder configurations. The cameras scan PCB holes and component orientation to achieve high insertion reliability. The clinch function (optional) prevents protrusion of components and improves solder strength after flow to achieve high-quality insertion of odd-form components.
RG131/RG131-S
High density radial lead component insertion machine for high quality and high production with our company's unique insertion methodThis high density radial lead component insertion machine achieves high productivity with our company's unique guide pin method and component supply section of sequence system.
RL132
High speed radial lead component insertion machine for for high efficiency and high quality production with high-speed insertion of 0.14s/ component This is a high-speed radial component insertion machine that achieves high productivity with the electronic component lead chuck system and the sequential component supply system.
APX300 Dry Etcher(S Option)
The APX300 (S option) is a dry etching system specializing in the processing of chemical compounds and non-volatile materials. It is compatible with wafers of 2 inches to 8 inches and irregular substrates, and two transport methods can be selected: “Atmospheric loading supply ” and “ Vacuum load lock supply ” CE certificated.
This equipment is a single-wafer processing type for wafers of 8 inches or smaller, and can be selected and optimized for a wide range of process applications such as power semiconductors, optical communications, high-frequency communications, RF modules, and MEMS.
In addition, as a post-etching process, the ashing and rinsing chambers can be expanded according to the process application.
PT-FRZ55
DLP™ imaging technology, Quartet Colour Harmonizer, Rich Colour Enhancer, and digitally modulated Dynamic Contrast 2 optimization coalesce in images of surpassing brightness, colour, and clarity regardless of ambient light levels.Flexible 2.0x zoom lens with V/H Lens-Shift joins DIGITAL LINK and CEC-ready HDMI® terminals supporting 4K/60p input signals*2. Separate LAN terminal and USB-DC outlet further streamline installation.
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