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AJ-CX4000GJ
The AJ-CX4000 is the latest addition to the 4K camcorder ‘CX Series’, which has been introduced to support UHD content acquisition for newsgathering operations, to stream live events, and for sports and documentary capture.
AG-CX350
Industrial Lightest Weight 4.2 lbs*1. and Highest Sensitivity of F12/F13*2 in the Fixed-Lens Camcorders, and  Direct Connection Capability to Live Streaming Service/NDI®*3 HX(pre-installed)*4
TY-SB01SS
3G-SDI Terminal Board_x000D_ Compatible with 3G-SDI, HD-SDI, SD-SDI audio and video formats
TOUGHBOOK G1 COMPATIBLE
PCPE-SYSLG15
THE DOCKABLE CASE (PCPE-SYSLG15) IS COMPATIBLE FOR ALL TOUGHBOOK G1 MODELS
TOUGHBOOK G1 COMPATIBLE
FZ-VPFG11U
The 10.1" LCD Protective Film (FZ-VPFG11U) is designed for compatibility with TOUGHBOOK G1.
TOUGHBOOK G1 COMPATIBLE
PCPE-FZG1CA1
CHARGER AND ATTACHMENT ADAPTOR FOR G1 BATTERY
ET-RFE16
Pleated air filter
MD-P200 Die Bonder
Unit Level Manufacturing by the Synchro-motion of Dispensing and Bonding MD-P200's die bonding is carried out immediately after Epoxy dispensing , thereby making it possible to finish the bonding operation before the Epoxy is deteriorated over time.This realizes stable and high quality bonding at all bond positions on a substrate.Also, the Bonding Stage Camera enables pre-bonding inspection right after Epoxy dispensing and post-bonding inspection right after the bonding of a die ( Option ). This system allows you to realize manufacturing with real-time quality-inspection. The large-sized touch panel and the interactive software realize an easy and reliable operating environment for all users from beginners to experts.
MD-P300 Flip-chip Bonder
The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.
PSX307 Plasma Cleaner
PSX307 is a parallel plate plasma cleaner for PCBs with automatic transfer. Loader/unloader and in-line specifications can be selected. One of the following 2 models can be selected depending on the PCB dimensions. S type PCB dimensions: L 50 mm × W 20 mm to L 250 mm × W 75 mm M type PCB dimensions: L 50 mm × W 20 mm to L 330 mm × W 120 mm
PSX307A Plasma Cleaner
PSX307 is a parallel plate plasma cleaner for PCBs with automatic transfer. Loader/unloader and in-line specifications can be selected. It can handle wafers up to ⌀300 mm (with or without dicing ring), and process four 77.5 mm wide PCBs simultaneously.
AW-UE150A
The AW-UE150A 4K PTZ camera has been designed to meet the needs of professional broadcasters and content creators, delivering advanced video quality, operability and efficiency in studio-based video productions.