Products

Achieving High Productivity, High Quality and Manpower Saving This is a modular mounter to achieve both high productivity and high precision. The machine configuration is 4 heads and 4 feeder carts, and achieves high productivity while allowing the placement of up to 136 different types of components. In addition, it supports a variety of automation and manpower saving functions, including the Auto Setting Feeder (ASF), which automates components feeding operations, to flexibly meet the demands of each mounting site.

Modular placement machine with high productivity and placement accuracy This modular mounter achieves both high productivity and high accuracy by improving the basic performance of key units such as the placement head and recognition camera. It is compatible with a wide range of components and a variety of supply units layouts. It also supports a variety of automation and labor-saving functions, including the Auto Setting Feeder (ASF), which automates parts supply work, to flexibly meet the demands of each mounting site.

Compact screen printer with high efficiency production and dual lanes Highly efficient production and dual lanes are realized in a compact size, providing the best functionality for your production configuration.

High speed radial lead component insertion machine for for high efficiency and high quality production with high-speed insertion of 0.14s/ component This is a high-speed radial component insertion machine that achieves high productivity with the electronic component lead chuck system and the sequential component supply system.

Unit Level Manufacturing by the Synchro-motion of Dispensing and Bonding MD-P200's die bonding is carried out immediately after Epoxy dispensing , thereby making it possible to finish the bonding operation before the Epoxy is deteriorated over time.This realizes stable and high quality bonding at all bond positions on a substrate.Also, the Bonding Stage Camera enables pre-bonding inspection right after Epoxy dispensing and post-bonding inspection right after the bonding of a die ( Option ). This system allows you to realize manufacturing with real-time quality-inspection. The large-sized touch panel and the interactive software realize an easy and reliable operating environment for all users from beginners to experts.

The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.

PSX307 is a parallel plate plasma cleaner for PCBs with automatic transfer. Loader/unloader and in-line specifications can be selected. It can handle wafers up to ⌀300 mm (with or without dicing ring), and process four 77.5 mm wide PCBs simultaneously.

Printer with built-in PCB sorting function to realize ultra-high speed tact time Ultra high-speed tact: This screen-printer achieves a cycle time of 10 seconds. Built-in PCB sorting function enables the machine to accommodate various line layouts of customers.

High speed Axial Lead Component Insertion Machine AV132 for high productivity with High speed insertion of 0.12 s / component , sequential component supply system and vertical automated feederThis is a high speed axial lead component insertion machine that inserts axial components and jumper wires at high speed (0.12 s/component).A sequential system has been adopted in the component supply unit to improve the operation rate.

High density radial lead component insertion machine for high quality and high production with our company's unique insertion methodThis high density radial lead component insertion machine achieves high productivity with our company's unique guide pin method and component supply section of sequence system.

The APX300 (S option) is a dry etching system specializing in the processing of chemical compounds and non-volatile materials. It is compatible with wafers of 2 inches to 8 inches and irregular substrates, and two transport methods can be selected: “Atmospheric loading supply ” and “ Vacuum load lock supply ” CE certificated.

This equipment is a single-wafer processing type for wafers of 8 inches or smaller, and can be selected and optimized for a wide range of process applications such as power semiconductors, optical communications, high-frequency communications, RF modules, and MEMS.

In addition, as a post-etching process, the ashing and rinsing chambers can be expanded according to the process application.

PSX307 is a parallel plate plasma cleaner for PCBs with automatic transfer. Loader/unloader and in-line specifications can be selected. One of the following 2 models can be selected depending on the PCB dimensions. S type PCB dimensions: L 50 mm × W 20 mm to L 250 mm × W 75 mm M type PCB dimensions: L 50 mm × W 20 mm to L 330 mm × W 120 mm