Products

The fully automated printing solution is part of the "Autonomous Factory" Concept - a factory that immediately responds to every situation and continues to evolve autonomously. Ensuring the production of non-defective items through the integrated control of autonomous uninterrupted mounting lines and floors independent of any human intervention and judgment.

The RL132 combines functionality and speed with an insertion rate up to 25,700cph (.14s/component), a board processing sizes up to 650 x 381mm, a 33% reduction in PCB transfer time, up to 18% reduction in electrical and air consumption per insertion and an improved parts lifespan for a very low cost of ownership. This through-hole machine features a 4-pitch span and is configurable with 40 or 80 components inputs. Meanwhile, its dual split carriage enables machine function at exchange mode and parts replenishment during production. The RL132 was designed for a non-stop productivity. The Lead V cut method enables the RL132 to insert radial lead components at a speed of 0.14s/component. Either a 2-pitch (2.5mm/5.0mm), 3-pitch (2.5mm/5.0mm/7.5mm) or 4-pitch (2.5mm/5.0mm/7.5mm/10.0mm) option can be selected. The fixed feeder unit method and an out-of-component detection function allow ongoing component replenishment and long-term runs. PCB of 650mm x 381mm can be processed.

The RG 131 is the successor of the RHSG. By supporting 3/4 pitches, expanding the range of board sizes and increasing component insertion rate, this high-density radial component insertion machine increases productivity. High speed insertion at a rate of between 0.25s and 0.6s per component can be achieved, even for large-size components with 3-pitch (2.5mm/5.0mm/7.5mm) or 4-pitch (2.5mm/5.0mm/7.5mm/10.0mm) configurations. A comprehensive self-correction function ensures high reliability. With large numbers of component supply and dual-partitioned component supply units, long-term operation can be obtained. A total of up to 80 types of components can be mounted. With large numbers of component supply and dual-partitioned component supply units, long-term operation can be achieved easily with the RG131. A total of up to 80 types of components can be mounted, with up to 32 (16 + 16) types of large components. The two separate component supply units enable components to be exchanged and replenished during operation. Panasonic offers also the RG131-S platform version with smaller footprint. Higher productivity expanding board size range and increasing component input.

Supplied with a 40 or 80 component feeder with optional jumper wire, the compact supply unit configuration of the AV132 can fit both ammo pack and reel. The dual partition configuration enables a fast changeover. The next job can be set up while the current one is being processed.Capable of inserting components in four directions: 0°, 90°, 180°, and 270°, the AV132 optimizes productivity by simultaneously handling 26 and 52mm taped components and providing fast, full auto-recovery. The AV132 can reduce loading times by running two PCBs simultaneously, enabling efficient production due to a speed of 0.12s/component and a transfer speed of 2s/PCB.The fixed feeder unit and the out-of-component detection feature allow to replenish components while maintaining long-term non-stop runs.Preparation in advance or equipment operation during component change-over is possible.

PanaCIM-EE Gen2 is the next generation of smart factory MES solution and connects digital and physical work, reporting and management areas.

Panasonic's Adaptive Process Control (APC) system realizes high-quality placement through excellent feed-forward and feed-back communication technology.

The NPM-DGS data creation system is the integral solution for creating, editing and simulating production and library data for high productivity.

PGMA - Panasonic Guided Manual Assembly helps to enhance manual assembly

The PSX307 Plasma Cleaner provides 1.5 times the productivity of conventional plasma cleaners. Panasonic's parallel plate plasma chamber technology delivers superior etch uniformity compared to conventional batch-type plasma cleaner systems.By using an argon plasma treatment, ultra-thin gold-plated electrodes can be wire-bonded reliably without the formation of nickel compounds. The savings achieved in cheaper gold plating can provide the ROI justification alone. The PSX307 Plasma Cleaner's other capabilities include surface modification by oxygen plasma, improving mold resin adhesion and under-fill wettability, and reducing the incidence of peel-off, voids, and cracks.Panasonic's Plasma Monitoring System suppresses abnormal discharges for a secure and efficient production process. The option to include traceability functionality ensures high level process quality as well.

Building upon the PSX307 Plasma Cleaner, the PSX307A Plasma Cleaner features an enlarged plasma chamber capacity that improves productivity. In addition, the PSX307A system is able to handle full wafers (both bare and on dicing frames).  Besides the increased capacity, Panasonic's original Plasma Monitoring System suppresses abnormal discharges resulting in a secure and efficient production process.  Additionally, the option to include a traceability functionality  ensures high level process Quality.

The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.

Unit Level Manufacturing by the synchro-motion of dispensing and bondingThe MD-P200's die bonding is carried out immediately after epoxy dispensing, thereby making it possible to finish the bonding operation before the epoxy has deteriorated. This realizes stable and high quality bonding at all bond positions on a substrate. In addition, the bonding stage camera enables pre-bonding inspection immediately after epoxy dispensing and post-bonding control immediately after the bonding of a die. This process enables manufacturing with real-time quality inspection.User-friendly operationA large touch panel and interactive software realize an easy and reliable operating environment for all users from beginners to experts.