MD-P300 Flip-chip Bonder
High yield, high throughput ultrasonic flip-chip bonding.
The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.
The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head.
The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.
The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.
Features and benefits of the Panasonic's MD-P300 Flip-chip Bonder
Easy process exchange
Bonding processes are available by switching the bonding tools, which can be performed by the customer by configuring the C4 dipping unit.
The bonding stage camera enables post-bonding inspection immediately after die bonding. This system enables manufacturing with real-time quality inspection.
A large touch panel and interactive software realize an easy and reliable operating environment for all users from beginners to experts.
- Process versatility
- Ideal for processors, CMOS, MEMS and power devices
- Fast and accurate
|Easy process exchange|
|Productivity||C4: 0.65s/IC (including dipping motion) Thermosonic: 0.65s/IC (including US process time of 0.2s)|
|Placement Accuracy||XY (3σ at PFSC conditions): ±5µm|
|Substrate dimensions||L 50 × W 50 to L 330 × W 330 (Heating specifications: L 330 × W 220mm)|
|Die dimensions (mm)||L 1 × W 1 to L 25 × W 25 (Thermosonic: L7 × W7)|
|Number of die types||Up to 12 product types (AWC specifications) nozzle type|
|Die Supply||Wafer frame 12 inches (Option: 8 inches)|
|Bonding Load||VCM head: 1N to 50N (Option: 2N to 100N)|
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