Products

The Pansonic arc welding robot cell PERFORMARC ET (Electrical Turntable) is a modular concept, developed using standard reliable Panasonic components.

IT/IP-centric platform based on an open software architecture that will bring ground-breaking innovations to many markets in the video industry, starting with a very powerful broadcast video switcher.

55-inch LED display capable of providing large-screen displays tailored to the space when used with multiple units

Next-generation Remote Camera Controller Revolutionizes Operator Workflows The AW-RP200GJ, building on its predecessor’s (AW-RP150GJ) highly regarded operability, introduces powerful new features such as convenient macro functionality for executing complex camera operations with ease, and dual left and right joysticks for flexible control. Such innovations enhance the controller’s performance for multi-camera productions, including in large-scale shooting environments, to elevate video content value.

When it comes to PTZ configuration, we have created an Easy IP Setup tool to make the process that much more straightforward. It allows you to see and change the IP of the cameras manually, as well as providing both camera control and reset options.

Software platform to manage media smartly and expand your creativity. Integration of software realize effective operation. Easy to add various extensive function on one software platform.

D-Sub/S-VIDEO conversion cable

The next-generation PT-REQ10 1-Chip DLP™ 4K Laser Projector is designed to streamline productions and expand the endless possibilities of entertainment by delivering exceptional, highly engaging immersive experiences with up to 10,000lm brightness, 4K resolution, and 240 Hz projection capability.

Unit Level Manufacturing by the Synchro-motion of Dispensing and Bonding MD-P200's die bonding is carried out immediately after Epoxy dispensing , thereby making it possible to finish the bonding operation before the Epoxy is deteriorated over time.This realizes stable and high quality bonding at all bond positions on a substrate.Also, the Bonding Stage Camera enables pre-bonding inspection right after Epoxy dispensing and post-bonding inspection right after the bonding of a die ( Option ). This system allows you to realize manufacturing with real-time quality-inspection. The large-sized touch panel and the interactive software realize an easy and reliable operating environment for all users from beginners to experts.

The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.

PSX307 is a parallel plate plasma cleaner for PCBs with automatic transfer. Loader/unloader and in-line specifications can be selected. One of the following 2 models can be selected depending on the PCB dimensions. S type PCB dimensions: L 50 mm × W 20 mm to L 250 mm × W 75 mm M type PCB dimensions: L 50 mm × W 20 mm to L 330 mm × W 120 mm

PSX307 is a parallel plate plasma cleaner for PCBs with automatic transfer. Loader/unloader and in-line specifications can be selected. It can handle wafers up to ⌀300 mm (with or without dicing ring), and process four 77.5 mm wide PCBs simultaneously.