Products

The Series features PT-MZ882 (8,200 lm), PT-MZ782 (7,500 lm), and PT-MZ682 (6,500 lm) WUXGA models with a refined Multi-Laser Drive Engine for the optimal balance of high brightness, vivid colour, and low-maintenance operation. *1 Measurement, measuring conditions, and method of notation are all compliant with ISO/IEC 21118: 2020 international standards. Value is average of all products when shipped

The Series features PT-MZ882 (8,200 lm), PT-MZ782 (7,500 lm), and PT-MZ682 (6,500 lm) WUXGA models with a refined Multi-Laser Drive Engine for the optimal balance of high brightness, vivid colour, and low-maintenance operation. *1 Measurement, measuring conditions, and method of notation are all compliant with ISO/IEC 21118: 2020 international standards. Value is average of all products when shipped

10.1" FULLY RUGGED WINDOWS 11 PRO TABLET

WINDOWS 11 PRO FULLY RUGGED DETACHABLE WITH 12" OUTDOOR FULL-HD DISPLAY

The next-generation PT-REQ10 1-Chip DLP™ 4K Laser Projector is designed to streamline productions and expand the endless possibilities of entertainment by delivering exceptional, highly engaging immersive experiences with up to 10,000lm brightness, 4K resolution, and 240 Hz projection capability.

Immersive for all : Compact and Light 1DLP 4K Projectors

Immersive for all : Compact and Light 1DLP 4K Projectors

Immersive for all : Compact and Light 1DLP 4K Projectors

Immersive for all : Compact and Light 1DLP 4K Projectors

Unit Level Manufacturing by the Synchro-motion of Dispensing and Bonding MD-P200's die bonding is carried out immediately after Epoxy dispensing , thereby making it possible to finish the bonding operation before the Epoxy is deteriorated over time.This realizes stable and high quality bonding at all bond positions on a substrate.Also, the Bonding Stage Camera enables pre-bonding inspection right after Epoxy dispensing and post-bonding inspection right after the bonding of a die ( Option ). This system allows you to realize manufacturing with real-time quality-inspection. The large-sized touch panel and the interactive software realize an easy and reliable operating environment for all users from beginners to experts.

The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.

PSX307 is a parallel plate plasma cleaner for PCBs with automatic transfer. Loader/unloader and in-line specifications can be selected. One of the following 2 models can be selected depending on the PCB dimensions. S type PCB dimensions: L 50 mm × W 20 mm to L 250 mm × W 75 mm M type PCB dimensions: L 50 mm × W 20 mm to L 330 mm × W 120 mm