Who we are
Smart Factory Solutions for any mix, any volume
Panasonic belongs to the global leading companies in the sector of the Smart Factory. Our unique DNA being a manufacturer and a total solutions provider enables us to understand the needs of our customers and to provide them with tailormade solutions for today’s challenges to be prepared for the industry of tomorrow.
Our dynamic and powerful software, managing our high-end equipment including 3rd party machines, provides our customers with a connected and responsive production environment. Any mix, any volume any time flexible to your needs with full process optimization.
Based on over 100 years of manufacturing and engineering experience, Panasonic offers trusted technology and innovation as your best partner in a connected future.
Connect to the Factory of Tomorrow
Our Solutions. Your Smart Factory
World-leading Panasonic technology matching your manufacturing needs with over 100 years of engineering experience and a wide range of factory solutions including SMT, THT, Robot & Welding, Microelectronics, UA3P equipment, and more.
Best-in-class Panasonic Software created in-house as a tailor-made dynamic solution to your manufacturing challenges: production line design, resource planning, traceability and continuous process optimization for a fully connected factory.
Trusted Panasonic Service with a strong network and trainings facilities all over the world. Providing support, machine & software trainings.
"Manufacturing is at the heart of what we do. And our collective knowledge and first-hand experience makes us the industry-leading solutions provider our customers know. "
Product Line Up SMT, THT, FATP and beyond
The printing performance of the SPG2 can be carried out in 14s with a process repeatability of ± 15μm. Larger circuit boards up to 510mm x 510mm can be handled without restrictions. A new programmable squeegee angle increases the filling pressure by up to 10%. The SPG2 can be equipped with the vacuum cleaning function, to enable a printing process without cleaning paper or cleaning agents. Additionally, it can be equipped with the optional automatic solder paste feed. The SPG2 can be linked into the Panasonic software environment, e.g. in the MES solution PanaCIM Gen2, Process Tracker and the MMS maintenance module in connection with the MFO manufacturing optimizer. Together with the integrated connection, the SPG2 is a trendsetting screen printer for Industry 4.0 applications. The SPG2 is Panasonic's latest printer for innovative high-mix manufacturing environments. The printer is equipped with additional functions and automation solutions for an even more cost-efficient SMD printing. Together with Panasonic’s software solutions, the SPG2 is a trendsetting screen printer for Industry 4.0 applications. Various features minimize the line management.
The SPV Stencil Printer offers a variety of options to suit different PCBs and production processes for consistent high quality. With its high 10s/PCB cycle time, the SPV eliminates bottlenecks and ensures quality by self-cleaning after every PCB. Three conveyors and the PCB identification function provide different automatic printing set ups for a high throughput. With the machine-to-machine-communication option the SPV Screen Printer is using APC correction data to correct positional printing errors. The SPV Stencil Printer can print multiple 350x300mm (M-size) boards simultaneously. This lowers WIP inventory and reduces changeover times by processing up to 4 unique products at once. The configuration minimizes capital expenditure by reducing printer investment by 50% and maximize the floor space utilization with new hybrid board handling concept and the multi-stage board handling conveyors.
The Stencil Printer SPV-DC enables high efficiency dual lane production in a compact design. The printer is designed for high speed production without changeovers. To reduce running costs the SPV-DC is equipped with the award-winning paperless cleaning function. Solder paste can refill automatically. Solder mask and the final printing result can be verified with an internal inspection. With the machine-to-machine-communication option the SPV-DC is using correction data to correct positional printing errors. The high-speed printer SPV-DC can print on board sizes from 50 x 50mm to 350 x 300mm. With the dual lanes the printer provides a cycle time of 13s, including transfer, positioning, recognition, high-precision printing and respective cleaning. Due to the non-stop changeover, the SPV-DC allows you to prepare the next production while running the printing process.
Mounting feed-forward function Components can be placed correctly based on the solder printing position. Placement skip data feed-forward/Block recognition data feed-forward Placement machine recognition time reduction based on feed-forward discrepancy data. Misplacement of components using a modular placement machine can be prevented based on feed-forward solder/land* printing defect block data.*When inspecting lands on which package components are placed using flux epoxy. Printing position data feedback The solder printing position misalignment is measured by the inspection machine. The positioning correction is transferred by means of feedback to the screen printer. The solder printing area is measured by the inspection equipment. The stencil cleaning direction can be compared with the reference value by means of feedback.
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Product Line Up Robot & Welding
TAWERS Arc welding system solution
The TAWERS “Weld Navigation” Software is an unique feature that will make your weld development much easier and faster.
TAWERS Arc welding system solution
TAWERS WG3 Arc welding system
Optimum welding processes are achieved by utilising an integrated inverter power source within the robot controller, ensuring complete synergy within the common control system. This ensures that the established benefits and advantages of the existing TAWERS Fusion Technology are also now available for use for the range of MIG, MAG and DC TIG welding process.
TAWERS Arc welding system solution
TAWERS WGH3 Arc welding system
Optimum welding processes are achieved by utilising an integrated inverter power source within the robot controller, ensuring complete synergy within the common control system.This ensures that the established benefits and advantages of the existing TAWERS Fusion Technology are also now available for use with WGH3.
TAWERS Arc welding system solution
TAWERS WG4 Arc welding system
The TAWERS-WG4 Arc Welding System is suitable for CO2, MAG, MIG and Stainless Steel welding applications.
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Product Line Up Microelectronics
APX300 Dry Etcher
The APX300 (option S) Dry Etcher is the perfect dry etching equipment for silicon and compound semiconductors. It incorporates a multi-wafer direct cooling system for optimal control of wafer temperature, as well as MSC-ICP (Multi-Spiral Coil type ICP) and BM-ICP (Beamed-type ICP) plasma sources to generate high density plasma. In this way, it achieves a uniform etching profile in a very short timeframe. Building upon the single wafer process chamber of the previous model (Panasonic E620), combined with enhanced process options and two different handling systems, the APX300 (option S) is extremely fast and covers a wide range of process demands. Features and benefits of Panasonic's APX300 (option S) Dry Etcher The Panasonic APX300 (option S) Dry Etcher can process wafers such as power devices, SAW filters, communication devices, MEMS sensors and many more. The APX300 (option S) is the successor to the previous best-selling Panasonic E620 and utilizes the same single wafer process chamber. Two plasma sources are available: MSC-ICP (Multi-Spiral Coil type ICP) and BM-ICP (Beamed-type ICP). MSC-ICP is Panasonic's latest technology, developed to realize highly accurate processing. BM-ICP offers higher electron density and achieves faster processing, covering a wide range of process demands. In addition, two types of handling systems are available: Atmospheric Loading Supply and Vacuum Load Lock Supply. The Panasonic APX300 (option S) Dry Etcher is CE certified.
APX300 Plasma Dicer
Plasma dicing is becoming increasingly attractive in the semiconductor market. Dies are becoming smaller and thinner and manufacturers are facing difficulties such as increasing material loss due to the width of the dicing line, mechanical damage to the dies from chipping and increasingly longer processing times due to line-by-line mechanical dicing. Panasonic’s APX300 Plasma Dicer solves these challenges and simultaneously provides a higher quality product with a lower cost of production. Features and benefits of Panasonic's APX300 Plasma DicerPlasma dicing requires a dicing street mask. After the mask is applied to the surface of the wafer and the dicing streets are exposed, the plasma process etches the exposed streets by a chemical reaction. By using a chemical etching process, a chipping-free and particle-free process is achieved. Thanks to the use of mask patterning, narrower street widths are possible – allowing more chips to be designed onto the wafer. Furthermore, the mask patterning allows complete flexibility in chip size, shape and position. The benefits of the Panasonic APX300 Plasma Dicer are: Particle-free and damage-free processHigher chip strengthYield improvementsThe Panasonic APX300 is available in a stand-alone single chamber (1 chamber) or a multi chamber (1, 2, or 3 chambers) configuration. Panasonic can provide a plasma dicing total solution to achieve a damage-free, particle-free, higher throughput and lower overall cost of production. The Panasonic APX300 is CE certified.
MD-P200 Die Bonder
Unit Level Manufacturing by the synchro-motion of dispensing and bondingThe MD-P200's die bonding is carried out immediately after epoxy dispensing, thereby making it possible to finish the bonding operation before the epoxy has deteriorated. This realizes stable and high quality bonding at all bond positions on a substrate. In addition, the bonding stage camera enables pre-bonding inspection immediately after epoxy dispensing and post-bonding control immediately after the bonding of a die. This process enables manufacturing with real-time quality inspection.User-friendly operationA large touch panel and interactive software realize an easy and reliable operating environment for all users from beginners to experts.
MD-P300 Flip-chip Bonder
The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.
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News & Events
The Connected Future of Manufacturing
Akira Yamashita, the new divisional head of Panasonic Factory Solutions in Europe, believes the future of manufacturing is a connected world, where connected equipment works in harmony with connected operators. He explains his vision…
Fascinating facts: The inspiring world of Panasonic
From hardware to software, to services to capabilities, to innovation to sustainability… Some inspiring facts about the world of Panasonic.
Rewarding times ahead for electronics manufacturers
There has never been a more rewarding time to be involved in European electronics manufacturing, says Peer Schumacher, the new Head of Manufacturing Solutions at Panasonic Connect Europe.
Just Weld it!
Just Weld it! Can be seen in large lettering across the wall as you enter the Robot and Welding area at the Panasonic Customer Experience Centre in Munich, Germany. And it’s a message the global industry is taking to heart with the welding market predicted to be worth more than €28 billion by 2028 – a compound annual growth rate of 4.6% driven by demand for advanced technology welding services, according to Fortune Business Insights.
The Material Facts about the Future of Manufacturing
The ability to control and optimise the just in time delivery of materials to the production process is one of the fundamental challenges for the future of automated manufacturing. Peter Barber, Head of Solutions Engineering at Panasonic Factory Solutions Europe, looks at the progress being made.
Robot and welding systems help to join the dots to autonomous manufacturing
A shortage of skilled welding labour and a desire for European manufacturers to localise their supply chains back on the continent is accelerating the move towards robot and welding systems and ultimately autonomous manufacturing. Peer Schumacher, head of department for Robot and Welding at Panasonic Connect explains more.
Smart Factory: Zero is the new hero
Ivan Flor Cantos, Marketing Manager of Panasonic Smart Factory Solutions, states production needs to be flexible and responsive to new requirements at any time and explains how the zero concept will contribute to process automation and smart factories.
Building the vision of the Autonomous Factory - Part 1
Imagine the gates to the factory slowly swing open as the self-driving truck arrives. It reverses into the unloading bay and a team of robots swing into co-ordinated action. They smoothly prepare the next production run – autonomously with zero human operator.
Building the vision of the Autonomous Factory - Part 2
Imagine we achieve the future vision of the autonomous factory: A totally integrated supply chain with lights-out production and ultimately zero human operators. Therefore, the challenge is connectivity.
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