Products

Filters
559 results

Placement (SMT)

NPM-GH

Automation / Labor-saving Solution + Intelligent system solution to achieve manufacturing that is further in line with production plan

Software

PanaCIM-EE Gen2: line management system

Featuressmart-factory-solutions software panacim-logo-02PanaCIM-EE Gen2 is the next generation of PanaCIM-EE, which allows for more efficient electronics manufacturing. This digital planning tool is necessary to enable reliable data management. This applies not only to individual systems, but to entire production lines, in which the data of each individual machine is included in the analysis. In addition, data from reports and management are included in the planning. This allows higher production rates and shorter cycle times to be achieved to make electronics production even more efficient and reliable. The PanaCIM-EE Gen2 is the next generation of a smart factory solution, connecting the shop floor with overall the management system. This includes precise inventory management, maximized factory performance based on a continuous production, total traceability, real time monitoring and optimization and an accurate in-time material supply. Material verificationMaterial controlTraceabilityProduction monitoring/dispatchProduction analysisMaintenanceEnterprise link

Camcorder

AG-CX18 / AG-CX20

Compacte 4K 10-bits 60p-camcorder met IP-connectiviteit.

AD Series

TL-137AD15AW

Een 137-inch alles-in-één LED-display met een hoge bruikbaarheid, een langdurige stabiele werking en flexibele installatie en uitbreidbaarheid

Insertion (THT/PTH)

RL132

The RL132 combines functionality and speed with an insertion rate up to 25,700cph (.14s/component), a board processing sizes up to 650 x 381mm, a 33% reduction in PCB transfer time, up to 18% reduction in electrical and air consumption per insertion and an improved parts lifespan for a very low cost of ownership. This through-hole machine features a 4-pitch span and is configurable with 40 or 80 components inputs. Meanwhile, its dual split carriage enables machine function at exchange mode and parts replenishment during production. The RL132 was designed for a non-stop productivity. The Lead V cut method enables the RL132 to insert radial lead components at a speed of 0.14s/component. Either a 2-pitch (2.5mm/5.0mm), 3-pitch (2.5mm/5.0mm/7.5mm) or 4-pitch (2.5mm/5.0mm/7.5mm/10.0mm) option can be selected. The fixed feeder unit method and an out-of-component detection function allow ongoing component replenishment and long-term runs. PCB of 650mm x 381mm can be processed.

Placement (SMT)

NPM-DX

The NPM-DX provides a greater line throughput, better quality and lower production cost featuring an autonomous line control, which guaranties a stable operation based on automatic functionality. This functionality in combination with the machine set up offers a labor-saving production with improved utilization. In combination with the Panasonic software environment and embedded into an Industry 4.0 philosophy, the user can expect a modern shop floor management system including various remote operation options, feeder setup navigation, component supply navigation etc. In total, the NPM-DX reduces downtimes and increase the line throughput. With 92 400 cph and a feeder capacity for up to 136 reels, the NPM-DX is the ideal solution to meet the expectation of an evolving electronics assembly industry. The NPM-DX can process PCB sizes of up to 510 x 590 mm and place large connectors (up to 150 x 25mm) and other components (up to 120 x 90mm). This and other features make the NPM-DX the best solution for high volume-mix manufacturing.

Placement (SMT)

NPM-GW

The NPM-GW SMT mounter combines flexibility, versatility, and precision.

AD Series

TL-110AD12AW

Een 110-inch alles-in-één LED-display met een hoge bruikbaarheid, een langdurige stabiele werking en flexibele installatie en uitbreidbaarheid

Microelectronics

APX300 Plasma Dicer

Plasma dicing is becoming increasingly attractive in the semiconductor market. Dies are becoming smaller and thinner and manufacturers are facing difficulties such as increasing material loss due to the width of the dicing line, mechanical damage to the dies from chipping and increasingly longer processing times due to line-by-line mechanical dicing. Panasonic’s APX300 Plasma Dicer solves these challenges and simultaneously provides a higher quality product with a lower cost of production. Features and benefits of Panasonic's APX300 Plasma DicerPlasma dicing requires a dicing street mask. After the mask is applied to the surface of the wafer and the dicing streets are exposed, the plasma process etches the exposed streets by a chemical reaction. By using a chemical etching process, a chipping-free and particle-free process is achieved. Thanks to the use of mask patterning, narrower street widths are possible – allowing more chips to be designed onto the wafer. Furthermore, the mask patterning allows complete flexibility in chip size, shape and position. The benefits of the Panasonic APX300 Plasma Dicer are: Particle-free and damage-free processHigher chip strengthYield improvementsThe Panasonic APX300 is available in a stand-alone single chamber (1 chamber) or a multi chamber (1, 2, or 3 chambers) configuration.  Panasonic can provide a plasma dicing total solution to achieve a damage-free, particle-free, higher throughput and lower overall cost of production. The Panasonic APX300 is CE certified. 

Microelectronics

MD-P300 Flip-chip Bonder

The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.

Microelectronics

PSX307A Plasma Cleaner

Building upon the PSX307 Plasma Cleaner, the PSX307A Plasma Cleaner features an enlarged plasma chamber capacity that improves productivity. In addition, the PSX307A system is able to handle full wafers (both bare and on dicing frames).  Besides the increased capacity, Panasonic's original Plasma Monitoring System suppresses abnormal discharges resulting in a secure and efficient production process.  Additionally, the option to include a traceability functionality  ensures high level process Quality.

Insertion (THT/PTH)

AV132

Supplied with a 40 or 80 component feeder with optional jumper wire, the compact supply unit configuration of the AV132 can fit both ammo pack and reel. The dual partition configuration enables a fast changeover. The next job can be set up while the current one is being processed.Capable of inserting components in four directions: 0°, 90°, 180°, and 270°, the AV132 optimizes productivity by simultaneously handling 26 and 52mm taped components and providing fast, full auto-recovery. The AV132 can reduce loading times by running two PCBs simultaneously, enabling efficient production due to a speed of 0.12s/component and a transfer speed of 2s/PCB.The fixed feeder unit and the out-of-component detection feature allow to replenish components while maintaining long-term non-stop runs.Preparation in advance or equipment operation during component change-over is possible.

You can select up to 3 products to compare: