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Building upon the PSX307 Plasma Cleaner, the PSX307A Plasma Cleaner features an enlarged plasma chamber capacity that improves productivity. In addition, the PSX307A system is able to handle full wafers (both bare and on dicing frames).  Besides the increased capacity, Panasonic's original Plasma Monitoring System suppresses abnormal discharges resulting in a secure and efficient production process.  Additionally, the option to include a traceability functionality  ensures high level process Quality.

Supplied with a 40 or 80 component feeder with optional jumper wire, the compact supply unit configuration of the AV132 can fit both ammo pack and reel. The dual partition configuration enables a fast changeover. The next job can be set up while the current one is being processed.Capable of inserting components in four directions: 0°, 90°, 180°, and 270°, the AV132 optimizes productivity by simultaneously handling 26 and 52mm taped components and providing fast, full auto-recovery. The AV132 can reduce loading times by running two PCBs simultaneously, enabling efficient production due to a speed of 0.12s/component and a transfer speed of 2s/PCB.The fixed feeder unit and the out-of-component detection feature allow to replenish components while maintaining long-term non-stop runs.Preparation in advance or equipment operation during component change-over is possible.

Automation / Labor-saving Solution + Intelligent system solution to achieve manufacturing that is further in line with production plan

The RG 131 is the successor of the RHSG. By supporting 3/4 pitches, expanding the range of board sizes and increasing component insertion rate, this high-density radial component insertion machine increases productivity. High speed insertion at a rate of between 0.25s and 0.6s per component can be achieved, even for large-size components with 3-pitch (2.5mm/5.0mm/7.5mm) or 4-pitch (2.5mm/5.0mm/7.5mm/10.0mm) configurations. A comprehensive self-correction function ensures high reliability. With large numbers of component supply and dual-partitioned component supply units, long-term operation can be obtained. A total of up to 80 types of components can be mounted. With large numbers of component supply and dual-partitioned component supply units, long-term operation can be achieved easily with the RG131. A total of up to 80 types of components can be mounted, with up to 32 (16 + 16) types of large components. The two separate component supply units enable components to be exchanged and replenished during operation. Panasonic offers also the RG131-S platform version with smaller footprint. Higher productivity expanding board size range and increasing component input.

The NPM-WX  represents the  next  generation  of  Panasonic’s  mounting  production  concept “Smart manufacturing”. The platform represents higher  line  throughput  and  improved  quality  at  lower cost  thanks  to  integrated  automated  systems.  APC  system  and  automatic  recovery  are  integrated  to provide autonomous line control.  The  incorporated  floor-management system and  remote-operation option  improve  utilisation  combined  with  lower  labour  costs.  Feeder  set-up  and  component supply  navigation  systems  are available, helping  to  reduce  the  work  variations.The  NPM-WX  can  handle  a  wide variety  of  components, from  0402  chip  components  up  to  large  components with  a max. size  of 150x25x40 mm.  Parts can be supplied from  tape,  stick or tray-feeder . Feeder-cart  flexibility can be provided by selecting the existing 30-input feeder cart or inserting two 17-inpu

The NPM-DGS data creation system is the integral solution for creating, editing and simulating production and library data for high productivity.

The APX300 (option S) Dry Etcher is the perfect dry etching equipment for silicon and compound semiconductors. It incorporates a multi-wafer direct cooling system for optimal control of wafer temperature, as well as MSC-ICP (Multi-Spiral Coil type ICP) and BM-ICP (Beamed-type ICP) plasma sources to generate high density plasma. In this way, it achieves a uniform etching profile in a very short timeframe. Building upon the single wafer process chamber of the previous model (Panasonic E620), combined with enhanced process options and two different handling systems, the APX300 (option S) is extremely fast and covers a wide range of process demands.

Features and benefits of Panasonic's APX300 (option S) Dry Etcher  The Panasonic APX300 (option S) Dry Etcher can process wafers such as power devices, SAW filters, communication devices, MEMS sensors and many more. The APX300 (option S) is the successor to the previous best-selling Panasonic E620 and utilizes the same single wafer process chamber.  Two plasma sources are available: MSC-ICP (Multi-Spiral Coil type ICP) and BM-ICP (Beamed-type ICP). MSC-ICP is Panasonic's latest technology, developed to realize highly accurate processing. BM-ICP offers higher electron density and achieves faster processing, covering a wide range of process demands.  In addition, two types of handling systems are available: Atmospheric Loading Supply and Vacuum Load Lock Supply.  The Panasonic APX300 (option S) Dry Etcher is CE certified.

The PSX307 Plasma Cleaner provides 1.5 times the productivity of conventional plasma cleaners. Panasonic's parallel plate plasma chamber technology delivers superior etch uniformity compared to conventional batch-type plasma cleaner systems.By using an argon plasma treatment, ultra-thin gold-plated electrodes can be wire-bonded reliably without the formation of nickel compounds. The savings achieved in cheaper gold plating can provide the ROI justification alone. The PSX307 Plasma Cleaner's other capabilities include surface modification by oxygen plasma, improving mold resin adhesion and under-fill wettability, and reducing the incidence of peel-off, voids, and cracks.Panasonic's Plasma Monitoring System suppresses abnormal discharges for a secure and efficient production process. The option to include traceability functionality ensures high level process quality as well.

The NPM-VF is equipped with a double portal. The SMD and THT components are placed by one placement head per portal. A wide variety of vacuum pipettes and grippers are available. The pick and place machine can be used in single or dual lane mode. The NPM-VF reaches a speed of up to 4,500cph and can process component sizes from 5x5mm up to 130x35mm and 60mm height. Active cutting and clinching tools are integrated which detach THT components from the radial and axial feeders. Clinching directions as well as pin lengths per THT component can be defined via the assembly program. Beside the radial and axial feeders, the NPM-VF can be equipped with all common standard feeder systems for SMD components. The flexible NPM-VF is an ideal machine for cycle-optimized production, especially for companies that must process both types of components due to the increased demand from power electronics for THT assemblies. This efficient pick and place machine contributes to reduce manpower requirements and to consistent production with high productivity, flexibility and high-quality pick and place results.

THE ROTATING HAND STRAP (FZ-VSTL11U) IS DESIGNED FOR TOUGHBOOK S1

THE DESKTOP PORT REPLICATOR (CF-VEB201U) IS DESIGNED FOR COMPATIBILITY WITH TOUGHBOOK G2, G1 MODELS

The Capacitive Stylus Pen is designed for compatibility with TOUGHBOOK A3, S1.