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Lenses for 1-Chip DLP

ET-C1W500

1-Chip DLP™ Projector Zoom Len - Throw Ratio 16:10 (0.940 - 1.39:1)

Lenses for 1-Chip DLP

ET-C1T700

1-Chip DLP™ Projector Zoom Len - Throw Ratio 16:10 (2.07 - 3.38:1)

Lenses for 1-Chip DLP

ET-C1S600

1-Chip DLP™ Projector Zoom Len - Throw Ratio 16:10 (1.36 - 2.10:1)

Lenses for LCD Projectors < 10.000 lumen

ET-ELT23

4.44-7.12:1 (WUXGA) Throw Ratio 

Lenses for 1-Chip DLP

ET-DLE060

0.600-0.801:1 (WUXGA) Throw Ratio

Lenses for LCD Projectors < 10.000 lumen

ET-ELT22

2.72-4.48:1 (WUXGA) Throw Ratio

Smart solutions

Virtual Robot Programming System

Panasonic Robot & Welding System Solutions presents the Virtual Robot Programming System (VPRS). This solution enables even unskilled robot operators to execute welding robot programming efficiently. The VRPS uses a digital twin of the welding robot that follows the movements of the manually guided torch model. Movements and welding tasks are defined on the real workpiece with the torch model, the virtual sequence is then transferred to the robot controller to be repeated by the robot. Two key benefits render the VPRS a great tool to improve your production:   • robot operators do not require years of experience, knowledge, or skill to program the robot   • the robot programming time is reduced drastically by simply using virtual reality on the actual workpiece.

Microelectronics

PSX307A Plasma Cleaner

Building upon the PSX307 Plasma Cleaner, the PSX307A Plasma Cleaner features an enlarged plasma chamber capacity that improves productivity. In addition, the PSX307A system is able to handle full wafers (both bare and on dicing frames).  Besides the increased capacity, Panasonic's original Plasma Monitoring System suppresses abnormal discharges resulting in a secure and efficient production process.  Additionally, the option to include a traceability functionality  ensures high level process Quality.

Microelectronics

PSX307 Plasma Cleaner

The PSX307 Plasma Cleaner provides 1.5 times the productivity of conventional plasma cleaners. Panasonic's parallel plate plasma chamber technology delivers superior etch uniformity compared to conventional batch-type plasma cleaner systems.By using an argon plasma treatment, ultra-thin gold-plated electrodes can be wire-bonded reliably without the formation of nickel compounds. The savings achieved in cheaper gold plating can provide the ROI justification alone. The PSX307 Plasma Cleaner's other capabilities include surface modification by oxygen plasma, improving mold resin adhesion and under-fill wettability, and reducing the incidence of peel-off, voids, and cracks.Panasonic's Plasma Monitoring System suppresses abnormal discharges for a secure and efficient production process. The option to include traceability functionality ensures high level process quality as well.

Microelectronics

MD-P300 Flip-chip Bonder

The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.

Microelectronics

MD-P200 Die Bonder

Unit Level Manufacturing by the synchro-motion of dispensing and bondingThe MD-P200's die bonding is carried out immediately after epoxy dispensing, thereby making it possible to finish the bonding operation before the epoxy has deteriorated. This realizes stable and high quality bonding at all bond positions on a substrate. In addition, the bonding stage camera enables pre-bonding inspection immediately after epoxy dispensing and post-bonding control immediately after the bonding of a die. This process enables manufacturing with real-time quality inspection.User-friendly operationA large touch panel and interactive software realize an easy and reliable operating environment for all users from beginners to experts.

Microelectronics

APX300 Plasma Dicer

Plasma dicing is becoming increasingly attractive in the semiconductor market. Dies are becoming smaller and thinner and manufacturers are facing difficulties such as increasing material loss due to the width of the dicing line, mechanical damage to the dies from chipping and increasingly longer processing times due to line-by-line mechanical dicing. Panasonic’s APX300 Plasma Dicer solves these challenges and simultaneously provides a higher quality product with a lower cost of production. Features and benefits of Panasonic's APX300 Plasma DicerPlasma dicing requires a dicing street mask. After the mask is applied to the surface of the wafer and the dicing streets are exposed, the plasma process etches the exposed streets by a chemical reaction. By using a chemical etching process, a chipping-free and particle-free process is achieved. Thanks to the use of mask patterning, narrower street widths are possible – allowing more chips to be designed onto the wafer. Furthermore, the mask patterning allows complete flexibility in chip size, shape and position. The benefits of the Panasonic APX300 Plasma Dicer are: Particle-free and damage-free processHigher chip strengthYield improvementsThe Panasonic APX300 is available in a stand-alone single chamber (1 chamber) or a multi chamber (1, 2, or 3 chambers) configuration.  Panasonic can provide a plasma dicing total solution to achieve a damage-free, particle-free, higher throughput and lower overall cost of production. The Panasonic APX300 is CE certified. 

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