329 results

Interface board/conversion cable


DVI-D input signal board

Interface board/conversion cable


12G-SDI signal board

Lenses for 3-Chip DLP > 35.000 lumens


3.89~5.47:1 throw ratio (Aspect 17:9) Zoom Lens for the PT-RQ50K

Lenses for 3-Chip DLP > 35.000 lumens


2.00~3.41:1 throw ratio (Aspect 17:9) Zoom Lens for the PT-RQ50K

Lenses for 3-Chip DLP < 35.000 lumens


Project in tight spaces from very short throw-distances. With zero offset capability, these two lens options widen the versatility of Panasonic’s 3-Chip DLP™ lineup.

Lenses for 3-Chip DLP < 35.000 lumens


4.94-7.94:1 for PT-RQ32K/RQ22K (16:10 aspect ratio) 4.61-7.41:1 for PT-RZ31K/RZ21K (16:10 aspect ratio) 4.99-8.02:1 for PT-RS30K/RS20K (4:3 aspect ratio)

Lenses for 3-Chip DLP < 35.000 lumens


2.57-5.00:1 for PT-RQ32K (16:10 aspect ratio)2.40-4.66:1 for PT-RZ31K/RZ21K (16:10 aspect ratio)2.59-5.05:1 for PT-RS30K/RS20K (4:3 aspect ratio)

IT Solutions


Manage and control multiple Panasonic PTZ camera presets

Mount Adaptor


Build-up Unit - Supports Large and ENG/EFP lens adaptor

Mounting (SMT)


The NPM-VF is equipped with a double portal. The SMD and THT components are placed by one placement head per portal. A wide variety of vacuum pipettes and grippers are available. The pick and place machine can be used in single or dual lane mode. The NPM-VF reaches a speed of up to 4,500cph and can process component sizes from 5x5mm up to 130x35mm and 60mm height. Active cutting and clinching tools are integrated which detach THT components from the radial and axial feeders. Clinching directions as well as pin lengths per THT component can be defined via the assembly program. Beside the radial and axial feeders, the NPM-VF can be equipped with all common standard feeder systems for SMD components. The flexible NPM-VF is an ideal machine for cycle-optimized production, especially for companies that must process both types of components due to the increased demand from power electronics for THT assemblies. This efficient pick and place machine contributes to reduce manpower requirements and to consistent production with high productivity, flexibility and high-quality pick and place results.

Mounting (SMT)


The NPM-DX provides a greater line throughput, better quality and lower production cost featuring an autonomous line control, which guaranties a stable operation based on automatic functionality. This functionality in combination with the machine set up offers a labor-saving production with improved utilization. In combination with the Panasonic software environment and embedded into an Industry 4.0 philosophy, the user can expect a modern shop floor management system including various remote operation options, feeder setup navigation, component supply navigation etc. In total, the NPM-DX reduces downtimes and increase the line throughput. With 92 400 cph and a feeder capacity for up to 136 reels, the NPM-DX is the ideal solution to meet the expectation of an evolving electronics assembly industry. The NPM-DX can process PCB sizes of up to 510 x 590 mm and place large connectors (up to 150 x 25mm) and other components (up to 120 x 90mm). This and other features make the NPM-DX the best solution for high volume-mix manufacturing.


MD-P200 Die Bonder

Unit Level Manufacturing by the synchro-motion of dispensing and bondingThe MD-P200's die bonding is carried out immediately after epoxy dispensing, thereby making it possible to finish the bonding operation before the epoxy has deteriorated. This realizes stable and high quality bonding at all bond positions on a substrate. In addition, the bonding stage camera enables pre-bonding inspection immediately after epoxy dispensing and post-bonding control immediately after the bonding of a die. This process enables manufacturing with real-time quality inspection.User-friendly operationA large touch panel and interactive software realize an easy and reliable operating environment for all users from beginners to experts.