Products

Despite its high brightness and jaw-dropping image quality, PT-RQ35K2 Series is the smallest and lightest 3-Chip DLP™ product in its class and can be transported and installed with just two people. Save on labor costs and enjoy greater convenience when backyard space is limited.A combination of two blue and one red laser expands colour-space reproduction by 114 %*3 over the PT-RQ32K2. Vivid red and pure blue reproduction heightens realism for an immersive experience and takes high-resolution content to the next level. Redesigned airflow path, cooling system, and finless radiator reinforce reliability. Dynamic Digital Control regulates red laser output and cooling for consistent image quality. Expect 20,000 hours of maintenance-free projection with backup input and laser failover circuitry offering peace of mind when projection can’t be interrupted.

Despite its high brightness and jaw-dropping image quality, PT-RQ35K2 Series is the smallest and lightest 3-Chip DLP™ product in its class and can be transported and installed with just two people.

Delivering 42,000 lm from a body size equivalent to the RQ35K2/RQ35K Series, the RQ45K Series streamlines transport, installation, and setup logistics. Compatibility with existing frames, flight cases, and optional lenses makes upgrading economical

The Stencil Printer SPV-DC enables high efficiency dual lane production in a compact design. The printer is designed for high speed production without changeovers. To reduce running costs the SPV-DC is equipped with the award-winning paperless cleaning function. Solder paste can refill automatically. Solder mask and the final printing result can be verified with an internal inspection. With the machine-to-machine-communication option the SPV-DC is using correction data to correct positional printing errors. The high-speed printer SPV-DC can print on board sizes from 50 x 50mm to 350 x 300mm. With the dual lanes the printer provides a cycle time of 13s, including transfer, positioning, recognition, high-precision printing and respective cleaning. Due to the non-stop changeover, the SPV-DC allows you to prepare the next production while running the printing process.

The RL132 combines functionality and speed with an insertion rate up to 25,700cph (.14s/component), a board processing sizes up to 650 x 381mm, a 33% reduction in PCB transfer time, up to 18% reduction in electrical and air consumption per insertion and an improved parts lifespan for a very low cost of ownership. This through-hole machine features a 4-pitch span and is configurable with 40 or 80 components inputs. Meanwhile, its dual split carriage enables machine function at exchange mode and parts replenishment during production. The RL132 was designed for a non-stop productivity. The Lead V cut method enables the RL132 to insert radial lead components at a speed of 0.14s/component. Either a 2-pitch (2.5mm/5.0mm), 3-pitch (2.5mm/5.0mm/7.5mm) or 4-pitch (2.5mm/5.0mm/7.5mm/10.0mm) option can be selected. The fixed feeder unit method and an out-of-component detection function allow ongoing component replenishment and long-term runs. PCB of 650mm x 381mm can be processed.

Higher productivity and quality thanks to the integration of printing, placement and inspection processes make the NPM-W2 one of the most flexible and versatile pick-and-place solutions on the market.

PanaCIM-EE Gen2 is the next generation of smart factory MES solution and connects digital and physical work, reporting and management areas.

Unit Level Manufacturing by the synchro-motion of dispensing and bondingThe MD-P200's die bonding is carried out immediately after epoxy dispensing, thereby making it possible to finish the bonding operation before the epoxy has deteriorated. This realizes stable and high quality bonding at all bond positions on a substrate. In addition, the bonding stage camera enables pre-bonding inspection immediately after epoxy dispensing and post-bonding control immediately after the bonding of a die. This process enables manufacturing with real-time quality inspection.User-friendly operationA large touch panel and interactive software realize an easy and reliable operating environment for all users from beginners to experts.

The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.

The AM100 meets the high standards of reliability, capacity and flexibility that customers look forward to in a cost-efficient, gradationally scalable, high-mix SMT solution. It only takes one machine to start off production and extra units and/or technologies can be easily integrated according to requirements. The single-head (single beam) of Panasonic's AM100 modular placement machine is able to place an impressive component array including: 0402 mm to 120 x 90 x 2 8mm, odd-shaped components, large connectors, as well as advanced packaging types e.g.Features The single solution AM100 provides high net productivity and versatility. Equipped with a 14-nozzle head and 160 feeders the AM100 can place an impressive component range. On top the non-stop changeover allows you to prepare the next product process during running production. An off-line setup support station and a feeder set-up navigator option improves operating time and minimizes the downtime.

Panasonic's Adaptive Process Control (APC) system realizes high-quality placement through excellent feed-forward and feed-back communication technology.

Designed to measure aspherical lenses & molds, freeform optics, mirrors and any other precision component requiring nanometer level accuracy.