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Ultrahigh accurate 3-D profilometer (UA3P)

Ultrahigh accurate 3-D profilometer (UA3P)

The Panasonic UA3P profilometer series is designed to measure aspherical lenses & molds, semiconductor wafers, and any other precision component requiring nanometer level accuracy ranging up to 200mm x 200mm. Different machine models are available to meet your optical & high aspect ratio metrology needs. The UA3P-300, UA3P-4 and UA3P-5 all offer users the accuracy of AFM technology with the measurement range of a CMM. Our unique approach uses atomic force probe technology in the stylus and HeNe laser-based interferometric XYZ axis positioning. Couple this technology with a solid granite-base and you have a robust metrology system that can be used on the factory floor and still deliver 0.1um level total uncertainty.

Smart solutions

Virtual Robot Programming System

Panasonic Robot & Welding System Solutions presents the Virtual Robot Programming System (VPRS). This solution enables even unskilled robot operators to execute welding robot programming efficiently. The VRPS uses a digital twin of the welding robot that follows the movements of the manually guided torch model. Movements and welding tasks are defined on the real workpiece with the torch model, the virtual sequence is then transferred to the robot controller to be repeated by the robot. Two key benefits render the VPRS a great tool to improve your production:   • robot operators do not require years of experience, knowledge, or skill to program the robot   • the robot programming time is reduced drastically by simply using virtual reality on the actual workpiece.

Final Assembly, Test & Packaging (FATP)

PGMA

PGMA - Panasonic Guided Manual Assembly helps to enhance manual assembly

Power sources

Robotic power sources

Panasonic provides MIG/MAG/TIG inverter pulse welding power sources for automatic welding with Panasonic welding robots. All power sources are based on the latest generation of Panasonic digital technology. The full digital control enables a fully digital communication between robot controller and power source for high quality welding.

Power sources

Manual welding power sources

Panasonic provides MIG/MAG/TIG inverter pulse welding power sources and wire feeders with intelligent remote control units for manual welding. All parts are based on the latest generation of Panasonic digital technology. It has 100% digital controlled ensuring high quality welding and easy access to the IT world via PC based interface.

TOUGHBOOK N1, F1 COMPATIBLE

Power and Chargers

FZ-AAE184EE/G

The USB Charger Kit (FZ-AAE184EE/G) is designed to be compatible with TOUGHBOOK L1, N1, T1, S1.

TOUGHBOOK 40, 33, 55, G2 COMPATIBLE

Power and Chargers

CF-AA5713A2E/G/T/D

The Vehicle dock is designed for compatibility with TOUGHBOOK 55.

TOUGHBOOK G2 STANDARD COMPATIBLE

Batteries

FZ-VZSU1UU

THE LONG-LIFE BATTERY PACKY (FZ-VZSU1UU) IS A BATTERY PACK DESIGNED FOR COMPATIBILITY WITH THE TOUGHBOOK G2 STANDARD

TOUGHBOOK 40 COMPATIBLE (512GB)

Miscellaneous

FZ-VSD400T1U

The 1st Opal SSD 512GB (FZ-VSD400T1U) is designed for compatibility with TOUGHBOOK 40.

TOUGHBOOK 55 COMPATIBLE

Desktop Port Replicators

CF-VEB541AU

THE DESKTOP PORT REPLICATOR (CF-VEB541AU) IS DESIGNED TO PROVIDE CONNECTIVITY AND FUNCTIONALITY IN A DESKTOP ENVIRONMENT, FULLY COMPATIBLE FOR THE TOUGHBOOK 55(54)

Microelectronics

APX300 Plasma Dicer

Plasma dicing is becoming increasingly attractive in the semiconductor market. Dies are becoming smaller and thinner and manufacturers are facing difficulties such as increasing material loss due to the width of the dicing line, mechanical damage to the dies from chipping and increasingly longer processing times due to line-by-line mechanical dicing. Panasonic’s APX300 Plasma Dicer solves these challenges and simultaneously provides a higher quality product with a lower cost of production. Features and benefits of Panasonic's APX300 Plasma DicerPlasma dicing requires a dicing street mask. After the mask is applied to the surface of the wafer and the dicing streets are exposed, the plasma process etches the exposed streets by a chemical reaction. By using a chemical etching process, a chipping-free and particle-free process is achieved. Thanks to the use of mask patterning, narrower street widths are possible – allowing more chips to be designed onto the wafer. Furthermore, the mask patterning allows complete flexibility in chip size, shape and position. The benefits of the Panasonic APX300 Plasma Dicer are: Particle-free and damage-free processHigher chip strengthYield improvementsThe Panasonic APX300 is available in a stand-alone single chamber (1 chamber) or a multi chamber (1, 2, or 3 chambers) configuration.  Panasonic can provide a plasma dicing total solution to achieve a damage-free, particle-free, higher throughput and lower overall cost of production. The Panasonic APX300 is CE certified. 

Microelectronics

MD-P200 Die Bonder

Unit Level Manufacturing by the synchro-motion of dispensing and bondingThe MD-P200's die bonding is carried out immediately after epoxy dispensing, thereby making it possible to finish the bonding operation before the epoxy has deteriorated. This realizes stable and high quality bonding at all bond positions on a substrate. In addition, the bonding stage camera enables pre-bonding inspection immediately after epoxy dispensing and post-bonding control immediately after the bonding of a die. This process enables manufacturing with real-time quality inspection.User-friendly operationA large touch panel and interactive software realize an easy and reliable operating environment for all users from beginners to experts.

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