Products

The TAWERS-WG4 Arc Welding System is suitable for CO2, MAG, MIG and Stainless Steel welding applications.

Optimum welding processes are achieved by utilising an integrated inverter power source within the robot controller, ensuring complete synergy within the common control system. This ensures that the established benefits and advantages of the existing TAWERS Fusion Technology are also now available for use for the range of MIG, MAG and DC TIG welding process.

Optimum welding processes are achieved by utilising an integrated inverter power source within the robot controller, ensuring complete synergy within the common control system.This ensures that the established benefits and advantages of the existing TAWERS Fusion Technology are also now available for use with WGH3.

The Slimline External CD/DVD Writer (PCPE-FCDVR05) is compatible for TOUGHBOOK products.

The Panasonic arc welding robot cell PERFORMARC FW-3PD (with 3 external axes PanaDice) is of a modular concept, developed using standard reliable Panasonic components.

4K CCU with Enhanced IP Connectivity,Including Support for ST 2110, The Industry’s First*1 Dante®, NDI®*4 and SRT. 

The AK-UCU700 CCU supports the next-generation SMPTE ST 21102 IP-transmission standard as well as JPEG-XS to uncompress/compress 4K video by a factor of 10 without degrading quality. As the industry's first1 studio camera system to support the Dante®*3 network audio standard as well as the NDI®*4 (High Bandwidth NDI®*4 ) and SRT (Secure Reliable Transport)*5 IP transmission standards, Panasonic Connect's new CCU realizes diverse networks and applications for IP studio camera systems. 

Featuressmart-factory-solutions software panacim-logo-02PanaCIM-EE Gen2 is the next generation of PanaCIM-EE, which allows for more efficient electronics manufacturing. This digital planning tool is necessary to enable reliable data management. This applies not only to individual systems, but to entire production lines, in which the data of each individual machine is included in the analysis. In addition, data from reports and management are included in the planning. This allows higher production rates and shorter cycle times to be achieved to make electronics production even more efficient and reliable. The PanaCIM-EE Gen2 is the next generation of a smart factory solution, connecting the shop floor with overall the management system. This includes precise inventory management, maximized factory performance based on a continuous production, total traceability, real time monitoring and optimization and an accurate in-time material supply. Material verificationMaterial controlTraceabilityProduction monitoring/dispatchProduction analysisMaintenanceEnterprise link

The RL132 combines functionality and speed with an insertion rate up to 25,700cph (.14s/component), a board processing sizes up to 650 x 381mm, a 33% reduction in PCB transfer time, up to 18% reduction in electrical and air consumption per insertion and an improved parts lifespan for a very low cost of ownership. This through-hole machine features a 4-pitch span and is configurable with 40 or 80 components inputs. Meanwhile, its dual split carriage enables machine function at exchange mode and parts replenishment during production. The RL132 was designed for a non-stop productivity. The Lead V cut method enables the RL132 to insert radial lead components at a speed of 0.14s/component. Either a 2-pitch (2.5mm/5.0mm), 3-pitch (2.5mm/5.0mm/7.5mm) or 4-pitch (2.5mm/5.0mm/7.5mm/10.0mm) option can be selected. The fixed feeder unit method and an out-of-component detection function allow ongoing component replenishment and long-term runs. PCB of 650mm x 381mm can be processed.

The Stencil Printer SPV-DC enables high efficiency dual lane production in a compact design. The printer is designed for high speed production without changeovers. To reduce running costs the SPV-DC is equipped with the award-winning paperless cleaning function. Solder paste can refill automatically. Solder mask and the final printing result can be verified with an internal inspection. With the machine-to-machine-communication option the SPV-DC is using correction data to correct positional printing errors. The high-speed printer SPV-DC can print on board sizes from 50 x 50mm to 350 x 300mm. With the dual lanes the printer provides a cycle time of 13s, including transfer, positioning, recognition, high-precision printing and respective cleaning. Due to the non-stop changeover, the SPV-DC allows you to prepare the next production while running the printing process.

The AM100 meets the high standards of reliability, capacity and flexibility that customers look forward to in a cost-efficient, gradationally scalable, high-mix SMT solution. It only takes one machine to start off production and extra units and/or technologies can be easily integrated according to requirements. The single-head (single beam) of Panasonic's AM100 modular placement machine is able to place an impressive component array including: 0402 mm to 120 x 90 x 2 8mm, odd-shaped components, large connectors, as well as advanced packaging types e.g.Features The single solution AM100 provides high net productivity and versatility. Equipped with a 14-nozzle head and 160 feeders the AM100 can place an impressive component range. On top the non-stop changeover allows you to prepare the next product process during running production. An off-line setup support station and a feeder set-up navigator option improves operating time and minimizes the downtime.

Mounting feed-forward function Components can be placed correctly based on the solder printing position. Placement skip data feed-forward/Block recognition data feed-forward Placement machine recognition time reduction based on feed-forward discrepancy data. Misplacement of components using a modular placement machine can be prevented based on feed-forward solder/land* printing defect block data.*When inspecting lands on which package components are placed using flux epoxy. Printing position data feedback The solder printing position misalignment is measured by the inspection machine. The positioning correction is transferred by means of feedback to the screen printer. The solder printing area is measured by the inspection equipment. The stencil cleaning direction can be compared with the reference value by means of feedback.

The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.