Products

Plasma dicing is becoming increasingly attractive in the semiconductor market. Dies are becoming smaller and thinner and manufacturers are facing difficulties such as increasing material loss due to the width of the dicing line, mechanical damage to the dies from chipping and increasingly longer processing times due to line-by-line mechanical dicing. Panasonic’s APX300 Plasma Dicer solves these challenges and simultaneously provides a higher quality product with a lower cost of production. Features and benefits of Panasonic's APX300 Plasma DicerPlasma dicing requires a dicing street mask. After the mask is applied to the surface of the wafer and the dicing streets are exposed, the plasma process etches the exposed streets by a chemical reaction. By using a chemical etching process, a chipping-free and particle-free process is achieved. Thanks to the use of mask patterning, narrower street widths are possible – allowing more chips to be designed onto the wafer. Furthermore, the mask patterning allows complete flexibility in chip size, shape and position. The benefits of the Panasonic APX300 Plasma Dicer are: Particle-free and damage-free processHigher chip strengthYield improvementsThe Panasonic APX300 is available in a stand-alone single chamber (1 chamber) or a multi chamber (1, 2, or 3 chambers) configuration.  Panasonic can provide a plasma dicing total solution to achieve a damage-free, particle-free, higher throughput and lower overall cost of production. The Panasonic APX300 is CE certified. 

The SPV Stencil Printer offers a variety of options to suit different PCBs and production processes for consistent high quality. With its high 10s/PCB cycle time, the SPV eliminates bottlenecks and ensures quality by self-cleaning after every PCB. Three conveyors and the PCB identification function provide different automatic printing set ups for a high throughput. With the machine-to-machine-communication option the SPV Screen Printer is using APC correction data to correct positional printing errors. The SPV Stencil Printer can print multiple 350x300mm (M-size) boards simultaneously. This lowers WIP inventory and reduces changeover times by processing up to 4 unique products at once. The configuration minimizes capital expenditure by reducing printer investment by 50% and maximize the floor space utilization with new hybrid board handling concept and the multi-stage board handling conveyors.

Panasonic RJB, RJR and RJC-Series positioners are built to move in harmony with robots and are designed for maximum flexibility to meet the needs of your applications.

THE 16GB RAM MODULE (FZ-BAZ2116) IS DESIGNED FOR COMPATIBLE WITH TOUGHBOOK 40

THE SHOULDER STRAP (FZ-VNS401U) IS DESIGNED FOR COMPATIBILITY WITH THE TOUGHBOOK 40

THE 32GB RAM MODULE (FZ-BAZ2132) IS DESIGNED FOR COMPATIBLE WITH TOUGHBOOK 40

THE INFOCASE MOBILITY BUNDLE (PCPE-INFG2MB) PROVIDES CARRYING SOLUTIONS FOR THE TOUGHBOOK G2 TABLET

THE USER CONFIGURABLE I/O (FZ-VCN401U) IS DESIGNED TO BE COMPATIBLE WITH TOUGHBOOK 40

The Capacitive Stylus Pen (FZ-VNP401U) is compatible for the TOUGHBOOK 40 model.

THE BLU RAY DRIVE (FZ-VBD401U) IS DESIGN FOR COMPATIBILITY WITH TOUGHBOOK 40

THE USER CONFIGURABLE I/O (FZ-VCN403U) IS DESIGNED TO BE COMPATIBLE WITH TOUGHBOOK 40

THE USER CONFIGURABLE I/O (FZ-VCN402U) IS DESIGNED TO BE COMPATIBLE WITH TOUGHBOOK 40