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AJ-PX380
P2HD Shoulder-Mount Camcorder with AVC-ULTRA recording and studio camera configuration
TY-SB01SS
3G-SDI Terminal Board_x000D_ Compatible with 3G-SDI, HD-SDI, SD-SDI audio and video formats
TOUGHBOOK G1 COMPATIBLE
PCPE-SYSLG15
THE DOCKABLE CASE (PCPE-SYSLG15) IS COMPATIBLE FOR ALL TOUGHBOOK G1 MODELS
TOUGHBOOK G1 COMPATIBLE
FZ-VPFG11U
The 10.1" LCD Protective Film (FZ-VPFG11U) is designed for compatibility with TOUGHBOOK G1.
TOUGHBOOK G1 COMPATIBLE
PCPE-FZG1CA1
CHARGER AND ATTACHMENT ADAPTOR FOR G1 BATTERY
ET-RFE16
Pleated air filter
MD-P200 Die Bonder
Unit Level Manufacturing by the Synchro-motion of Dispensing and Bonding MD-P200's die bonding is carried out immediately after Epoxy dispensing , thereby making it possible to finish the bonding operation before the Epoxy is deteriorated over time.This realizes stable and high quality bonding at all bond positions on a substrate.Also, the Bonding Stage Camera enables pre-bonding inspection right after Epoxy dispensing and post-bonding inspection right after the bonding of a die ( Option ). This system allows you to realize manufacturing with real-time quality-inspection. The large-sized touch panel and the interactive software realize an easy and reliable operating environment for all users from beginners to experts.
MD-P300 Flip-chip Bonder
The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.
PSX307 Plasma Cleaner
PSX307 is a parallel plate plasma cleaner for PCBs with automatic transfer. Loader/unloader and in-line specifications can be selected. One of the following 2 models can be selected depending on the PCB dimensions. S type PCB dimensions: L 50 mm × W 20 mm to L 250 mm × W 75 mm M type PCB dimensions: L 50 mm × W 20 mm to L 330 mm × W 120 mm
PSX307A Plasma Cleaner
PSX307 is a parallel plate plasma cleaner for PCBs with automatic transfer. Loader/unloader and in-line specifications can be selected. It can handle wafers up to ⌀300 mm (with or without dicing ring), and process four 77.5 mm wide PCBs simultaneously.
AW-UE150A
The AW-UE150A 4K PTZ camera has been designed to meet the needs of professional broadcasters and content creators, delivering advanced video quality, operability and efficiency in studio-based video productions.
SPV
Printer with built-in PCB sorting function to realize ultra-high speed tact time Ultra high-speed tact: This screen-printer achieves a cycle time of 10 seconds. Built-in PCB sorting function enables the machine to accommodate various line layouts of customers.