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PT-MZ882 Series

PT-MZ882

The Series features PT-MZ882 (8,200 lm11), PT-MZ782 (7,500 lm11), and PT-MZ682 (6,500 lm) WUXGA models with a refined Multi-Laser Drive Engine for the optimal balance of high brightness, vivid colour, and low-maintenance operation. *1 Measurement, measuring conditions, and method of notation are all compliant with ISO/IEC 21118: 2020 international standards. Value is average of all products when shipped.

PT-MZ882 Series

PT-MZ782

The Series features PT-MZ882 (8,200 lm11), PT-MZ782 (7,500 lm11), and PT-MZ682 (6,500 lm) WUXGA models with a refined Multi-Laser Drive Engine for the optimal balance of high brightness, vivid colour, and low-maintenance operation. *1 Measurement, measuring conditions, and method of notation are all compliant with ISO/IEC 21118: 2020 international standards. Value is average of all products when shipped.

Lamps

ET-LAD120PW

420 W UHM lamp x 2, For portrait mode

4K product line-up

AW-UE100

Supports high bandwidth NDI® for low latency transmission of high-quality 4K 60p/50p*1 video, and SRT*3 for high-quality and stable transmission, and also compatible with 12G-SDI output for use in a wide range of situations, from live streaming of events to studio production.

Brackets

ET-PKD520S

The Low ceiling mount bracket is designed for compatibility with PT-DZ21K2E, PT-DS20K2E, PT-DW17K2E, PT-DZ16K2, PT-RZ12K, PT-RQ13K projectors.

Brackets

ET-PKD120S

Low ceiling mount bracket

Brackets

ET-PKD120H

High ceiling mount bracket

Brackets

ET-PKD130H

ET-PKD130H

Microelectronics

APX300 Plasma Dicer

Plasma dicing is becoming increasingly attractive in the semiconductor market. Dies are becoming smaller and thinner and manufacturers are facing difficulties such as increasing material loss due to the width of the dicing line, mechanical damage to the dies from chipping and increasingly longer processing times due to line-by-line mechanical dicing. Panasonic’s APX300 Plasma Dicer solves these challenges and simultaneously provides a higher quality product with a lower cost of production. Features and benefits of Panasonic's APX300 Plasma DicerPlasma dicing requires a dicing street mask. After the mask is applied to the surface of the wafer and the dicing streets are exposed, the plasma process etches the exposed streets by a chemical reaction. By using a chemical etching process, a chipping-free and particle-free process is achieved. Thanks to the use of mask patterning, narrower street widths are possible – allowing more chips to be designed onto the wafer. Furthermore, the mask patterning allows complete flexibility in chip size, shape and position. The benefits of the Panasonic APX300 Plasma Dicer are: Particle-free and damage-free processHigher chip strengthYield improvementsThe Panasonic APX300 is available in a stand-alone single chamber (1 chamber) or a multi chamber (1, 2, or 3 chambers) configuration.  Panasonic can provide a plasma dicing total solution to achieve a damage-free, particle-free, higher throughput and lower overall cost of production. The Panasonic APX300 is CE certified. 

Microelectronics

MD-P200 Die Bonder

Unit Level Manufacturing by the synchro-motion of dispensing and bondingThe MD-P200's die bonding is carried out immediately after epoxy dispensing, thereby making it possible to finish the bonding operation before the epoxy has deteriorated. This realizes stable and high quality bonding at all bond positions on a substrate. In addition, the bonding stage camera enables pre-bonding inspection immediately after epoxy dispensing and post-bonding control immediately after the bonding of a die. This process enables manufacturing with real-time quality inspection.User-friendly operationA large touch panel and interactive software realize an easy and reliable operating environment for all users from beginners to experts.

Microelectronics

APX300 Dry Etcher

The APX300 (option S) Dry Etcher is the perfect dry etching equipment for silicon and compound semiconductors. It incorporates a multi-wafer direct cooling system for optimal control of wafer temperature, as well as MSC-ICP (Multi-Spiral Coil type ICP) and BM-ICP (Beamed-type ICP) plasma sources to generate high density plasma. In this way, it achieves a uniform etching profile in a very short timeframe. Building upon the single wafer process chamber of the previous model (Panasonic E620), combined with enhanced process options and two different handling systems, the APX300 (option S) is extremely fast and covers a wide range of process demands. Features and benefits of Panasonic's APX300 (option S) Dry Etcher  The Panasonic APX300 (option S) Dry Etcher can process wafers such as power devices, SAW filters, communication devices, MEMS sensors and many more. The APX300 (option S) is the successor to the previous best-selling Panasonic E620 and utilizes the same single wafer process chamber.  Two plasma sources are available: MSC-ICP (Multi-Spiral Coil type ICP) and BM-ICP (Beamed-type ICP). MSC-ICP is Panasonic's latest technology, developed to realize highly accurate processing. BM-ICP offers higher electron density and achieves faster processing, covering a wide range of process demands.  In addition, two types of handling systems are available: Atmospheric Loading Supply and Vacuum Load Lock Supply.  The Panasonic APX300 (option S) Dry Etcher is CE certified.

Microelectronics

MD-P300 Flip-chip Bonder

The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.

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