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TOUGHBOOK 40 COMPATIBLE
FZ-VNF401BU

The Contactless Smart Card Reader (FZ-VNF401BU) is designed for compatibility with TOUGHBOOK 40.

PT-REQ10

Nová generace 1čipového DLP™ 4K laserového projektoru PT-REQ10 je navržena tak, aby zefektivnila produkci a rozšířila nekonečné možnosti zábavy tím, že poskytuje výjimečné, vysoce poutavé pohlcující zážitky s jasem až 10 000lm, rozlišením 4K a projekcí 240 Hz.

10 000 lm 1-čipové DLP™ 4K+ slot Intel® SDM
PT-VW540

High brightness in compact and lightweight body. Designed for education and corporate applications

5 300 lm LCD WXGA
MD-P200 Die Bonder

Unit Level Manufacturing by the Synchro-motion of Dispensing and Bonding MD-P200's die bonding is carried out immediately after Epoxy dispensing , thereby making it possible to finish the bonding operation before the Epoxy is deteriorated over time.This realizes stable and high quality bonding at all bond positions on a substrate.Also, the Bonding Stage Camera enables pre-bonding inspection right after Epoxy dispensing and post-bonding inspection right after the bonding of a die ( Option ). This system allows you to realize manufacturing with real-time quality-inspection. The large-sized touch panel and the interactive software realize an easy and reliable operating environment for all users from beginners to experts.

MD-P300 Flip-chip Bonder

The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.

PSX307 Plasma Cleaner

PSX307 is a parallel plate plasma cleaner for PCBs with automatic transfer. Loader/unloader and in-line specifications can be selected. One of the following 2 models can be selected depending on the PCB dimensions. S type PCB dimensions: L 50 mm × W 20 mm to L 250 mm × W 75 mm M type PCB dimensions: L 50 mm × W 20 mm to L 330 mm × W 120 mm

PSX307A Plasma Cleaner

PSX307 is a parallel plate plasma cleaner for PCBs with automatic transfer. Loader/unloader and in-line specifications can be selected. It can handle wafers up to ⌀300 mm (with or without dicing ring), and process four 77.5 mm wide PCBs simultaneously.

AW-UE150A

The AW-UE150A 4K PTZ camera has been designed to meet the needs of professional broadcasters and content creators, delivering advanced video quality, operability and efficiency in studio-based video productions.

SPV

Printer with built-in PCB sorting function to realize ultra-high speed tact time Ultra high-speed tact: This screen-printer achieves a cycle time of 10 seconds. Built-in PCB sorting function enables the machine to accommodate various line layouts of customers.

SPV-DC

Compact screen printer with high efficiency production and dual lanes Highly efficient production and dual lanes are realized in a compact size, providing the best functionality for your production configuration.

AV132

High speed Axial Lead Component Insertion Machine AV132 for high productivity with High speed insertion of 0.12 s / component , sequential component supply system and vertical automated feederThis is a high speed axial lead component insertion machine that inserts axial components and jumper wires at high speed (0.12 s/component).A sequential system has been adopted in the component supply unit to improve the operation rate.

NPM-VF

Innovating PCB assembly process via automation of odd-form components insertion This is a odd-form component insertion machine that realizes high productivity by automating manual insertion of odd-form components.It supports various types of odd-form components with various head and feeder configurations. The cameras scan PCB holes and component orientation to achieve high insertion reliability. The clinch function (optional) prevents protrusion of components and improves solder strength after flow to achieve high-quality insertion of odd-form components.