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AW-UE40
Remote cameras enhance visual communication in a variety of applications ranging from online classes to online seminars. The AW-UE50/UE40 supports a compact design to blend in with the surroundings and operates very quietly to permit flexible use in any video shooting locations or conditions. The AW-UE50/UE40 offers high security and it is easy to install and operate for capturing stable images, so even people unfamiliar with video shooting or camera operation can utilize it. The excellent flexibility of the product simplifies wiring and operation. Linkage with online conference software or online application is possible, so online video streaming is easy to initiate. The AW-UE50/UE40 is a standard model perfect for people who want to utilize online video streaming more frequently or enhance the quality of online video streaming.
MD-P200 Die Bonder
Unit Level Manufacturing by the Synchro-motion of Dispensing and Bonding
MD-P200's die bonding is carried out immediately after Epoxy dispensing , thereby making it possible to finish the bonding operation before the Epoxy is deteriorated over time.This realizes stable and high quality bonding
at all bond positions on a substrate.Also, the Bonding Stage Camera enables pre-bonding inspection right after Epoxy dispensing and post-bonding inspection right after the bonding of a die ( Option ).
This system allows you to realize manufacturing with real-time quality-inspection. The large-sized touch panel and the interactive software realize an easy and reliable operating environment for all users
from beginners to experts.
MD-P300 Flip-chip Bonder
The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.
PSX307 Plasma Cleaner
PSX307 is a parallel plate plasma cleaner for PCBs with automatic transfer. Loader/unloader and in-line specifications can be selected. One of the following 2 models can be selected depending on the PCB dimensions.
S type PCB dimensions: L 50 mm × W 20 mm to L 250 mm × W 75 mm
M type PCB dimensions: L 50 mm × W 20 mm to L 330 mm × W 120 mm
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