Die Bonder

MD-P200

A device bonder for high-speed, high-quality bonding of bare ICs for cutting-edge devices

Features and benefits of Panasonic's MD-P200 Die Bonder

The MD-P200 Die Bonder offers the capability of multiple small die stacking which contributes to the downsizing of valuable devices. A variety of epoxy-supplying methods contributes to flexible production. Flip-chip and thermosonic bonding capabilities contribute to higher density and performance for valuable devices.

Unit Level Manufacturing by the synchro-motion of dispensing and bonding

The MD-P200's die bonding is carried out immediately after epoxy dispensing, thereby making it possible to finish the bonding operation before the epoxy has deteriorated. This realizes stable and high quality bonding at all bond positions on a substrate. In addition, the bonding stage camera enables pre-bonding inspection immediately after epoxy dispensing and post-bonding control immediately after the bonding of a die. This process enables manufacturing with real-time quality inspection.

User-friendly operation

A large touch panel and interactive software realize an easy and reliable operating environment for all users from beginners to experts.

Key features of MD-P200 Die Bonder

Hauptmerkmale

The basic structure comprises fixed-point pickup and mounting that supports supply of wafers up to ⌀200 mm

In response to innovations in manufacturing, such as multi-functionality, miniaturization and reduced thickness, and multi-layering, various functions such as flip-chip bonding, thermosonic bonding, DAF bonding, and stacked bonding, can also be selected

Specifications of MD-P200 Die Bonder

Tabelle der Spezifikationen

Model Number	NM-EFD1B
Placement Accuracy	XY ( 3σ at Panasonic conditions ) : ±7 μm ( Flip bonding ) , ±15 μm ( With pre-centering ) , ±25 μm（Direct bonding )^*1
Substrate dimensions	L 50 mm × W 30 mm to L 280 mm × W 140 mm ( For thermosonic : L 200 mm × W 150 mm )
Die dimensions (mm)	L 0.25 mm × W 0.25 mm to L 6 mm × W 6 mm

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Full specifications

Technische Daten herunterladen

Model Number	NM-EFD1B
Placement Accuracy	XY ( 3σ at Panasonic conditions ) : ±7 μm ( Flip bonding ) , ±15 μm ( With pre-centering ) , ±25 μm（Direct bonding )^*1
Substrate dimensions	L 50 mm × W 30 mm to L 280 mm × W 140 mm ( For thermosonic : L 200 mm × W 150 mm )
Die dimensions (mm)	L 0.25 mm × W 0.25 mm to L 6 mm × W 6 mm
Bonding Load	Pneumatic head : 0.5 N to 10 N ( Option : 1 N to 50 N ) VCM head for thermosonic process : 1 N to 50 N ( Option : 2 N to 100 N )
Head Heating	Constant heating , Up to 250 ℃ for the pneumatic head , Up to 300 ℃ for the VCM head
Substrate Heating	Constant heating , Up to 300 ℃
Power Source	3-phase AC 200 V ±10V , 50 / 60 Hz , Up to 4 kVA（Up to 7 kVA for heating specification )^*2
Pneumatic Source	0.5 MPa , 30 L / min ( A.N.R. ) ( Up to 150 L / min for full-featured machine including cooling air )
Dimensions (mm)	Standard specification ( Up to 200 mm substrate length. Including loader / unloader ) W 1 950 mm × D 1 190 mm × H 1 720 mm ( Machine body : W 1 190 mm × D 1 190 mm × H 1 720 mm )
Die Supply	Wafer frame , Pre-expanded ring , Tray
Fußnote	Please refer to the specifications on details. The described productivity and placement accuracy may dier depending on the conditions of use. Three phase 208 / 220 / 380 / 400 / 415 / 480