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Optimum welding processes are achieved by utilising an integrated inverter power source within the robot controller, ensuring complete synergy within the common control system. This ensures that the established benefits and advantages of the existing TAWERS Fusion Technology are also now available for use for the range of MIG, MAG and DC TIG welding process.

The RG 131 is the successor of the RHSG. By supporting 3/4 pitches, expanding the range of board sizes and increasing component insertion rate, this high-density radial component insertion machine increases productivity. High speed insertion at a rate of between 0.25s and 0.6s per component can be achieved, even for large-size components with 3-pitch (2.5mm/5.0mm/7.5mm) or 4-pitch (2.5mm/5.0mm/7.5mm/10.0mm) configurations. A comprehensive self-correction function ensures high reliability. With large numbers of component supply and dual-partitioned component supply units, long-term operation can be obtained. A total of up to 80 types of components can be mounted. With large numbers of component supply and dual-partitioned component supply units, long-term operation can be achieved easily with the RG131. A total of up to 80 types of components can be mounted, with up to 32 (16 + 16) types of large components. The two separate component supply units enable components to be exchanged and replenished during operation. Panasonic offers also the RG131-S platform version with smaller footprint. Higher productivity expanding board size range and increasing component input.

The PSX307 Plasma Cleaner provides 1.5 times the productivity of conventional plasma cleaners. Panasonic's parallel plate plasma chamber technology delivers superior etch uniformity compared to conventional batch-type plasma cleaner systems.By using an argon plasma treatment, ultra-thin gold-plated electrodes can be wire-bonded reliably without the formation of nickel compounds. The savings achieved in cheaper gold plating can provide the ROI justification alone. The PSX307 Plasma Cleaner's other capabilities include surface modification by oxygen plasma, improving mold resin adhesion and under-fill wettability, and reducing the incidence of peel-off, voids, and cracks.Panasonic's Plasma Monitoring System suppresses abnormal discharges for a secure and efficient production process. The option to include traceability functionality ensures high level process quality as well.

The APX300 (option S) Dry Etcher is the perfect dry etching equipment for silicon and compound semiconductors. It incorporates a multi-wafer direct cooling system for optimal control of wafer temperature, as well as MSC-ICP (Multi-Spiral Coil type ICP) and BM-ICP (Beamed-type ICP) plasma sources to generate high density plasma. In this way, it achieves a uniform etching profile in a very short timeframe. Building upon the single wafer process chamber of the previous model (Panasonic E620), combined with enhanced process options and two different handling systems, the APX300 (option S) is extremely fast and covers a wide range of process demands.

Features and benefits of Panasonic's APX300 (option S) Dry Etcher  The Panasonic APX300 (option S) Dry Etcher can process wafers such as power devices, SAW filters, communication devices, MEMS sensors and many more. The APX300 (option S) is the successor to the previous best-selling Panasonic E620 and utilizes the same single wafer process chamber.  Two plasma sources are available: MSC-ICP (Multi-Spiral Coil type ICP) and BM-ICP (Beamed-type ICP). MSC-ICP is Panasonic's latest technology, developed to realize highly accurate processing. BM-ICP offers higher electron density and achieves faster processing, covering a wide range of process demands.  In addition, two types of handling systems are available: Atmospheric Loading Supply and Vacuum Load Lock Supply.  The Panasonic APX300 (option S) Dry Etcher is CE certified.

Panasonic’s manufacturing operations optimizer automatically draws up production plans to reduce man-hours and enhancing production efficiency.

Supplied with a 40 or 80 component feeder with optional jumper wire, the compact supply unit configuration of the AV132 can fit both ammo pack and reel. The dual partition configuration enables a fast changeover. The next job can be set up while the current one is being processed.Capable of inserting components in four directions: 0°, 90°, 180°, and 270°, the AV132 optimizes productivity by simultaneously handling 26 and 52mm taped components and providing fast, full auto-recovery. The AV132 can reduce loading times by running two PCBs simultaneously, enabling efficient production due to a speed of 0.12s/component and a transfer speed of 2s/PCB.The fixed feeder unit and the out-of-component detection feature allow to replenish components while maintaining long-term non-stop runs.Preparation in advance or equipment operation during component change-over is possible.

Building upon the PSX307 Plasma Cleaner, the PSX307A Plasma Cleaner features an enlarged plasma chamber capacity that improves productivity. In addition, the PSX307A system is able to handle full wafers (both bare and on dicing frames).  Besides the increased capacity, Panasonic's original Plasma Monitoring System suppresses abnormal discharges resulting in a secure and efficient production process.  Additionally, the option to include a traceability functionality  ensures high level process Quality.

Optimum welding processes are achieved by utilising an integrated inverter power source within the robot controller, ensuring complete synergy within the common control system.This ensures that the established benefits and advantages of the existing TAWERS Fusion Technology are also now available for use with WGH3.

The Stencil Printer SPV-DC enables high efficiency dual lane production in a compact design. The printer is designed for high speed production without changeovers. To reduce running costs the SPV-DC is equipped with the award-winning paperless cleaning function. Solder paste can refill automatically. Solder mask and the final printing result can be verified with an internal inspection. With the machine-to-machine-communication option the SPV-DC is using correction data to correct positional printing errors. The high-speed printer SPV-DC can print on board sizes from 50 x 50mm to 350 x 300mm. With the dual lanes the printer provides a cycle time of 13s, including transfer, positioning, recognition, high-precision printing and respective cleaning. Due to the non-stop changeover, the SPV-DC allows you to prepare the next production while running the printing process.

THE DESKTOP PORT REPLICATOR - WITH KENSINGTON LOCK SLOT (CF-VEB331U) IS A DESKTOP PORT REPLICATOR DESIGNED FOR COMPATIBILITY FOR TOUGHBOOK 33

THE LI-ION EXTENDED BATTERY PACK (FZ-VZSU88U) IS DESIGNED FOR COMPATIBILITY WITH THE TOUGHBOOK G1

THE ROTATING HAND STRAP (FZ-VSTL11U) IS DESIGNED FOR TOUGHBOOK S1