Products

Panasonic Robot & Welding System Solutions presents the Virtual Robot Programming System (VPRS). This solution enables even unskilled robot operators to execute welding robot programming efficiently. The VRPS uses a digital twin of the welding robot that follows the movements of the manually guided torch model. Movements and welding tasks are defined on the real workpiece with the torch model, the virtual sequence is then transferred to the robot controller to be repeated by the robot. Two key benefits render the VPRS a great tool to improve your production:

• robot operators do not require years of experience, knowledge, or skill to program the robot

• the robot programming time is reduced drastically by simply using virtual reality on the actual workpiece.

Optimum welding processes are achieved by utilising an integrated inverter power source within the robot controller, ensuring complete synergy within the common control system. This ensures that the established benefits and advantages of the existing TAWERS Fusion Technology are also now available for use for the range of MIG, MAG and DC TIG welding process.

The new developed TL Robot series by Panasonic has the opportunity to work in a 2 meter working area for wide and maximum reachable welding procedures. With the efficient and rapid mechanical system this robot is the fastest robot on the market. Compared to former products the speed of the major axis is adjusted to its maximum. An integrated wire feeder and an optional usable wire guiding are only two outstanding advantages of the new Panasonic robot model. The new torch design allows an optimal adjustment of the welding torch according to the installed TCP-properties. Through this an improved path accuracy and therefore an optimal welding result can be achieved.

Unit Level Manufacturing by the synchro-motion of dispensing and bondingThe MD-P200's die bonding is carried out immediately after epoxy dispensing, thereby making it possible to finish the bonding operation before the epoxy has deteriorated. This realizes stable and high quality bonding at all bond positions on a substrate. In addition, the bonding stage camera enables pre-bonding inspection immediately after epoxy dispensing and post-bonding control immediately after the bonding of a die. This process enables manufacturing with real-time quality inspection.User-friendly operationA large touch panel and interactive software realize an easy and reliable operating environment for all users from beginners to experts.

The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.

Welding torches

THE BLU RAY DRIVE (FZ-VBD401U) IS DESIGN FOR COMPATIBILITY WITH TOUGHBOOK 40

THE USER CONFIGURABLE I/O (FZ-VCN403U) IS DESIGNED TO BE COMPATIBLE WITH TOUGHBOOK 40

THE 32GB RAM MODULE (FZ-BAZ2132) IS DESIGNED FOR COMPATIBLE WITH TOUGHBOOK 40

The Capacitive Stylus Pen (FZ-VNP401U) is compatible for the TOUGHBOOK 40 model.

THE USER CONFIGURABLE I/O (FZ-VCN402U) IS DESIGNED TO BE COMPATIBLE WITH TOUGHBOOK 40

THE 16GB RAM MODULE (FZ-BAZ2116) IS DESIGNED FOR COMPATIBLE WITH TOUGHBOOK 40