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FeaturesThe revolutionary integrated  line  management  system  is  the basis for  controlling the  entire  production line. It  is  not limited  to  Panasonic machines but  also  integrates  third-party  equipment such as PCB transfer systems, laser markers, AOI, SPI and ovens. Conventional systems require a number of PCs to control different machine types from different suppliers. The iLNB controls the entire line with only one PC.  iLNB  significantly improves overall  productivity.  Production  data  and  production  changeover  of  all equipment, such as Panasonic’s placement machines as well as non-Panasonic machines including AOI, SPI, reflow  ovens  and  others,  can  be  controlled.  All  collected  data  are  transferred  to  a remote central computer. Small  errors such  as pick-up  errors  can  be recovered from  that  central  point.  Automatic production changeover is also possible. With the iLNB, users can manage automatic product changeovers and have an E-Link which provides an interface for information input and output, for machine control, management of components per feeder, and communication with a GEM/PLC. iLNB provides total control of the production line by interfacing between Panasonic and non-Panasonic machines, acting as one-stop channel. With the iLNB Users can manage automatic product changeovers and have an E-Link which provides an interface for information in- and output, for machine control, management of component per feeder and a communication to GEM/PLC. Automatic changeover Registration of automatic changeover recipeLine automatic changeoverAutomatic changeover monitoringLine operation monitoringE-Link interface for Information inputDownload / edit of scheduleE-Link interface for Information outputOperational information outputTrace information outputMachine status outputE-Link interface for machine controlMachine interlock; production start controlE-Link interface for feeder writeWriting of component data by an external systemCommunications to GEM/PLCSECS2/GEM communicationOPC communicationIO/RS-232C communication

FeaturesThe Manufacturing Operations Optimiser (MFO) is a newly developed product for drawing up production plans required  for on-site  operations  to  reduce the man-hours needed for the production  plan  and,  at  the same time, to enhance production efficiency. MFO creates detailed schedules for productions and pre-set-up operations and calculates the required resources for production by simulating the manufacturing process  of  the  entire  SMT production floor.  By simulating the planned  production, the  MFO  answers questions about estimated  production  completion, indicates which  production  sequence is to  be  used for higher efficiency, proposes optimal machine set-up for higher efficiency, and indicates the number of staff needed to  achieve  the  plan.  MFO  models  the  required  production  line, taking  into  account errors that can occur at the production machines, such as parts exchange. It optimises production taking into  account multiple  production  lines.  The  off-line  set-up  sequence  can  be  optimised  to  adjust  the requirement  of  staff  and  material. MFO  support  is  not  limited  to  machines  of the NPM-series  but also  supports  CMand  DT-series  machines  and  screen  printers. It also supports non-Panasonic equipment such as SPI, AOI, reflow ovens, screen printers and others.

Panasonic manufacturing operations optimizer (MFO) is the line management system to create detailed production schedules including pre-set-up operations. Those production plans are mandatory to optimize manufacturing processes and thus improves cycle times and production efficiency. It also calculates the number of operators required by simulating the entire SMT manufacturing operation.  Image of the systemMFO provides clear and easy to understand plans for production, process set-up and operator management plus simulation reports.

Beside this, it provides various optimization function, like mounting process, production plan, production-set-up plan and operator count, including a table of function list and machines.  

The fully automated printing solution is part of the "Autonomous Factory" Concept - a factory that immediately responds to every situation and continues to evolve autonomously. Ensuring the production of non-defective items through the integrated control of autonomous uninterrupted mounting lines and floors independent of any human intervention and judgment.

Features:Increased Production Time:  (1) Reduces machine availability losses through automation of operations required for model changeover.(2) Reduces machine performance losses through automation of operations involved in production.(3) Increases production time by monitoring machine conditions and thereby performing maintenanceat right times.

Maintenance of printing quality at a consistently high level: Reduces losses due to defective items through various functions that actualizes consistently high-qualityprinting capable of responding to any changes in 5M.

Support for line solution: Realizes high-quality line production through M2M

Automation / Labor-saving Solution + Intelligent system solution to achieve manufacturing that is further in line with production plan

Plasma dicing is becoming increasingly attractive in the semiconductor market. Dies are becoming smaller and thinner and manufacturers are facing difficulties such as increasing material loss due to the width of the dicing line, mechanical damage to the dies from chipping and increasingly longer processing times due to line-by-line mechanical dicing. Panasonic’s APX300 Plasma Dicer solves these challenges and simultaneously provides a higher quality product with a lower cost of production. Features and benefits of Panasonic's APX300 Plasma DicerPlasma dicing requires a dicing street mask. After the mask is applied to the surface of the wafer and the dicing streets are exposed, the plasma process etches the exposed streets by a chemical reaction. By using a chemical etching process, a chipping-free and particle-free process is achieved. Thanks to the use of mask patterning, narrower street widths are possible – allowing more chips to be designed onto the wafer. Furthermore, the mask patterning allows complete flexibility in chip size, shape and position. The benefits of the Panasonic APX300 Plasma Dicer are: Particle-free and damage-free processHigher chip strengthYield improvementsThe Panasonic APX300 is available in a stand-alone single chamber (1 chamber) or a multi chamber (1, 2, or 3 chambers) configuration.  Panasonic can provide a plasma dicing total solution to achieve a damage-free, particle-free, higher throughput and lower overall cost of production. The Panasonic APX300 is CE certified. 

FeaturesThe line management system NPM-DGS provides various features, like the Multi-CAD import, tact simulations, a component library of all pick and place machines, displaying of placement and inspection head data on the display during operation, production data optimization and an optional off-line component data creation to make the work preparation as easy as possible, by guaranteeing an improved and more efficient placement process. NPM-DGS offers to create off-line component data and improves productivity and the data generation workflow. A parts library for the entire shop floor can be centrally managed. With simulations the total operating rate of the production line can be checked. With the MJS-function the feeder replacement can be reduced. The PPD/LWS Editor helps to quickly and easily edit the production data. Multi-CAD importMost CAD data formats can be imported through macro definitions. A polarity check in performed in advance. Optional off-line component data creationDGS works with any flatbed scannerand offers the ability  to create off-line component data or with the NPM off-line camera unit to improve productivity and  quality of the data generation workflow Component library A parts library for all placement equipment in the entire shop floor can be centrally managed, even including data from the CM series. SimulationCheck the tact simulation in advance on the screen and improve the total operating rate of the line. Mix Job Setter (MJS)A common feeder arrangement is advantageous when manufacturing multiple different products, since the reduction in feeder replacement time increases productivity. PPD/LWS EditorReduce loss times by quickly and easily editing the production data of the placement and inspection heads on the PC screen during production.

Building upon the PSX307 Plasma Cleaner, the PSX307A Plasma Cleaner features an enlarged plasma chamber capacity that improves productivity. In addition, the PSX307A system is able to handle full wafers (both bare and on dicing frames).  Besides the increased capacity, Panasonic's original Plasma Monitoring System suppresses abnormal discharges resulting in a secure and efficient production process.  Additionally, the option to include a traceability functionality  ensures high level process Quality.

The SPV Stencil Printer offers a variety of options to suit different PCBs and production processes for consistent high quality. With its high 10s/PCB cycle time, the SPV eliminates bottlenecks and ensures quality by self-cleaning after every PCB. Three conveyors and the PCB identification function provide different automatic printing set ups for a high throughput. With the machine-to-machine-communication option the SPV Screen Printer is using APC correction data to correct positional printing errors. The SPV Stencil Printer can print multiple 350x300mm (M-size) boards simultaneously. This lowers WIP inventory and reduces changeover times by processing up to 4 unique products at once. The configuration minimizes capital expenditure by reducing printer investment by 50% and maximize the floor space utilization with new hybrid board handling concept and the multi-stage board handling conveyors.

The AM100 meets the high standards of reliability, capacity and flexibility that customers look forward to in a cost-efficient, gradationally scalable, high-mix SMT solution. It only takes one machine to start off production and extra units and/or technologies can be easily integrated according to requirements. The single-head (single beam) of Panasonic's AM100 modular placement machine is able to place an impressive component array including: 0402 mm to 120 x 90 x 2 8mm, odd-shaped components, large connectors, as well as advanced packaging types e.g.Features The single solution AM100 provides high net productivity and versatility. Equipped with a 14-nozzle head and 160 feeders the AM100 can place an impressive component range. On top the non-stop changeover allows you to prepare the next product process during running production. An off-line setup support station and a feeder set-up navigator option improves operating time and minimizes the downtime.

The NPM-VF is equipped with a double portal. The SMD and THT components are placed by one placement head per portal. A wide variety of vacuum pipettes and grippers are available. The pick and place machine can be used in single or dual lane mode. The NPM-VF reaches a speed of up to 4,500cph and can process component sizes from 5x5mm up to 130x35mm and 60mm height. Active cutting and clinching tools are integrated which detach THT components from the radial and axial feeders. Clinching directions as well as pin lengths per THT component can be defined via the assembly program. Beside the radial and axial feeders, the NPM-VF can be equipped with all common standard feeder systems for SMD components. The flexible NPM-VF is an ideal machine for cycle-optimized production, especially for companies that must process both types of components due to the increased demand from power electronics for THT assemblies. This efficient pick and place machine contributes to reduce manpower requirements and to consistent production with high productivity, flexibility and high-quality pick and place results.

The NPM-WX  represents the  next  generation  of  Panasonic’s  mounting  production  concept “Smart manufacturing”. The platform represents higher  line  throughput  and  improved  quality  at  lower cost  thanks  to  integrated  automated  systems.  APC  system  and  automatic  recovery  are  integrated  to provide autonomous line control.  The  incorporated  floor-management system and  remote-operation option  improve  utilisation  combined  with  lower  labour  costs.  Feeder  set-up  and  component supply  navigation  systems  are available, helping  to  reduce  the  work  variations.The  NPM-WX  can  handle  a  wide variety  of  components, from  0402  chip  components  up  to  large  components with  a max. size  of 150x25x40 mm.  Parts can be supplied from  tape,  stick or tray-feeder . Feeder-cart  flexibility can be provided by selecting the existing 30-input feeder cart or inserting two 17-inpu

The APX300 (option S) Dry Etcher is the perfect dry etching equipment for silicon and compound semiconductors. It incorporates a multi-wafer direct cooling system for optimal control of wafer temperature, as well as MSC-ICP (Multi-Spiral Coil type ICP) and BM-ICP (Beamed-type ICP) plasma sources to generate high density plasma. In this way, it achieves a uniform etching profile in a very short timeframe. Building upon the single wafer process chamber of the previous model (Panasonic E620), combined with enhanced process options and two different handling systems, the APX300 (option S) is extremely fast and covers a wide range of process demands.

Features and benefits of Panasonic's APX300 (option S) Dry Etcher  The Panasonic APX300 (option S) Dry Etcher can process wafers such as power devices, SAW filters, communication devices, MEMS sensors and many more. The APX300 (option S) is the successor to the previous best-selling Panasonic E620 and utilizes the same single wafer process chamber.  Two plasma sources are available: MSC-ICP (Multi-Spiral Coil type ICP) and BM-ICP (Beamed-type ICP). MSC-ICP is Panasonic's latest technology, developed to realize highly accurate processing. BM-ICP offers higher electron density and achieves faster processing, covering a wide range of process demands.  In addition, two types of handling systems are available: Atmospheric Loading Supply and Vacuum Load Lock Supply.  The Panasonic APX300 (option S) Dry Etcher is CE certified.