Products

The 512GB OPAL SSD Universal Bay (FZ-VSD55152U) is designed for compatibility with TOUGHBOOK 55.

The AW-RP150 will be the newest remote camera controller to compliment Panasonic's comprehensive professional PTZ camera lineup. It has the same great functionality of the AW-RP120 and AW-RP50, and joins the lineup with significant improvements over those models, including a new one-hand operation joystick (controlling PTZ or Focus) and a large touch-panel LCD screen for monitoring and menu setting.

Equipped with a GUI menu screen for clear visibility and a joystick for intuitive control.Compact Remote Camera Controller with PoE* support for single cable connection.

The HD integrated camera AW-HE145 realizes high sensitivity of F9/2000lx with the mounted 1.0-type MOS sensor, and can shoot beautifully at stage events or church services with low light. The operation mechanism is the same design as the high-end model, so the operating performance of the pan/tilt and zoom is smooth and accurate, allowing you to shoot without stress. Furthermore, it is equipped with an optical 20x zoom and horizontal 75.1° wide-angle lens to realize flexible video production.

Panasonic's Visual Preset Software adds intuitive GUI-based operation to the free to download PTZ Control Centre software. This enables the management and control of PTZ camera presets whilst incorporating photos and layout diagrams assigned by the user.

The Slimline External CD/DVD Writer (PCPE-FCDVR05) is compatible for TOUGHBOOK products.

Compact operation panel with IP control and PoE support. By combining them AK-HCU250 Camera Control Units (CCU) and the AK-HRP250GJ Remote Operation Panel (ROP), it is possible to construct a long-distance optical fiber transmission studio camera system at a low cost.

Low-cost camera control unit of high video quality, long-distance optical fiber transmission camera systems.

The RL132 combines functionality and speed with an insertion rate up to 25,700cph (.14s/component), a board processing sizes up to 650 x 381mm, a 33% reduction in PCB transfer time, up to 18% reduction in electrical and air consumption per insertion and an improved parts lifespan for a very low cost of ownership. This through-hole machine features a 4-pitch span and is configurable with 40 or 80 components inputs. Meanwhile, its dual split carriage enables machine function at exchange mode and parts replenishment during production. The RL132 was designed for a non-stop productivity. The Lead V cut method enables the RL132 to insert radial lead components at a speed of 0.14s/component. Either a 2-pitch (2.5mm/5.0mm), 3-pitch (2.5mm/5.0mm/7.5mm) or 4-pitch (2.5mm/5.0mm/7.5mm/10.0mm) option can be selected. The fixed feeder unit method and an out-of-component detection function allow ongoing component replenishment and long-term runs. PCB of 650mm x 381mm can be processed.

The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.

Plasma dicing is becoming increasingly attractive in the semiconductor market. Dies are becoming smaller and thinner and manufacturers are facing difficulties such as increasing material loss due to the width of the dicing line, mechanical damage to the dies from chipping and increasingly longer processing times due to line-by-line mechanical dicing. Panasonic’s APX300 Plasma Dicer solves these challenges and simultaneously provides a higher quality product with a lower cost of production. Features and benefits of Panasonic's APX300 Plasma DicerPlasma dicing requires a dicing street mask. After the mask is applied to the surface of the wafer and the dicing streets are exposed, the plasma process etches the exposed streets by a chemical reaction. By using a chemical etching process, a chipping-free and particle-free process is achieved. Thanks to the use of mask patterning, narrower street widths are possible – allowing more chips to be designed onto the wafer. Furthermore, the mask patterning allows complete flexibility in chip size, shape and position. The benefits of the Panasonic APX300 Plasma Dicer are: Particle-free and damage-free processHigher chip strengthYield improvementsThe Panasonic APX300 is available in a stand-alone single chamber (1 chamber) or a multi chamber (1, 2, or 3 chambers) configuration.  Panasonic can provide a plasma dicing total solution to achieve a damage-free, particle-free, higher throughput and lower overall cost of production. The Panasonic APX300 is CE certified. 

Building upon the PSX307 Plasma Cleaner, the PSX307A Plasma Cleaner features an enlarged plasma chamber capacity that improves productivity. In addition, the PSX307A system is able to handle full wafers (both bare and on dicing frames).  Besides the increased capacity, Panasonic's original Plasma Monitoring System suppresses abnormal discharges resulting in a secure and efficient production process.  Additionally, the option to include a traceability functionality  ensures high level process Quality.