Mikroelektronik
Die neuesten Systeme für: Plasma Dicing und Trockenätzen von Wafern; Plasmareinigung von Wafern und Substraten; und hochwertiges Ultraschall-Flip-Chip-Bonding von blanken ICs.
Mit jahrzehntelanger Erfahrung – auch als Hersteller – verbessern wir kontinuierlich unsere Technologien und entwickeln neue Lösungen. Wir bieten eine Reihe modernster Mikroelektronikgeräte, um unseren Kunden zu helfen, Produktionskosten zu senken und die Qualität zu steigern.
Über Mikroelektronik
Panasonic ist eines der weltweit führenden Unternehmen im Bereich der Smart Factory. Unsere Position, sowohl Hersteller als auch Ausrüstungslieferant zu sein, ist einzigartig und hat es uns ermöglicht, bewährte Technologie zu liefern. Im Bereich Mikroelektronik bieten wir erstklassige Geräte, Prozesslösungen, Materialien und Software für hochpräzise Waferbearbeitung, Ultrahochpräzisions-Device-Bonding und hochwertiges Flüssigkristall-Panel-Bonding. Zusätzlich bieten wir Plasma Dicing als Dienstleistung an.
Mikroelektronik in Aktion
Unser Produktportfolio
Product
APX300 Plasma Dicer
Plasma dicing is becoming increasingly attractive in the semiconductor market. Dies are becoming smaller and thinner and manufacturers are facing difficulties such as increasing material loss due to the width of the dicing line, mechanical damage to the dies from chipping and increasingly longer processing times due to line-by-line mechanical dicing. Panasonic’s APX300 Plasma Dicer solves these challenges and simultaneously provides a higher quality product with a lower cost of production. Features and benefits of Panasonic's APX300 Plasma DicerPlasma dicing requires a dicing street mask. After the mask is applied to the surface of the wafer and the dicing streets are exposed, the plasma process etches the exposed streets by a chemical reaction. By using a chemical etching process, a chipping-free and particle-free process is achieved. Thanks to the use of mask patterning, narrower street widths are possible – allowing more chips to be designed onto the wafer. Furthermore, the mask patterning allows complete flexibility in chip size, shape and position. The benefits of the Panasonic APX300 Plasma Dicer are: Particle-free and damage-free processHigher chip strengthYield improvementsThe Panasonic APX300 is available in a stand-alone single chamber (1 chamber) or a multi chamber (1, 2, or 3 chambers) configuration. Panasonic can provide a plasma dicing total solution to achieve a damage-free, particle-free, higher throughput and lower overall cost of production. The Panasonic APX300 is CE certified.
Product
APX300 Dry Etcher
The APX300 (option S) Dry Etcher is the perfect dry etching equipment for silicon and compound semiconductors. It incorporates a multi-wafer direct cooling system for optimal control of wafer temperature, as well as MSC-ICP (Multi-Spiral Coil type ICP) and BM-ICP (Beamed-type ICP) plasma sources to generate high density plasma. In this way, it achieves a uniform etching profile in a very short timeframe. Building upon the single wafer process chamber of the previous model (Panasonic E620), combined with enhanced process options and two different handling systems, the APX300 (option S) is extremely fast and covers a wide range of process demands. Features and benefits of Panasonic's APX300 (option S) Dry Etcher The Panasonic APX300 (option S) Dry Etcher can process wafers such as power devices, SAW filters, communication devices, MEMS sensors and many more. The APX300 (option S) is the successor to the previous best-selling Panasonic E620 and utilizes the same single wafer process chamber. Two plasma sources are available: MSC-ICP (Multi-Spiral Coil type ICP) and BM-ICP (Beamed-type ICP). MSC-ICP is Panasonic's latest technology, developed to realize highly accurate processing. BM-ICP offers higher electron density and achieves faster processing, covering a wide range of process demands. In addition, two types of handling systems are available: Atmospheric Loading Supply and Vacuum Load Lock Supply. The Panasonic APX300 (option S) Dry Etcher is CE certified.
Product
PSX307 Plasma Cleaner
The PSX307 Plasma Cleaner provides 1.5 times the productivity of conventional plasma cleaners. Panasonic's parallel plate plasma chamber technology delivers superior etch uniformity compared to conventional batch-type plasma cleaner systems.By using an argon plasma treatment, ultra-thin gold-plated electrodes can be wire-bonded reliably without the formation of nickel compounds. The savings achieved in cheaper gold plating can provide the ROI justification alone. The PSX307 Plasma Cleaner's other capabilities include surface modification by oxygen plasma, improving mold resin adhesion and under-fill wettability, and reducing the incidence of peel-off, voids, and cracks.Panasonic's Plasma Monitoring System suppresses abnormal discharges for a secure and efficient production process. The option to include traceability functionality ensures high level process quality as well.
Product
PSX307A Plasma Cleaner
Building upon the PSX307 Plasma Cleaner, the PSX307A Plasma Cleaner features an enlarged plasma chamber capacity that improves productivity. In addition, the PSX307A system is able to handle full wafers (both bare and on dicing frames). Besides the increased capacity, Panasonic's original Plasma Monitoring System suppresses abnormal discharges resulting in a secure and efficient production process. Additionally, the option to include a traceability functionality ensures high level process Quality.
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Panasonic Connect Europe GmbH
Factory Solutions Europe
Microelectronics
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85521 Ottobrunn
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+ 49 89 45354-1000
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