Products

High yield, high throughput ultrasonic flip-chip bonding.

Panasonic's Adaptive Process Control (APC) system realizes high-quality placement through excellent feed-forward and feed-back communication technology.

Designed to measure aspherical lenses & molds, freeform optics, mirrors and any other precision component requiring nanometer level accuracy

Panasonic’s manufacturing operations optimizer automatically draws up production plans to reduce man-hours and enhancing production efficiency.

Wafer level parallel plate plasma cleaning technology.

The perfect dry etching equipment for silicon and compound semiconductors.  

iLNB, for line management, provides complete control over the entire production line, including non-Panasonic equipment, for higher productivity.

Plasma cleaning utilizing parallel plate plasma cleaning technology.

All component data for each machine can be created offline.

Media Production Suite : Software platform to manage media smartly and expand your creativity