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PT-MZ882 Series

Głośnik PT-MZ682

The Series features PT-MZ882 (8,200 lm11), PT-MZ782 (7,500 lm11), and PT-MZ682 (6,500 lm) WUXGA models with a refined Multi-Laser Drive Engine for the optimal balance of high brightness, vivid colour, and low-maintenance operation. *1 Measurement, measuring conditions, and method of notation are all compliant with ISO/IEC 21118: 2020 international standards. Value is average of all products when shipped.

PT-MZ882 Series

PT-MZ882

The Series features PT-MZ882 (8,200 lm11), PT-MZ782 (7,500 lm11), and PT-MZ682 (6,500 lm) WUXGA models with a refined Multi-Laser Drive Engine for the optimal balance of high brightness, vivid colour, and low-maintenance operation. *1 Measurement, measuring conditions, and method of notation are all compliant with ISO/IEC 21118: 2020 international standards. Value is average of all products when shipped.

PT-MZ882 Series

PT-MZ782

The Series features PT-MZ882 (8,200 lm11), PT-MZ782 (7,500 lm11), and PT-MZ682 (6,500 lm) WUXGA models with a refined Multi-Laser Drive Engine for the optimal balance of high brightness, vivid colour, and low-maintenance operation. *1 Measurement, measuring conditions, and method of notation are all compliant with ISO/IEC 21118: 2020 international standards. Value is average of all products when shipped.

Lamps

ET-LAD120PW

1 × lampa UHM o mocy 420 W, Do trybu portretowego

Lamps

ET-LAV300

1 × lampa UHM o mocy 230 W

TOUGHBOOK 55

TOUGHBOOK 55 mk3 HD

TOUGHBOOK 55 z systemem Windows 11 Pro, obudową ze stopu magnezu, elastyczną konfiguracją i uniwersalnym portem  to najbardziej wszechstronny Toughbook klasy Rugged z 14-calowym ekranem, jakiego do tej pory stworzyliśmy — nie znaczy to jednak, że stracił na wytrzymałości: wyjątkowa konstrukcja przypominająca plaster miodu zwiększa jego trwałość i zapewnia odporność na zalanie. TOUGHBOOK 55 jest niezwykły również pod względem ogromnej elastyczności. Dzięki szerokiej gamie opcji konfiguracyjnych klienci mogą wybrać dokładnie takie urządzenie, które spełni wszystkie ich potrzeby.

Brackets

ET-PKD520S

Wspornik do montażu pod niskim sufitem

Brackets

ET-PKD120S

Wspornik do montażu pod niskim sufitem

Brackets

ET-PKD120H

Wspornik do montażu pod wysokim sufitem

Brackets

ET-PKD130H

ET-PKD130H

Microelectronics

APX300 Plasma Dicer

Plasma dicing is becoming increasingly attractive in the semiconductor market. Dies are becoming smaller and thinner and manufacturers are facing difficulties such as increasing material loss due to the width of the dicing line, mechanical damage to the dies from chipping and increasingly longer processing times due to line-by-line mechanical dicing. Panasonic’s APX300 Plasma Dicer solves these challenges and simultaneously provides a higher quality product with a lower cost of production. Features and benefits of Panasonic's APX300 Plasma DicerPlasma dicing requires a dicing street mask. After the mask is applied to the surface of the wafer and the dicing streets are exposed, the plasma process etches the exposed streets by a chemical reaction. By using a chemical etching process, a chipping-free and particle-free process is achieved. Thanks to the use of mask patterning, narrower street widths are possible – allowing more chips to be designed onto the wafer. Furthermore, the mask patterning allows complete flexibility in chip size, shape and position. The benefits of the Panasonic APX300 Plasma Dicer are: Particle-free and damage-free processHigher chip strengthYield improvementsThe Panasonic APX300 is available in a stand-alone single chamber (1 chamber) or a multi chamber (1, 2, or 3 chambers) configuration.  Panasonic can provide a plasma dicing total solution to achieve a damage-free, particle-free, higher throughput and lower overall cost of production. The Panasonic APX300 is CE certified. 

Microelectronics

MD-P200 Die Bonder

Unit Level Manufacturing by the synchro-motion of dispensing and bondingThe MD-P200's die bonding is carried out immediately after epoxy dispensing, thereby making it possible to finish the bonding operation before the epoxy has deteriorated. This realizes stable and high quality bonding at all bond positions on a substrate. In addition, the bonding stage camera enables pre-bonding inspection immediately after epoxy dispensing and post-bonding control immediately after the bonding of a die. This process enables manufacturing with real-time quality inspection.User-friendly operationA large touch panel and interactive software realize an easy and reliable operating environment for all users from beginners to experts.

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