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Panasonic Factory Solutions Europe
Your partner for production equipment and automated manufacturing solutions.
Who we are
Smart Factory Solutions for any mix, any volume
Panasonic belongs to the global leading companies in the sector of the Smart Factory. Our unique DNA being a manufacturer and a total solutions provider enables us to understand the needs of our customers and to provide them with tailormade solutions for today’s challenges to be prepared for the industry of tomorrow.
Our dynamic and powerful software, managing our high-end equipment including 3rd party machines, provides our customers with a connected and responsive production environment. Any mix, any volume any time flexible to your needs with full process optimization.
Based on over 100 years of manufacturing and engineering experience, Panasonic offers trusted technology and innovation as your best partner in a connected future.
Connect to the Factory of Tomorrow
Our Solutions. Your Smart Factory
World-leading Panasonic technology matching your manufacturing needs with over 100 years of engineering experience and a wide range of factory solutions including SMT, THT, Robot & Welding, Microelectronics, UA3P equipment, and more.
Best-in-class Panasonic Software created in-house as a tailor-made dynamic solution to your manufacturing challenges: production line design, resource planning, traceability and continuous process optimization for a fully connected factory.
Trusted Panasonic Service with a strong network and trainings facilities all over the world. Providing support, machine & software trainings.
Our Divisions. For your Manufacturing
Panasonic Factory Solutions Europe, headquartered in Ottobrunn, near Munich, provides industrial products, solutions and services in Europe. The company’s portfolio covers production equipment for the electronic industry, software solutions, welding robots and automated manufacturing solutions across a broad range of industries.
Panasonic Factory Solutions Europe consists of the following business units:
- Electronics Manufacturing Solutions (Pick & Place equipment, printers and laser markers for SMT and THT manufacturing)
- Microelectronics (Plasma cleaning, dry-etching and plasma dicing, flip-chip bonding)
- Robot & Welding Systems (Welding and Handling Robots, turn-key PerformArc Cells, Laser Welding systems)
- Solution Engineering (Software Solutions like PanaCIM and ProcessTracker for smart manufacturing and digitalization for Industry 4.0)

Microelectronics Solutions
With decades of experience we are continually improving our technologies.

Robot & Welding System Solutions
For more than 60 years, Panasonic is developing welding technology products.

Smart Factory
In the SMT area we offer turnkey solutions for your manufacturing challenges from our portfolio of best-in-class hardware and software products for overall optimization.
"Manufacturing is at the heart of what we do. And our collective knowledge and first-hand experience makes us the industry-leading solutions provider our customers know. "
Head of Factory Solutions Europe
Product Line Up SMT, THT, FATP and beyond
Printing (SMT)
SPG2
The printing performance of the SPG2 can be carried out in 14s with a process repeatability of ± 15μm. Larger circuit boards up to 510mm x 510mm can be handled without restrictions. A new programmable squeegee angle increases the filling pressure by up to 10%. The SPG2 can be equipped with the vacuum cleaning function, to enable a printing process without cleaning paper or cleaning agents. Additionally, it can be equipped with the optional automatic solder paste feed. The SPG2 can be linked into the Panasonic software environment, e.g. in the MES solution PanaCIM Gen2, Process Tracker and the MMS maintenance module in connection with the MFO manufacturing optimizer. Together with the integrated connection, the SPG2 is a trendsetting screen printer for Industry 4.0 applications. The SPG2 is Panasonic's latest printer for innovative high-mix manufacturing environments. The printer is equipped with additional functions and automation solutions for an even more cost-efficient SMD printing. Together with Panasonic’s software solutions, the SPG2 is a trendsetting screen printer for Industry 4.0 applications. Various features minimize the line management.
Printing (SMT)
SPV
The SPV Stencil Printer offers a variety of options to suit different PCBs and production processes for consistent high quality. With its high 10s/PCB cycle time, the SPV eliminates bottlenecks and ensures quality by self-cleaning after every PCB. Three conveyors and the PCB identification function provide different automatic printing set ups for a high throughput. With the machine-to-machine-communication option the SPV Screen Printer is using APC correction data to correct positional printing errors. The SPV Stencil Printer can print multiple 350x300mm (M-size) boards simultaneously. This lowers WIP inventory and reduces changeover times by processing up to 4 unique products at once. The configuration minimizes capital expenditure by reducing printer investment by 50% and maximize the floor space utilization with new hybrid board handling concept and the multi-stage board handling conveyors.
Printing (SMT)
SPV-DC
The Stencil Printer SPV-DC enables high efficiency dual lane production in a compact design. The printer is designed for high speed production without changeovers. To reduce running costs the SPV-DC is equipped with the award-winning paperless cleaning function. Solder paste can refill automatically. Solder mask and the final printing result can be verified with an internal inspection. With the machine-to-machine-communication option the SPV-DC is using correction data to correct positional printing errors. The high-speed printer SPV-DC can print on board sizes from 50 x 50mm to 350 x 300mm. With the dual lanes the printer provides a cycle time of 13s, including transfer, positioning, recognition, high-precision printing and respective cleaning. Due to the non-stop changeover, the SPV-DC allows you to prepare the next production while running the printing process.
Printing (SMT)
APC
Mounting feed-forward function Components can be placed correctly based on the solder printing position. Placement skip data feed-forward/Block recognition data feed-forward Placement machine recognition time reduction based on feed-forward discrepancy data. Misplacement of components using a modular placement machine can be prevented based on feed-forward solder/land* printing defect block data.*When inspecting lands on which package components are placed using flux epoxy. Printing position data feedback The solder printing position misalignment is measured by the inspection machine. The positioning correction is transferred by means of feedback to the screen printer. The solder printing area is measured by the inspection equipment. The stencil cleaning direction can be compared with the reference value by means of feedback.
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Product Line Up Robot & Welding
TAWERS Arc welding system solution
TAWERS Software
The TAWERS “Weld Navigation” Software is an unique feature that will make your weld development much easier and faster.
TAWERS Arc welding system solution
TAWERS WG3 Arc welding system
Optimum welding processes are achieved by utilising an integrated inverter power source within the robot controller, ensuring complete synergy within the common control system. This ensures that the established benefits and advantages of the existing TAWERS Fusion Technology are also now available for use for the range of MIG, MAG and DC TIG welding process.
TAWERS Arc welding system solution
TAWERS WGH3 Arc welding system
Optimum welding processes are achieved by utilising an integrated inverter power source within the robot controller, ensuring complete synergy within the common control system.This ensures that the established benefits and advantages of the existing TAWERS Fusion Technology are also now available for use with WGH3.
PERFORMARC welding systems
PA-c-TT
The PA-c-TT Connect cell combines a 6-axis robot with an integrated power source with the versatility of a compact and easy-to-use welding solution for small-and medium-sized production sites.
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Product Line Up Microelectronics
Microelectronics
MD-P200 Die Bonder
Unit Level Manufacturing by the synchro-motion of dispensing and bondingThe MD-P200's die bonding is carried out immediately after epoxy dispensing, thereby making it possible to finish the bonding operation before the epoxy has deteriorated. This realizes stable and high quality bonding at all bond positions on a substrate. In addition, the bonding stage camera enables pre-bonding inspection immediately after epoxy dispensing and post-bonding control immediately after the bonding of a die. This process enables manufacturing with real-time quality inspection.User-friendly operationA large touch panel and interactive software realize an easy and reliable operating environment for all users from beginners to experts.
Microelectronics
MD-P300 Flip-chip Bonder
The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.
Microelectronics
PSX307 Plasma Cleaner
The PSX307 Plasma Cleaner provides 1.5 times the productivity of conventional plasma cleaners. Panasonic's parallel plate plasma chamber technology delivers superior etch uniformity compared to conventional batch-type plasma cleaner systems.By using an argon plasma treatment, ultra-thin gold-plated electrodes can be wire-bonded reliably without the formation of nickel compounds. The savings achieved in cheaper gold plating can provide the ROI justification alone. The PSX307 Plasma Cleaner's other capabilities include surface modification by oxygen plasma, improving mold resin adhesion and under-fill wettability, and reducing the incidence of peel-off, voids, and cracks.Panasonic's Plasma Monitoring System suppresses abnormal discharges for a secure and efficient production process. The option to include traceability functionality ensures high level process quality as well.
Microelectronics
PSX307A Plasma Cleaner
Building upon the PSX307 Plasma Cleaner, the PSX307A Plasma Cleaner features an enlarged plasma chamber capacity that improves productivity. In addition, the PSX307A system is able to handle full wafers (both bare and on dicing frames). Besides the increased capacity, Panasonic's original Plasma Monitoring System suppresses abnormal discharges resulting in a secure and efficient production process. Additionally, the option to include a traceability functionality ensures high level process Quality.
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News & Events
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